The Race To 10/7nm


Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

Maintaining Power Profiles At 10/7nm


Understanding power consumption in detail is now a must-have of electronic design at 10nm and below, putting more pressure on SoC verification to ensure a device not only works, but meets the power budget. As part of this, the complete system must be run in a realistic manner — at the system-level — when the design and verification teams are looking at the effects of power during hardwar... » read more

Can Formal Replace Simulation?


A year ago, [getentity id="22147" comment="Oski Technology"] achieved something that had never happened before. It brought together 15 of the top minds in [getkc id="33" kc_name="formal verification"] deployment and sat them down in a room to discuss the problems and issues they face and the ways in which they are attempting to solve those problems. Semiconductor Engineering was there to record... » read more

22nm Process War Begins


Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

The Week In Review: Manufacturing


Fab equipment and test VLSI Research has released its top 10 semiconductor equipment supplier ranking in terms of sales in 2016. Applied Materials topped the list again, achieving a growth of 18%. ASML was second, followed by Lam Research, TEL and KLA-Tencor. Fig. 1: Ranking based on 2016 sales. Source: VLSI Research. Unic Capital Management, a Chinese-based private equity fund, announ... » read more

Electric Vehicles Set The Pace


Electric vehicles are leading the charge for innovation in automotive electronics. Companies that invested and embraced the challenge of EVs are besting their less-nimble, less-open-minded engineering cohorts. Semiconductors and embedded computers have been controlling the dashboard, mirrors, seats, heating and cooling for years. But with EVs, engineering teams are starting to tackle tas... » read more

How Testing MEMS, Sensors Is Different


When it comes to testing microelectromechanical system devices and sensors, sometimes you have to shake and bake. [getkc id="311" comment="MEMS"] and [getkc id="187" kc_name="sensors"] are physically different from standard ICs. They require a specific type of stimulus to get the required testing results. Most chips only need to have an electrical charge run through them to gauge their pass/... » read more

The Week In Review: IoT


Mergers & Acquisitions Qualcomm reported that the waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976 expired on Monday, April 3, clearing the chip design company’s proposed $47 billion acquisition of NXP Semiconductors, at least in the eyes of U.S. antitrust regulators. Qualcomm expects to close the transaction, which will create an Internet of Things powerhouse, b... » read more

Conflicting Goals In Data Centers


Two conflicting goals are emerging inside of data centers—speed at any cost, and the ability to extend hardware well beyond its expected lifetime to amortize that cost. Layered across both of those are concerns about how to move data back and forth more efficiently, how to secure it, and how to best integrate different generations of technology. But these widely different goals have create... » read more

Challenges Grow For IP Reuse


As chip complexity increases, so does the complexity of IP blocks being developed for those designs. That is making it much more difficult to re-use IP from one design to the next, or even to integrate new IP into an SoC. What is changing is the perception that standard [getkc id="43" kc_name="IP"] works the same in every design. Moreover, well-developed [getkc id="100" kc_name="methodologie... » read more

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