More and bigger funding rounds for AI chips and AI for making chips; 75 companies raise $3 billion.
The promise of AI dominated the last quarter of 2025. Investors were eager to claim stakes in both brand-new startups and more established companies developing AI-specific hardware, primarily for data centers, with over $1 billion alone flowing into the sector. The largest round of the quarter went to a new entrant aiming to fundamentally change how AI compute is performed, while two in-memory compute companies also drew significant funding.
But it’s not just chipmakers reaping the benefits of the AI boom. The potential to improve the design process itself is spurring the creation of new companies offering agentic AI design and debug, PCB layout, and AI-assisted physics simulation.
The number of mega-rounds has also increased lately. Semiconductor Engineering tracked 12 rounds of $100 million or more in Q4 and 11 in Q3, a significant increase from earlier in 2025 and 2024, when around 6 per quarter was more common. Other highlights of the quarter include new memory technologies, power management and conversion chips, additive manufacturing, and security in this look at 75 companies that collectively raised $3 billion in Q4 2025.
Celero Communications raised $100.0M in Series B investment led by Alphabet’s CapitalG, plus seed and Series A rounds totaling $40.0M led by Sutter Hill Ventures, with participation from Valor Equity Partners, Atreides Management, Maverick Silicon, and others. Celero develops a coherent DSP platform for high-bandwidth, low-power optical connectivity for AI infrastructure. The company says its DSPs enable AI systems to scale across accelerator clusters and cloud data center connections. Founded in 2024, it is based in Irvine, California, USA.
Movandi raised $40.0M in strategic funding led by ITHCA Group, joined by Phaistos Investment Fund, VT Alliance, Murata, Cota Capital, Celesta Capital, DNX Ventures, and Sierra Ventures. Movandi provides RF and mmWave chipsets, beamforming silicon, phased array antennas, and repeater systems for wireless communications infrastructure. Target markets include 5G mmWave, satellite communications, and fixed wireless access. Funds will accelerate global deployment. Founded in 2016, it is based in Irvine, California, USA.
Magics Technologies added €4.0M (~$4.6M) in the second closing of its capital round, led by SC One and PMV, with participation from KU Leuven Research & Development, Gemma Frisius Fund, Invest for Jobs, Belgian Nuclear Research Centre, and the company’s founders, bringing the round to €9.7M (~$11.1M). Magics makes radiation-hardened ICs for space systems and nuclear infrastructure. The startup says its radiation-hardened-by-design methodology produces chips that can withstand conditions of up to 100 Mrad / 1 MGy (Si) TID and immunity to Single Event Effects of up to LET > 62.5 MeV · cm²/mg. Funding will be used to accelerate the roll out of three product lines: imaging chips for nuclear cameras and inspection systems, precision timing and clock generation ICs for space missions, and sensing and control chips for robotics, actuators, and SMRs. A spin-off from KU Leuven and SCK CEN founded in 2015, it is based in Geel, Belgium.
Morphing Machines raised INR 384.0M (~$4.3M) in Series A funding led by IAN Group, with participation from existing investors Speciale Invest, IvyCap Ventures, and Navam Capital. Morphing Machines develops a many-core, massively parallel, runtime reconfigurable SoC platform that can scale from 16 cores to 4K cores. The embedded processor platform enables multiple domain-specific architectures on a single chip that can be instantiated on demand upon an event to handle mixed critical tasks and applications simultaneously. Target markets include avionics, automotive, and 5G/6G telecom. Funds will support tape out, pilot deployments, and hiring. Founded in 2005, it is based in Bengaluru, India.
