中文 English

Blog Review: Sept. 28


Cadence's Paul McLellan shares more highlights from the recent Hot Chips, including some very large chips and accelerators for AI and deep learning, new networks and switches, and mobile and edge processors. Synopsys' Marc Serughetti considers the different use cases for digital twins in automotive and how they can help determine the impact of software on verification, test, and validation a... » read more

Week In Review: Manufacturing, Test


On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Week In Review: Design, Low Power


Quantum The $3 million Breakthrough Prize in Fundamental Physics was awarded to four pioneers in the field of quantum information. The laureates are Charles H. Bennett, Gilles Brassard, David Deutsch and Peter Shor. Bennett and Brassard were part of the team that proved the usefulness of entanglement, while Deutsch defined the quantum version of a Turing machine. Shor invented the first "clear... » read more

Strengthening The Global Semi Supply Chain


This confluence of all these factors is creating disruptions around the globe. Compounding that, the end customer base is shifting from traditional chipmakers designing for a socket to a combination of systems companies, existing chipmakers, and a slew of new players that are developing chips for very specific applications. Some of those are being developed at the most advanced nodes, particula... » read more

Blog Review: Sept. 21


Arm's Neil Burgess and Sangwon Ha explain why they've joined Intel and Nvidia in proposing a new 8-bit floating point specification to enable neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the vast amounts of model data between formats while reducing task loss to a minimum. Synopsys' Manuel Mota examines ver... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive and mobility U.S. President Joe Biden announced the approval of $900 million in funding for a nationwide network of electrical vehicle charging stations in 35 states. The money is part of a multi-year, $7.5 billion plan to create 500,000 charging stations along federal highways. Industry executives told Reuters that remote human supervisors may be a permanent fixture of highly au... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO


Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

How Mature Are Verification Methodologies?


Semiconductor Engineering sat down to discuss differences between hardware and software verification and changes and challenges facing the chip industry, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president o... » read more

Blog Review: Sept. 14


Synopsys' Godwin Maben, Piyush Sancheti, and Hany Elhak examine some of the top chip design considerations for medical devices and why they require careful analysis of power to reduce the number surgeries to replace batteries, reliability for devices that can be expected to last for ten years or more, and security to protect private medical data and prevent breaches. Siemens' Chris Spear exp... » read more

Designing For Thermal


Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

← Older posts