Author's Latest Posts


Tackling Variability With AI-based Process Control


Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What follows are excerpts of that conversation. SE: How is AI being used in semiconductor manufacturing and what will the impact be? Herlocker: AI is going to create a completely different factor... » read more

Fan-Out Panel-Level Packaging Hurdles


Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield. There is still much work to be done before that happens. Until now, FOPLP has been adopted for devices that are manufactured in ve... » read more

Plugging Gaps In The IC Supply Chain


Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

Fabs Begin Ramping Up Machine Learning


Fabs are beginning to deploy machine learning models to drill deep into complex processes, leveraging both vast compute power and significant advances in ML. All of this is necessary as dimensions shrink and complexity increases with new materials and structures, processes, and packaging options, and as demand for reliability increases. Building robust models requires training the algorithms... » read more

Fingerprinting Chips For Traceability


Semiconductor components increasingly require unclonable and tamper resistant identifiers, which are especially necessary as devices become increasingly heterogeneous collections of chiplets and subsystems. These fingerprints provide traceability, which contributes to process improvements and yield learning and enable tracking for a tightly managed supply chain. While some of this technology... » read more

Applying ML In Failure Analysis


Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran H... » read more

IC Manufacturing Targets Less Water, Less Waste


Fabs, OSATs, and equipment makers are accelerating their efforts to consume less water while recycling more material waste in a trend toward better sustainability. With chips, sustainability is heavily focused on carbon emissions, and energy consumption is a significant contributor. But there is an equal effort underway to reduce water consumption and pollution. Across the globe, the number ... » read more

DRAM Test And Inspection Just Gets Tougher


DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much more difficult with the rollout of faster interfaces and multi-chip packages. DRAM plays a key role in a wide variety of electronic devices, from phones and PCs to ECUs in cars and servers ins... » read more

Isolating Critical Data In Failure Analysis


Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hakim, ASIC reliability engineer at Teradyne... » read more

Streamlining Failure Analysis Of Chips


Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hak... » read more

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