Advanced Packaging Goes Mainstream


The roadmap for shrinking digital logic will continue for at least the next 10 years. For others devices, particularly analog, it will slow down or end. And therein lies one of the most fundamental changes in semiconductor design and manufacturing in the past half century. This is no longer just talk. Apple is using a fan-out architecture in its iPhone 7. Memory makers are stacking NAND and ... » read more

Can Formal Replace Simulation?


A year ago, [getentity id="22147" comment="Oski Technology"] achieved something that had never happened before. It brought together 15 of the top minds in [getkc id="33" kc_name="formal verification"] deployment and sat them down in a room to discuss the problems and issues they face and the ways in which they are attempting to solve those problems. Semiconductor Engineering was there to record... » read more

Time For Massively Parallel Testing


Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

The Week In Review: Design


SoftBank plans to sell a 25% stake in ARM to Vision Fund, a $100 billion technology fund created last year by SoftBank and Saudi Arabia's Public Investment Fund. SoftBank and Saudi Arabia are investing $25 billion and $45 billion in the fund, respectively. Another potential major player is Mubadala Development Co., the government-owned Abu Dhabi investment firm which owns GlobalFoundries and, a... » read more

OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

What’s Missing In Advanced Packaging


Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

The Week In Review: Design


M&A Lattice Semiconductor is set for a buyout by private equity fund Canyon Bridge at a price of $1.3 billion, or $8.30 per share. Lattice will operate as a standalone subsidiary and does not expect any changes in operations or management. The deal is expected to close in early 2017. Earlier this week, Lattice announced a low power, small form factor FPGA for 5G SERDES applications. The ... » read more

The Week In Review: Manufacturing


Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

Seeing The Future Of Vision


Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

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