Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

What Works Best For Chiplets

By Anne Meixner - 18 Apr, 2024 - Comments: 0

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

Memristor Crossbar Architecture for Encryption, Decryption and More

By Technical Paper Link - 16 Apr, 2024 - Comments: 0

A new technical paper titled "Tunable stochastic memristors for energy-efficient encryption and computing" was published by researchers at Seoul National University, Sandia National Laboratories, Texas A&M University and Applied Materials. Abstract "Information security and computing, two critical technological challenges for post-digital computation, pose opposing requirement... » read more

Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Digital Twins Target IC Tool And Fab Efficiency

By Laura Peters - 21 Mar, 2024 - Comments: 0

Digital twins have emerged as the hot "new" semiconductor manufacturing technology, enabling fabs to create a virtual representation of a physical system on which to experiment and optimize what's going on inside the real fab. While digital twin technology has been in use for some time in other industries, its use has been limited in semiconductor manufacturing. What's changing is the breadt... » read more

Chip Industry Week In Review

By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Backside Power Delivery Gears Up For 2nm Devices

By Laura Peters - 26 Feb, 2024 - Comments: 1

The top three foundries plan to implement backside power delivery as soon as the 2nm node, setting the stage for faster and more efficient switching in chips, reduced routing congestion, and lower noise across multiple metal layers. The benefits of using this approach are significant. By delivering power using slightly fatter, less resistive lines on the backside, rather than inefficient fro... » read more

Why Chiplets Are So Critical In Automotive

By John Koon - 20 Feb, 2024 - Comments: 1

Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

Chip Ecosystem Apprenticeships Help Close The Talent Gap

By Liz Allan - 12 Feb, 2024 - Comments: 1

Competency-based apprenticeship programs are gaining wider acceptance across the chip industry as companies and governments look for new ways to address talent shortages, and as workers look for new skills that can span multiple industry sectors and industries. Funded in part by the CHIPS Act in the U.S. the European Chips Act, and various other nation-specific and regional programs, apprent... » read more

Chip Industry Week In Review

By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

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tag: Applied Materials

Chip Industry Week In Review

What Works Best For Chiplets

Memristor Crossbar Architecture for Encryption, Decryption and More

Chip Industry Week In Review

Digital Twins Target IC Tool And Fab Efficiency

Chip Industry Week In Review

Backside Power Delivery Gears Up For 2nm Devices

Why Chiplets Are So Critical In Automotive

Chip Ecosystem Apprenticeships Help Close The Talent Gap

Chip Industry Week In Review

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