Tech Talk: Verification


Frank Schirrmeister, Cadence's senior group director for verification platforms, talks about what's changing in verification with 5G, machine learning, greater connectivity, advanced packaging, and the growing need to build security into designs. https://youtu.be/GMF8BkmdJzE » read more

Chiplets Gaining Steam


Building chips from pre-verified chiplets is beginning to gain traction as a way of cutting costs and reducing time to market for heterogeneous designs. The chiplet concept has been on the drawing board for some time, but it has been viewed more as a possible future direction than a necessary solution. That perception is beginning to change as complexity rises, particularly at advanced nodes... » read more

The Chiplet Option


All of the leading chipmakers, foundries and OSATs are now working with some sort of advanced packaging. The next step is to add some consistency to those efforts to be able to assemble chips much more quickly and inexpensively. DARPA has been promoting chiplets as the best way to solve this problem, and for the military, this is a pretty logical choice. With a push toward heterogeneity in c... » read more

DARPA CHIPS Program Pushes For Chiplets


While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

From SerDes Chiplets To Die-To-Die Interfaces


The demand for ever faster high-speed interfaces has never been quite so pronounced. In our increasingly connected world, petabytes of data are continuously generated by a wide range of devices, systems and IoT endpoints such as vehicles, wearables, smartphones and even appliances. The resulting digital tsunami has prompted industry heavyweights like Google, Microsoft, Facebook and Amazon to co... » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more