Unconventional AI raised $475.0M in seed funding led by Lightspeed Venture Partners and Andreessen Horowitz, with participation from Sequoia Capital, Lux Capital, DCVC, Future Ventures, and individual investors. Unconventional AI co-designs analog AI chips, algorithms, and software with the goal of dramatically increasing AI energy efficiency. The startup believes it can achieve energy efficiency akin to the brain by building circuits and software that interface with the inherent physics of silicon and demonstrate non-linear dynamics similar to those of biological neurons. Founded in 2025, it is based in San Francisco, California, USA.
d-Matrix raised $275.0M in Series C funding led by BullhoundCapital, Triatomic Capital, and Temasek, joined by Qatar Investment Authority, EDBI, Microsoft’s M12, Nautilus Venture Partners, Industry Ventures, and Mirae Asset. d-Matrix has developed a 3D stacked digital in-memory computing (DIMC) architecture targeting generative AI and LLM data center inference workloads. The chiplet-based architecture tightly integrates compute and memory with die-to-die interconnects in an all-to-all topology and natively implements Block Floating Point numerics. The company also offers NICs and software. Funds will accelerate global expansion and support multiple large-scale deployments. Founded in 2019, it is based in Santa Clara, California, USA, and has raised $450M to date.
Tachyum raised $220.0M in Series C funding. Tachyum has designed what it calls a universal processor that combines the functionality of CPUs, GPGPUs, and AI accelerators in a single homogeneous architecture for AI/ML, HPC, big data analytics, and cloud workloads. In its latest design, based on a 2nm process, each chiplet in the package integrates 256 high-performance custom 64-bit cores; its top-end chip will include 1,024 cores, 24 DDR5 17.6GT/s memory controllers, and 128 PCIe 7.0 lanes. Tachyum also licenses AI inference processor IP for edge and IoT devices. Funds will be used to tape out the chip. The company is eyeing an IPO as early as 2027. Founded in 2016, it is based in Bratislava, Slovakia, and Las Vegas, Nevada, USA.
Mythic raised $125.0M in funding led by DCVC, joined by New Enterprise Associates, Atreides Management, Future Ventures, Softbank KR, S3 Ventures, Linse Capital, One Madison Group, Catapult Ventures, UDC Ventures, Honda Motors, Lockheed Martin, and others. Mythic makes analog processing units (APUs) for edge and data center AI. The energy-efficient analog compute-in-memory architecture can perform a single multiply-accumulate operation using only 17 femto joules, which it says results in 120 TOPS/W with the current architecture. Additionally, it can scale to 1T parameter LLMs, in both 2D and 3D, without requiring a high-speed APU-to-APU connection. Mythic also claims it provides accuracy levels higher than von Neumann architectures operating in higher precision. The company has integrated its APUs into a sub-1W device used to improve the performance of image sensors by extracting signals from noise. Target markets are robotics, automotive, defense, and data centers. Founded in 2012, it is based in Austin, Texas and Redwood City, California, USA.
Majestic Labs emerged from stealth with over $100.0M in Series A and seed financing led by Bow Wave Capital and Lux Capital, joined by SBI, Upfront Ventures, Grove Ventures, Hetz Ventures, QP Ventures, Aidenlair Global, and TAL Ventures. Majestic Labs has designed an AI server architecture with high memory capacity using custom accelerator and memory interface chips that disaggregate memory from compute. The startup says its approach enables up to 128 TB of high-bandwidth memory per server. Funds will support development of the full software stack, pilot deployments, and hiring. Founded in 2023, it is based in Tel Aviv, Israel, and San Francisco, California, USA.
Vinci emerged from stealth with $46.0M in seed and Series A funding led by Xora Innovation and Eclipse Ventures. Vinci offers physics-based AI for hardware design and simulation, particularly advanced packaging and 2.5D/3D IC. The startup says its tool can maintain full-fidelity accuracy for complex geometries, such as nanometer-scale components on centimeter-scale dies, while speeding up simulation time and reducing compute costs compared to traditional FEA solvers. It also requires no training or customer data to achieve full accuracy. Founded in 2023, it is based in Palo Alto, California, USA.
Ricursive Intelligence launched with a $35.0M seed round led by Sequoia Capital. Ricursive Intelligence is developing AI models to automate all stages of chip design and verification with the goal of shortening development timelines and enabling any company to create custom silicon. The startup is particularly focused on designing AI chips to create a feedback loop between model and design improvements. Funds will be used to scale its AI research, expand its compute infrastructure, and bring its platform to early enterprise. Founded in 2025, it is based in Palo Alto, California, USA.
