The Data Deluge


Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to discuss the intersection of big data and technology, from the data center to the edge and vertical markets such as automotive. What follows are excerpts of that conversation. SE: What are the biggest changes you've seen over the past year? Tan: We are moving quickly toward data-driven economics. There... » read more

More 2.5D/3D, Fan-Out Packages Ahead


A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Striking the Right Chord for Chiplet Integration


The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving vehicles must cope with twice as much data, at higher speeds. Traditional signali... » read more

Speedchip FPGA Chiplets


Next-generation SoC platforms are evolving rapidly to process and move enormous amounts of data from the edge; over the network and to the cloud for high data and compute intensive applications such as AI and machine learning, high-performance computing (HPC) and autonomous driving. As a result, next-generation ASICs need to be larger, faster and further optimized for performance, power and are... » read more

Reducing Advanced Packaging Costs


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

What’s the Right Path For Scaling?


The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Top Tech Talks Of 2018


2018 shaped up to be a year of transition and inflection, sometimes in the same design. There were new opportunities in automotive, continued difficulties in scaling, and an explosion in AI and machine learning everywhere. Traffic numbers on stories give a snapshot of the most current trends, but with videos those trends are even more apparent because of the time invested in watching those v... » read more

Security, Scaling and Power


If anyone has doubts about the slowdown and increasing irrelevance of Moore's Law, Intel's official unveiling of its advanced packaging strategy should leave little doubt. Inertia has ended and the roadmap is being rewritten. Intel's discussion of advanced packaging is nothing new. The company has been public about its intentions for years, and started dropping hints back when Pat Gelsinger ... » read more

Packaging Biz Faces Challenges in 2019


The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

The Case For Chiplets


Kandou’s Amin Shokrollahi looks at what’s behind the momentum for a LEGO-like approach, where the challenges are, and how the cost compares with other approaches. https://youtu.be/7QHEeagdLzk     ___________________________________ Find more tech talk videos here .   » read more

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