Blog Review: Aug. 16


Cadence's Paul McLellan checks out how Imec sees the future of transistors and the challenges of 3D logic. Synopsys' Robert Vamosi gets a lesson on the electronic systems powering modern cars, and considers when it's ethical to hack one. Mentor's Colin Walls takes a look at how to pass data between RTOS tasks. Rambus' Aharon Etengoff looks at recent semi market predictions, from expand... » read more

How Reliable Are FinFETs?


Stringent safety requirements in the automotive and industrial sectors are forcing chipmakers to re-examine a number of factors that can impact reliability over the lifespan of a device. Many of these concerns are not new. Electrical overstress (EOS), electrostatic discharge (ESD) and [getkc id="160" kc_name="electromigration"] (EM) are well understood, and have been addressed by EDA tools f... » read more

The Week In Review: Design


M&A Mentor acquired Valydate, provider of the VERA schematic integrity analysis tool. Founded in 2010, the Canadian company also offered signal and power integrity and static timing analysis services. Valydate's technology will be integrated with Mentor's Xpedition PCB design flow, though former Valydate CEO Michael Alam says it will continue to serve all EDA environments. Tools Aldec ... » read more

UPF Power Domains And Boundaries


The Universal Power Format (UPF) plays a central role in mitigating dynamic and static power in the battle for low-power in advanced process technology. A higher process node is definitely attractive as more functionality integration is possible in a smaller die area at a lower cost. However, in reality, this comes at the cost of exponentially increasing leakage power. This is because the minim... » read more

Addressing The Complex Challenges In Low-Power Design And Verification


This paper provides a comprehensive analysis of various complex debug problems faced in low-power design and verification. By using relevant examples it demonstrates how these issues can be either avoided or easily solved. We will also highlight some of the common pitfalls that low-power designers can avoid, which otherwise can lead to complex low-power issues that are difficult to debug at lat... » read more

Blog Review: Aug. 9


Cadence's Paul McLellan digs into a recently discovered vulnerability in the Broadcom Wi-Fi chip used in many smartphones and why it should be a wakeup call for SoC designers. Mentor's Craig Armenti considers whether work-in-process design data management is an asset or a liability. Synopsys' Thomas M. Tuerke notes that in code, as in medicine, proper hygiene is should be treated as a con... » read more

Advanced Packaging Moves To Cars


By Ann Steffora Mutschler and Ed Sperling As automotive OEMs come up to speed on electrification of vehicles, each at their own pace, they are starting to embrace novel packaging approaches as a way to differentiate themselves in an increasingly competitive market. Wirebond used to dominate this market, where most of the chips were relatively unsophisticated and product cycles were slowâ€... » read more

Solving The Design And Verification Challenges Of High Density Advanced Packaging


This paper discusses ways in which design teams can apply silicon (IC) type processes to the design and verification of the emerging HDAP packages. High Density Advanced Packaging, or HDAP, is the next-generation architecture for increased functional density, higher performance, lower power, smaller PCB footprints, and thinner profiles. This new “breed” of disruptive packaging technology... » read more

5 Big Under-The-Hood Engineering Challenges In Building Autonomous Vehicles


Stories about autonomous vehicles are regular fare in the tech news cycle and usually include forecasts about the eventual ascendancy of self-driving cars. The Boston Consulting Group, for example, says that by 2035, 25% of all cars will have partial or full autonomy, with total global sales growing from near-zero levels in 2015 to $42 billion in 2025 and ~ $77 billion by 2035. In short few ye... » read more

Flexible Devices Drive New IoT Apps


Printed and flexible electronics are becoming almost synonymous with many emerging applications in the IoT, and as the technologies progress so do the markets that rely on those technologies. Flexible [getkc id="187" kc_name="sensors"] factor into a number of [getkc id="76" kc_name="IoT"] use cases such as agriculture, health care, and structural health monitoring. Other types of flexible de... » read more

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