Quilter raised $25.0M in Series B funding led by Index Ventures. Quilter automates PCB design using physics-driven AI. Trained on the fundamental physics of electromagnetic behavior, thermodynamics, and signal propagation, its tool can generate millions of possible layouts, evaluate them for physical side effects, and learn from that signal to find better solutions. To achieve this, the startup has built its own low-level CAD kernels, high-fidelity physics engines, and reinforcement learning agents that design boards directly from physics evaluations. Founded in 2019, it is based in Los Angeles, California, USA.
ChipAgents raised $21.0M in Series A funding from Bessemer Venture Partners, Micron Ventures, MediaTek, Ericsson, other semiconductor companies, and angel investors. ChipAgents offers an agentic AI chip design environment. By deploying AI agents for EDA workflows, the company says it can provide a 10x boost in RTL design, debugging, and verification productivity. Its chip design environment enables designers to transform concepts into precise design specifications using simple language prompts, analyzes and generates RTL design specs and code, auto-completes Verilog, automates the creation of testbenches, and autonomously verifies and debugs design code through real-time learning from simulations. Funds will support product development, customer acquisition, and strategic industry partnerships. Founded in 2024, it is based in Goleta, California, USA, and has raised $24M to date.
Chipmind launched from stealth with $2.5M in pre-seed funding led by Founderful and joined by angel investors. Chipmind provides AI agents to automate and optimize complex chip design and verification tasks. Built upon each customer’s proprietary, design-specific data, the agents integrate into existing workflows and can understand the entire chip design hierarchy, enabling them to self-adapt to the specific design context and auto-customize for proprietary EDA tools. Funds will be used to accelerate product development and hire. Founded in 2024, it is based in Zurich, Switzerland.
Maieutic Semiconductors added $1.8M to its seed round with funding from Tokyo Edge Capital Partners, Endiya Partners, and Exfinity Venture Partners, bringing the round to $6.0M. Maieutic offers a generative AI copilot for analog chip design. The startup says its AI assistant can accelerate initial design phases, aid in tradeoff analysis, and automate reviews by detecting bugs and inconsistencies. Founded in 2025, it is based in Bengaluru, India.
Substrate raised $100.0M in seed funding from Founders Fund, General Catalyst, Long Journey Ventures, In-Q-Tel, and others. Substrate is building X-ray lithography equipment using particle accelerators, which it claims is comparable to high-NA EUV resolution. Founded in 2022, it is based in San Francisco, California, USA.
Fabric8Labs raised $50.0M in funding led by New Enterprise Associates and Intel Capital, joined by Lam Capital, TDK Ventures, SE Ventures, Marunouchi Innovation Partners, SK hynix, Ericsson Ventures, Masco Ventures, and Toppan Global Venture Partners. Fabric8Labs uses electrochemical additive manufacturing (ECAM) to manufacture thermal management, RF, and power electronics components. ECAM is a room-temperature metal additive manufacturing technology that leverages electroplating principles, water-based metal salt feedstocks, and a microelectrode array printhead composed of millions of individually addressable pixels on the scale of tens of microns. Compatible with any materials that can be electroplated, the startup says the approach allows for micron-scale feature resolution, complex internal features, high-purity materials, and low surface roughness. Funds will be used for capacity expansion, production ramp-up, and hiring. Founded in 2015, it is based in San Diego, California, USA.
Hummink raised €15.0M (~$17.5M) in funding led by KBC Focus Fund, Cap Horn, and Bpifrance, joined by Elaia Partners, Sensinnovat, Beeyond, and EIC Fund. Hummink has developed a high-precision capillary printing (HPCaP) technology that can print metals at the sub-micron scale. The printing method can be used to repair defects in chips and displays, improving overall yield and reducing material waste. The startup is initially targeting OLED displays for smartphones and laptops, with early tests showing a potential yield boost of around 10%. Funds will be used to accelerate the development of an industrial-grade printing module and prepare the technology for full integration inside semiconductor and display fabs. Founded in 2020 based on research from Ecole Normale Supérieure (ENS) and PSL University, it is based in Paris, France.
