Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
Chip Industry Week in Review
TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.
Tape-Out Failures Are The Tip Of The Iceberg
As the success rate for the semiconductor industry declines, it may be time to rethink our priorities.
Chip Industry Week In Review
TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare earths dry up; new EV chips.