Exploring New Scaling Approaches


At the recent SPIE Photomask Technology + Extreme Ultraviolet Lithography 2017 conference, Semiconductor Engineering sat down to discuss semiconductor technology with Tsu-Jae King Liu, the TSMC Distinguished Professor in Microelectronics in the Department of Electrical Engineering and Computer Sciences at the University of California at Berkeley. More specifically, Liu discussed some of the new... » read more

Searching For EUV Mask Defects


Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that is becoming more worrisome is how to find [gettech id="31045" comment="EUV"] mask defects. That isn't the only issue, of course. The industry continues to work on the power source and resists. Bu... » read more

Next-Gen Mask Writer Race Begins


Competition is heating up in the mask writer equipment business as two vendors—Intel/IMS and NuFlare—vie for position in the new and emerging multi-beam tool segment. Last year, Intel surprised the industry by acquiring IMS Nanofabrication, a multi-beam e-beam mask writer equipment vendor. Also last year, IMS, now part of Intel, began shipping the world’s first multi-beam mask writer f... » read more

Looming Issues And Tradeoffs For EUV


Momentum is building for extreme ultraviolet (EUV) lithography, but there are still some major challenges to solve before this long-overdue technology can be used for mass production. [gettech id="31045" comment="EUV"] lithography—a next-generation technology that patterns tiny features on a chip—was supposed to move into production around 2012. But over the years, EUV has encountered se... » read more

Unsolved Litho Issues At 7nm


By Ed Sperling & Mark LaPedus EUV lithography is creating a new set of challenges on the photomask side for which there currently are no simple solutions. While lithography is viewed as a single technology, [gettech id="31045" comment="EUV"] actually is a collection of technologies. Not all of those technologies have advanced equally and simultaneously, however. For example, aberrations... » read more

Challenges Mount For Photomasks


Semiconductor Engineering sat down to discuss photomask technologies with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP); Banqiu Wu, principal member of the technical staff and chief technology officer of the Mask and TSV Etch Division at [getentity id="22817" e_name="Applied Materials"]; Weston Sousa, general manager of the Reticle Products Division at [getentity id="22876" commen... » read more

What’s After 7nm?


The rollout of 10/7nm was a long time coming, and for good reason. It's hard stuff, and chipmakers have to be ready to take a giant step forward with new processes, tools, and to deal with a slew of physical effects that no longer can be handled by just guard-banding a design. The big question is what's next, when it will happen, and how much it will cost. Preparing for the next process node... » read more

Survey: Optimism Grows for EUV


The optimism is growing for extreme ultraviolet (EUV) lithography in the market, according to a pair of new surveys released by the eBeam Initiative, which also revealed some new and surprising data about mask writing tools and other photomask technology. In one of the surveys from the [getentity id="22818" e_name="eBeam Initiative"], respondents revealed that they are more optimistic than e... » read more

Getting Ready For EUV


The highly anticipated introduction of extreme ultra-violet (EUV) lithography is reflected in recent surveys conducted by the eBeam Initiative, which will be presented on Sept. 11 at the annual Photomask Technology Symposium in Monterey, Calif.  There are many changes are coming to the mask industry, in addition to EUV. Those include greater use of inverse-lithography technologies (ILT) and... » read more

Manufacturing Bits: Aug. 29


Compact synchrotron EUV sources For some time, the industry has been exploring the development of next-generation power sources for extreme ultraviolet (EUV) lithography. ASML and Gigaphoton are separately developing EUV sources based on the more traditional and compact laser-produced-plasma (LPP) technology. Then, in R&D, others are exploring the development of futuristic EUV sources us... » read more

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