AlixLabs raised €14.1M (~$16.3M) in Series A funding led by Navigare Ventures, Industrifonden, and FORWARD.one, joined by STOAF and Global Brain. AlixLabs develops atomic layer etch (ALE) processes for semiconductor manufacturing. The company’s atomic layer etch pitch splitting (APS) technology uses ALE to split nanostructures in half by leveraging the properties of the sidewalls of nanoscale features, which act as a topographical mask during etching. The method can create features with critical dimensions below 10nm and a tight pitch on silicon, dielectrics, and other materials like gallium phosphide. It also offers ALE pattern shaping and surface smoothing to selectively remove unwanted material from the surface of semiconductor structures, addressing surface defects, reducing surface roughness, and mitigating line edge roughness. Funds will be used to accelerate beta testing of APS, targeting early manufacturing implementation by 2027. Founded in 2019, it is based in Lund, Sweden.
Delvitech raised $40.0M in Series B funding led by EGS Beteiligungen and Creadd Ventures. Delvitech offers AI-powered automated optical inspection and solder paste inspection systems for PCBs. The inspection systems provide true 3D data using an optical head that combines six cameras, FPGA integration, and four digital projectors. Compatible with SMT and THT, the platform uses neural network training to adapt to specific production lines and supports post-paste, pre-reflow, and post-reflow phases. Founded in 2018, it is based in Rancate, Switzerland.
Galatek raised $30.0M in Series A funding. Galatek offers AI-driven process equipment spanning front-end metrology and inspection to back-end advanced packaging. Integrating vision AI and motion control algorithms, its solutions include fully automated overlay measurement systems, deep learning-based automatic optical inspection (AOI) systems, and precision wafer dicing equipment. The company also offers solutions for the life sciences industry. Founded in 2025, it is based in Singapore.
EuQlid emerged from stealth with $3.0M in funding led by QDNL Participations and joined by Quantonation. EuQlid makes a quantum imaging metrology platform for non-destructive, high-precision mapping of buried current flow inside complex materials and devices. The startup says its approach, which combines quantum diamond magnetometry with advanced signal processing and AI-driven analytics, can provide nano-amp sensitivity for applications including spatial analysis of state-dependent power flows in functioning CPUs and GPUs or the detection and localization of interconnect stacking errors in HBMs.
Ferroelectric Memory Company (FMC) drew €100.0M (~$116.4M) in Series C and public funding led by HV Capital and the DeepTech & Climate Fonds, along with Vsquared Ventures, eCAPITAL, Bosch Ventures, Air Liquide Venture Capital, Merck’s M Ventures, and Verve Ventures. FMC develops persistent memory cells based on ferroelectric thin-film hafnium oxide. Aiming to replace volatile DRAM and SRAM cache memory, the company says its cells improve energy efficiency by minimizing and optimizing the data transfers between compute hierarchies. Target markets range from AI data centers and high-performance databases to edge AI devices and high-temperature industrial/automotive. Funds will accelerate commercialization. Founded in 2016, it is based in Dresden, Germany.
RAAAM Memory Technologies raised $17.5M in Series A funding led by NXP Semiconductors, joined by IAG Capital Partners, EIC Fund, LiFTT, Alumni Ventures, J-Ventures, Silicon Catalyst Ventures, Serpentine Ventures, and others. RAAAM develops an on-chip memory technology called Gain-Cell Random Access Memory (GCRAM) that requires only 3 transistors to store a bit of data. The GCRAM bit-cell utilizes decoupled write and read ports, providing native two-ported operation. Proposed as a drop-in SRAM replacement with higher memory bandwidth and lower area and power consumption, it is manufacturable using a standard CMOS process. Funds will support full qualification in leading-edge process nodes of several foundries. Founded in 2021, it is based in Petach Tikva, Israel, and has raised over $24M to date.
PowerLattice emerged from stealth with $25.0M in Series A funding led by Playground Global and Celesta Capital. PowerLattice offers a power delivery chiplet that integrates voltage regulation directly into the processor package. The micro-IVR architecture combines miniaturized on-die magnetic inductors, an advanced control circuit, a vertical design, and a programmable software layer. The startup says its approach reduces power noise by an order of magnitude, reducing effective compute power needs, creating less interference in high-speed IOs, and extending processor lifetime. It targets AI accelerators, GPUs, and data center processors where compute is limited by power and infrastructure constraints. Founded in 2023, it is based in Vancouver, Washington, USA, and has raised $31M to date.
