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Research Bits: October 24

Photonic-electronic hardware processes 3D data Researchers from the University of Oxford, University of Muenster, University of Heidelberg, and University of Exeter are developing integrated photonic-electronic hardware capable of processing three-dimensional data, which the team claims boosts data processing parallelism for AI tasks. The researchers added an extra parallel dimension to the... » read more

Blog Review: October 18

Siemens' Stephen Chavez suggests including analog mixed signal analysis and board level parasitics within the design process from the earliest electrical design stage and throughout final release of the PCB design. Synopsys’ Filip Thoen, Leonard Drucker, and Vivek Prasad highlight how the complexities and interdependencies of multi-die systems create new challenges for software bring-up, a... » read more

Research Bits: October 17

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

Blog Review: October 11

Cadence's Sangeeta Soni examines Integrity and Data Encryption (IDE) verification considerations for Compute Express Link (CXL) devices, including MAC generation and handling, key programming and exchange, and early MAC termination. Synopsys' Madhumita Sanyal points to how the increased bandwidth of PCIe 6.0 supports the demanding requirements of AI accelerators. Siemens' Kevin Webb expla... » read more

Startup Funding: September 2023

Chip-to-chip and data center I/O drew investor interest in September, including support for several startups developing Compute Express Link (CXL) solutions. Elsewhere in the data center, several large rounds went to companies developing AI accelerators. And at the edge, startups are building unique ways to handle AI at very little power by initially processing data directly at the sensor. O... » read more

Blog Review: October 4

Cadence's Felipe Goncalves checks out the Integrity and Data Encryption (IDE) feature in PCIe 6.0, a new layer inserted between the transection layer and data link layer with the goal of protecting against threats from physical attacks on the link. Siemens' Robin Bornoff, Daniel Berger, and Kai Liu explore the potential for large language models (LLMs) make the use of CAE tools simpler, more... » read more

Research Bits: October 3

Growing indium selenide at scale Researchers from the University of Pennsylvania, Brookhaven National Laboratory, and the Air Force Research Laboratory grew the 2D semiconductor indium selenide (InSe) on a full-size, industrial-scale wafer. It can also be deposited at temperatures low enough to integrate with a silicon chip. The team noted that producing large enough films of InSe has prove... » read more

Blog Review: September 27

Siemens' Dirk Hartmann examines how a continual improvement in predictive capability processing and algorithms enables the evolution of simulation performance and highlights two areas that underpin most simulation tools. Synopsys' Ian Land, Jason Niatas, and Marc Serughetti note that digital twins can be used from the chip level through sub-systems and up to the system level to examine perfo... » read more

Research Bits: September 26

2D waveguides Researchers from the University of Chicago found that a sheet of glass crystal just a few atoms thick could trap and carry light efficiently up to a centimeter. In tests, the researchers found they could use extremely tiny prisms, lenses, and switches to guide the path of the light along a chip. “We were utterly surprised by how powerful this super-thin crystal is; not on... » read more

Blog Review: September 20

Siemens' Patrick Hope considers the unique attributes of materials used in flex and rigid-flex PCB designs and how they are constructed. Synopsys' Kenneth Larsen and Shekhar Kapoor find that the increased impact of thermal, signal integrity, and other multi-physics effects on multi-die systems calls for looking at the whole system, from technology to dies and package together. Cadence's V... » read more

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