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Week In Review: Design, Low Power


Tools & design EDA industry revenue increased 7.1% year-over-year from $2.95 billion to $3.46 billion in Q3 2021, according to the ESD Alliance. "Geographically, all regions reported double-digit growth, with product categories CAE, Printed Circuit Board and Multi-Chip Module, SIP, and Services also showing double-digit growth," said Walden C. Rhines, Executive Sponsor of the SEMI Electron... » read more

Blog Review: Jan. 19


Synopsys' Anand Thiruvengadam examines the memory chip design challenges of optimizing PPA, speeding turnaround time, and improving reliability and how a shift-left approach can help. Cadence's Paul McLellan checks out some of TSMC's recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between IR-drop and TSV usage in multi-chip physical verific... » read more

Power/Performance Bits: Jan. 18


3D printed custom wearables Researchers from the University of Arizona created a 3D printed wearable that can operate continuously through wireless power to track body temperature and muscle deformation during exercise. Based on 3D body scans of the wearer, the medical-grade 'biosymbiotic device' can be custom printed to conform to a user's skin without the need for adhesives, which can irr... » read more

Week In Review: Design, Low Power


Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Blog Review: Jan. 12


Synopsys' Twan Korthorst introduces the history of photonics, why it is important for the semiconductor industry, key market applications, and the future of photonic integrated circuits. Cadence's Paul McLellan takes a look at TSMC's recent announcements around its N3 and N3 HPC notes and the push for performance gains through design technology co-optimization Siemens' Sebastian Flock che... » read more

Power/Performance Bits: Jan. 10


Muscle-tracking clothing Researchers from the University of Utah and Gyeongsang National University developed a low-cost bioelectrical sensor that can be integrated into clothing. The sensor measures electromyography (EMG) signals that are generated in muscles when they contract. EMG signals are useful for studying muscle fatigue and recovery and could potentially be used to inform diagnosi... » read more

Week In Review: Design, Low Power


SK Hynix completed the first phase of its acquisition of Intel's NAND and SSD business. In this first step it took control Intel’s SSD business and the Dalian NAND flash manufacturing facility in China, for a price of $7 billion. Next, it will acquire from Intel the remaining assets in relation to its NAND business, including IP related to the manufacture and design of NAND flash wafers, R&am... » read more

Blog Review: Jan. 5


Cadence's Paul McLellan listens in on the challenges Tesla sees in manufacturing batteries for electric vehicles at scale and the types of battery chemistries it are currently using. Synopsys' Mark Kahan finds out the launch steps involved with the James Webb Space Telescope and the role of optical design software in creating the new instruments for Near IR and Mid IR sensing. Siemens' An... » read more

Startup Funding: December 2021


Chinese startups dominated last month's fundraising, with companies from the country comprising about two-thirds of those covered in this report. In addition to the number of companies, startups from China also drew significant amounts of funding, with a display driver company and an EV battery maker each garnering around $1B and six more companies seeing rounds over $100M. Two particularly ... » read more

Power/Performance Bits: Jan. 3


Optical device integration Researchers from the University of Strathclyde, University of Glasgow, and the Australian National University propose a way to place multiple micron-scale optical devices made from different materials close together on a single silicon chip. “The development of electronics that are based on silicon transistors has enabled increasingly more powerful and flexible ... » read more

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