Vertical Semiconductor raised $11.0M in seed funding led by Playground Global, with participation from JIMCO Technology Fund, Milemark Capital, and Shin-Etsu Chemical. Vertical makes vertical gallium nitride (GaN) transistors that push power conversion closer to the chip with less power loss and heat. Demonstrated on 8-inch wafers, the technology is compatible with standard silicon CMOS semiconductor manufacturing methods and supports devices from 100 volts to 1.2kV. The company plans to start early sampling for its first prototype packaged devices and have a fully integrated solution in 2026. A spin-out from MIT founded in 2024, it is based in Cambridge, Massachusetts, USA.
Skycore Semiconductors raised €5.0M (~$5.8M) in seed funding led by APEX Ventures, with participation from First Momentum Ventures, Mätch VC, and Balnord. Skycore designs switched-capacitor power ICs for high-voltage energy conversion. The startup’s architecture combines ultra-compact power stage and driver ICs with switched-capacitor and hybrid topologies to replace multiple components with a single chip and a few ceramic capacitors. It targets upcoming 800V HVDC data centers and other high-power applications, power modules, ultra-thin laptops, and active battery balancing. Founded in 2021, it is based in Copenhagen, Denmark.
Patentix raised JPY 719.0M (~$4.9M) in Series A funding. Patentix makes r-GeO2 (rutile-type germanium dioxide) epitaxial wafers for power semiconductors. The company says that, as an ultra-wide bandgap material, germanium dioxide’s high breakdown electric field provides stable operation even in high-voltage environments, and it is theoretically predicted that both p-type and n-type doping are possible. It can be manufactured at film deposition temperatures below 1000°C and without a vacuum environment. Funds will support R&D, manufacturing, hiring, and market expansion. Founded in 2022, it is based in Kusatsu, Japan.
NcodiN raised €16.0M (~$18.4M) in seed financing led by MIG Capital, with participation from Maverick Silicon, PhotonVentures, Verve Ventures, Elaia, Earlybird, and OVNI. NcodiN develops optical interposer technology with integrated nanolasers for high-bandwidth communication in multi-chip systems. The startup says its interposer enables ultra-high integration density of more than 10,000 components per cm2. It has demonstrated proof-of-concept nanolasers with energy efficiency below 0.1 pJ/bit, integrated nanodetectors, and full optical links, all on silicon. Funds will support an industrial pilot, R&D, and hiring. Founded in 2023, it is based in Palaiseau, France.
Teradar raised $150.0M in Series B funding led by VXI Capital with participation from IBEX Investors, Capricorn Investment Group, The Engine Ventures, and Lockheed Martin Ventures. Teradar develops solid-state terahertz vision sensor chips for all-weather automotive sensing. The customizable chip architecture includes transmit, receive, and processing elements that can be tailored to meet the range and resolution requirements of specific ADAS or autonomous driving systems. Other potential applications include defense, healthcare, and manufacturing. Founded in 2020, it is based in Boston, Massachusetts, USA.
Axiado Corporation raised over $100.0M in Series C+ funding led by Maverick Silicon with participation from Prosperity7 Ventures, Orbit Venture Partners, Crosslink Capital, Nosterra Ventures, and others. Axiado provides a trusted control/compute unit (TCU) that integrates key infrastructure security and management functions into an SoC. Its platform includes a root-of-trust/cryptography core and AI-driven pre-emptive threat detection engine to detect, quarantine, and protect systems against breaches, vulnerabilities, and attacks as they occur directly in hardware. It also includes dynamic voltage & frequency scaling (DVFS) and a dynamic thermal management solution to predict and adjust the cooling requirements of AI servers. Funds will be used for hiring and development of next-generation platforms. Founded in 2017, it is based in San Jose, California, USA.
