Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Leveraging Data In Chipmaking


John Kibarian, president and CEO of PDF Solutions, sat down with Semiconductor Engineering to talk about the impact of data analytics on everything from yield and reliability to the inner structure of organizations, how the cloud and edge will work together, and where the big threats are in the future. SE: When did you recognize that data would be so critical to hardware design and manufact... » read more

Week in Review: Iot, Security, Automotive


IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Revving Up For Edge Computing


The edge is beginning to take shape as a way of limiting the amount of data that needs to be pushed up to the cloud for processing, setting the stage for a massive shift in compute architectures and a race among chipmakers for a stake in a new and highly lucrative market. So far, it's not clear which architectures will win, or how and where data will be partitioned between what needs to be p... » read more

Week In Review: Manufacturing, Test


Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Week in Review: IoT, Security, Autos


Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Focus Shifts To Wasted Power


Mobile phones made the industry aware of power, but now the focus is shifting to the total energy needed to perform a task. Activity that is unnecessary to perform the intended task is wasted power, and reducing it requires some new methodologies and structural changes within development teams. There is a broadening awareness about power. "The companies doing SoCs for mobile lead the charge ... » read more

Blog Review: Sept. 25


Mentor's Dave Rich points out that unexpected values from a constraint solver can often be explained by how Verilog expression evaluation rules affect the solution space of SystemVerilog constraints. Cadence's Madhavi Rao points to the need for new and updated safety and cybersecurity standards for autonomous vehicles and highlights one of the most challenging parts of AV deployment. A Sy... » read more

Week In Review: Manufacturing, Test


Fab tools The confidence level of extreme ultraviolet (EUV) lithography continues to grow as the technology moves into production, but the EUV mask infrastructure remains a mixed picture, according to new surveys released by the eBeam Initiative. D2S has developed new hardware and software that enables a long-awaited technology--full-chip masks using inverse lithography technology (ILT). ... » read more

Week in Review – IoT, Security, Autos


Products/Services Synopsys had a lot of announcements this week! Summer is definitely over. The company released BSIMM10 study, the latest version of the Building Security in Maturity Model, helping organizations plan, execute, mature, and measure their software security initiatives. It also released LucidShape version 2019.09, the latest version of that tool for the design, simulation, and an... » read more

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