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Week In Review: Design, Low Power


Infineon acquired Industrial Analytics, a provider of AI-enabled industrial equipment monitoring. Its solution can monitor plants for early detection of critical developments, based on analysis and evaluation of vibrations, and evaluate data for both predictive and prescriptive maintenance. "Industrial Analytics has outstanding expertise in the area of predictive analysis for industrial machine... » read more

Blog Review: Aug. 10


Siemens' Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration. Cadence's Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive suppl... » read more

Research Bits: Aug. 8


Speeding NVM encryption Researchers from North Carolina State University propose a way to speed up encryption and file system performance for non-volatile memory (NVM). “NVMs are an emerging technology that allows rapid access to the data, and retains data even when a system crashes or loses power,” said Amro Awad, an assistant professor of electrical and computer engineering at North C... » read more

Startup Funding: July 2022


Quantum computing may seem like a futuristic technology, but computation based on superposition and entanglement is here and investors are eager to get behind it. Two of July's rounds that passed the $100 million mark were for superconducting quantum processor companies, one of which is also developing EDA software to assist in designing quantum circuits. And it's not just mega-rounds. Two quan... » read more

Blog Review: Aug. 3


Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Blog Review: July 27


Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

Research Bits: July 26


Photonic computing with polarization Researchers at the University of Oxford and University of Exeter developed a method that uses the polarization of light to maximize information storage density and computing performance using nanowires. The researchers note that different polarizations of light do not interact with each other, allowing each to be used as an independent information channe... » read more

Blog Review: July 20


Synopsys' Ron Lowman examines the various neural networks used in camera applications, the balancing act between camera lens choice and neural networks implemented, and how IP and embedded vision processors help optimize the designs. Siemens' Katie Tormala considers the importance of acoustic performance in consumer electronics and why it's important to understand the relationships between t... » read more

Research Bits: July 18


CXL memory disaggregation Researchers from the Korea Advanced Institute of Science and Technology (KAIST) developed a Compute Express Link (CXL) solution for directly accessible, high-performance memory disaggregation that they say significantly improves performance compared to existing remote direct memory access (RDMA)-based memory disaggregation. RDMA enables a host to directly access an... » read more

Week In Review: Design, Low Power


Tools & IP Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins. Future Facilities’ product portfolio includes an electronics thermal solution, as well as computational fluid dynamics (CFD) electronics cooling simulation technology that op... » read more

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