The Sub-2nm Paradox
Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.
Flash Getting Stacked High-Bandwidth Version
Inspired by HBM, HBF could improve AI efficiency in 3D flash memory.
AI Accelerator Testing Depends On DFT Innovations
Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them.
Chiplets Need A New Workflow
Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to identify risks early and scale reliably.
HBM Shifts Testing Left To Preserve AI Chip Yield
Testing sooner and more often can improve quality and reduce scrap, but it's also more costly.
