Semicon West Day One/Two


For years, the semiconductor and equipment industry has congregated at the annual Semicon West trade show in San Francisco. It’s an event to get an update on the latest equipment, test and packaging technologies. It’s also a good way to meet with people who you haven’t seen in a year, if not longer. It’s a great way to get a pulse on the industry. Needless to say, Semicon is a vir... » read more

Atomic Layer Etch Expands To New Markets


The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology that removes materials at the atomic scale, is one of several tools used to process advanced devices in a fab. ALE moved into production for select applications around 2016, although the technolog... » read more

Week In Review: Manufacturing, Test


Fab tools, packaging/test VLSI Research has released its 200mm wafer fab equipment (WFE) market share figures for 2019. The top three suppliers--Applied Materials, TEL, and ASML—saw growth in the 2019 200mm WFE business. Lam Research was in fourth place, followed by KLA and Canon. In total, 200mm wafer fab equipment sales were $3.6 billion in 2019, declining 5% from 2018, according to the fi... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

Week In Review: Manufacturing, Test


Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000 wafers per month. TSMC’s total spending on this project will be approximately $12 billion from 2021 to 2029. Construction is planned to start in 2021 with production targeted to begin in 202... » read more

Week In Review: Auto, Security, Pervasive Computing


AI/Edge The United States now has the highest number of COVID-19 cases, and the state governments in the U.S. are asking technologists for help, according to a story in The Washington Post. Data scientists, software developers, and others are needed to help. New York State started a Technology SWAT team calling for help from the tech community. Intel AI Builder program participant DarwinAI ... » read more

Week In Review: Manufacturing, Test


The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

Blog Review: Feb. 5


Cadence's Paul McLellan checks out the different ways persistent memories can be used, as well as a basic persistent programming model and key things hardware needs to support. In a video, Mentor's Colin Walls explains what's different about operating systems for embedded applications and how to go about selecting one. Synopsys' Taylor Armerding finds troubling vulnerabilities in U.S. cri... » read more

SiC Foundry Business Emerges


Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the market will not be so easy for SiC foundry vendors and their customers. They are facing stiff competition from traditional SiC device vendors such as Cree, Infineon, Rohm and STMicroelectronics. ... » read more

AI And Big Data Set To Reinvent Semiconductor Industry


The recent IEEE International Electron Devices Meeting (IEDM) reaffirmed that the semiconductor industry is in a period of reinvention as we grapple with the challenges and opportunities promised by the Internet of Things (IoT), Big Data and AI. That such change is underway was made evident by a panel I was honored to moderate titled, “The Future of Logic: EUV is Here, Now What?” Joining... » read more

← Older posts