Chip Industry Week In Review


Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Humanoid Touch And Voice Are Improving Rapidly


Key Takeaways Humanoid robots are rapidly expanding beyond factories and logistics toward broader, general-purpose roles (including in-home assistance), driven by advances in AI and sensing. Compared with vision and language, touch (haptics) and hearing/voice in real environments remain the hardest — and most commercially important — sensing challenges, requiring fast sensor fusio... » read more

Blog Review: May 6


Synopsys' Prith Banerjee identifies key challenges in designing AI data centers and why addressing them requires a transformative approach that impacts every aspect of the system design and its individual components. Cadence's Meet S Chauhan checks out what's new in MIPI C-PHY v3.0, including the new 18 wire state mode that can support high-resolution display and image sensors and motion vec... » read more

Chip Industry Week in Review


Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

How Long Will CAN Stick Around As Rival Networks Speed Up?


Key Takeaways Automotive Ethernet is rapidly becoming the backbone of software-defined vehicles for higher bandwidth, scalability, and advanced features like TSN and security that legacy protocols cannot match. CAN, LIN, and other legacy networks will not disappear quickly because they are deeply embedded, low‑cost, and proven, but they are increasingly seen as inadequate for future A... » read more

Blog Review: Apr. 29


Synopsys' Madhumita Sanyal shows why interface IP has emerged as the keystone for building scalable, reliable 3D multi-die designs in which interconnects often have a greater influence on overall system capability than the peak performance of individual dies. Cadence's Frank Ferro checks out why SOCAMM2 built on LPDDR is being deployed in AI data centers, increasing memory bandwidth and capa... » read more

Chip Industry Week In Review


Deals Marvell acquired Polariton Technologies, a Swiss developer of plasmonics-based silicon photonics devices. Onto Innovation is partnering with Rigaku, combining Onto’s analysis software with Rigaku’s CD-SAXS platform for advanced semiconductor process control. Onto also agreed to acquire a 27% stake in Rigaku for about $710M. Tesla plans to use Intel’s 14A process for its T... » read more

Blog Review: Apr. 8


Cadence's Shyam Sharma highlights new capabilities in LPDDR6, including metadata built into the data packets, rowhammer mitigations, DVFS with support for three operating voltage rails, and new efficiency modes. Synopsys' Akanksha Soni points to multiphysics simulation as a key element of ensuring automotive IC designs meet ISO 26262 requirements. Siemens' John McMillan suggests a simulat... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

Moving Electrons, Not Just Vehicles


Key Takeaways: There are several ways to convert AC power from the grid to DC power in the system. Some degrade the battery faster than others. Battery management systems monitor cell voltage, current, and temperature, helping to estimate state of charge, health, and useful remaining life. A PMIC with a multi-level converter is the most efficient way to get power from the battery to ... » read more

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