AI Data Centers And Auto Industry Converge On Same Issues


Key Takeaways:   AI data centers need power from a range of sources, including batteries, to safeguard against blackouts, transient voltage spikes, and grid demand spikes.   As with regenerative braking and bidirectional charging in electric vehicles, data centers could feed power or heat back into the grid for public use, but the immediate goal is to disrupt the grid as little ... » read more

Chip Industry Technical Paper Roundup: June 30


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations PuDGhost: Experimental Analysis of Computation Result Corruption in Processing-using-DRAM Operations on Real DRAM Chips and Implications for Future Systems 🔗 The University of Tokyo, ETH Zurich, CISPA, RIKEN Recent Progress in Atomic-Scale Contr... » read more

Chip Industry Week In Review


Dealmaking Amkor inked a 10-year agreement with TSMC to provide advanced packaging and test services in Arizona, tying TSMC’s U.S. fab expansion to domestic OSAT capacity. Trump said in a post that Apple will partner with Intel on chip design and production in the U.S., marking a second reported win for the chipmaker this month. Intel Foundry will also reportedly manufacture 3 million... » read more

Google Details Five Generations Of TPU Training Supercomputers


Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training Supercomputers from TPU v2 to Ironwood: Architectural Stability, Scale, Resilience, Power Efficiency, and Sustainability Across Five Generations.” The paper summarizes five generations of Google TPUs, from TPU v2 through Ironwood, and examines how the systems evolved int... » read more

The Edge LLM Offload Story


By Karthikeyan Shanmuga Vadivel and Sauryadeep Pal Developers and system architects today face a growing demand to enable large language model variants on device. They are facing pressure to support transformer-capable models on constrained devices to ensure data privacy, eliminate cloud API charges, and provide offline reliability. On-device execution is also becoming a necessity to meet st... » read more

Chip Industry Technical Paper Roundup: Jun. 2


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Physical Foundation Models: Fixed HW implementations of large-scale neural networks 🔗 Yale University, Cornell University, Boston University, NTT Research Understanding Inference Scaling for LLMs: Bottlenecks, Trade-offs, and Performance Princip... » read more

Detecting Defect-Induced Silent Data Corruptions in CPUs (Stanford, Google)


Researchers from Stanford University and Google have published “ITHICA: Intra-Thread Instruction Checking Approach for Defect-Induced Silent Data Corruptions”. Abstract “Hyperscaler reports of silent data corruptions (SDCs)—presumed to be caused by silicon manufacturing defects—have motivated the development of functional tests for detecting defective CPUs and their use in h... » read more

Chip Industry Week In Review


Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging collaborations with ASE and others. AMD also announced the start of its production ramp of its Venice processors on TSMC's 2nm process. Lam Research established a panel-level packaging cen... » read more

Chip Industry Week In Review


Deals Marvell acquired Polariton Technologies, a Swiss developer of plasmonics-based silicon photonics devices. Onto Innovation is partnering with Rigaku, combining Onto’s analysis software with Rigaku’s CD-SAXS platform for advanced semiconductor process control. Onto also agreed to acquire a 27% stake in Rigaku for about $710M. Tesla plans to use Intel’s 14A process for its T... » read more

Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

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