Niobium Microsystems raised over $23.0M in seed financing from Fusion Fund, Morgan Creek Capital, Rev1 Ventures, Ohio Innovation Fund, Blockchange Ventures, Analog Devices’ ADVentures, Korea Development Bank, JobsOhio Ventures, Rev1 Angels, and Silicon Catalyst Ventures. Niobium makes hardware accelerators for fully homomorphic encryption (FHE), enabling computation to be performed on encrypted data. With a highly parallelized architecture designed specifically for FHE mathematical algorithms, the chip design eliminates the need for cache-based memory storage and devotes the extra silicon area to ciphertext storage and processing. The PCIe board also includes dedicated hardware for FHE-specific mathematical operations. Funds will be used to accelerate development of a second-generation FHE platform, finalize its production silicon architecture, and begin development of a production ASIC. Founded in 2021 as a spin-out from Galois, it is based in Dayton, Ohio, USA.
Corintis raised $25.0M in Series A1 funding led by Applied Digital. Corintis has developed an in-chip microfluidic cooling system for data centers. It uses micro-scale channels that are tailored to a specific chip to guide coolant to the most critical regions. Designed using the company’s simulation and optimization software and made in its copper microfluidic manufacturing facility, the technology can be supplied as either drop-in replacement cold plates for current liquid cooling systems or co-packaged with a chip. In collaboration with Microsoft, the startup demonstrated that its approach can effectively cool a server running core services. Founded in 2021 based on research conducted at EPFL, it is based in Lausanne, Switzerland.
xMEMS Labs closed a $21.0M Series D round led by Boardman Bay Capital Management, with participation from Cloudview Capital, CDIB-TEN Capital, Harbinger Venture Capital, SIG Asia Investments, and others. xMEMS offers a piezoelectric MEMS fan-on-a-chip thermal management solution and piezoMEMS solid-state silicon speakers. It targets space-constrained devices such as smartwatches, earbuds and headphones, AR glasses, and smartphones. The fan can also be used in SSDs and optical transceivers. Funds will be used to accelerate mass production and commercialization. Founded in 2018, it is based in Santa Clara, California, USA.
| Company | Sector | Amount Raised (M, USD) |
Funding Type | HQ | Month |
|---|---|---|---|---|---|
| Unconventional AI | AI HW | $475.0 | Seed | USA | Dec 2025 |
| d-Matrix | AI HW | $275.0 | Series C | USA | Nov 2025 |
| Tachyum | AI HW | $220.0 | Series C | Slovakia | Oct 2025 |
| Teradar | Sensors | $150.0 | Series B | USA | Nov 2025 |
| Celero Communications | Processors & Network | $140.0 | Series A & B | USA | Nov 2025 |
| Mythic | AI HW | $125.0 | Venture | USA | Dec 2025 |
| Ferroelectric Memory Company (FMC) | Memory & Storage | $116.4 | Series C | Germany | Nov 2025 |
| Axiado Corporation | Security | $100.0 | Series C+ | USA | Dec 2025 |
| Majestic Labs | AI HW | $100.0 | Seed & Series A | Israel | Nov 2025 |
| Neural Concept | EDA Adjacent | $100.0 | Series C | Switzerland | Dec 2025 |
| Quantum Art | Quantum | $100.0 | Series A | Israel | Dec 2025 |
| Substrate | Equipment | $100.0 | Seed | USA | Oct 2025 |
| Nu Quantum | Quantum | $60.0 | Series A | UK | Dec 2025 |
| Fabric8Labs | Manufacturing | $50.0 | Venture | USA | Nov 2025 |
| Vinci | EDA | $46.0 | Seed & Series A | USA | Dec 2025 |
| Zadient Technologies | Materials | $40.3 | Series A | France | Nov 2025 |
| Delvitech | Equipment | $40.0 | Series B | Switzerland | Nov 2025 |
| Movandi | Wireless | $40.0 | Strategic | USA | Oct 2025 |
| Ricursive Intelligence | EDA | $35.0 | Seed | USA | Dec 2025 |
| Dracula Technologies | Ambient Power | $34.8 | Series A | France | Oct 2025 |
| Mixx Technologies | Photonics & Optics | $33.0 | Series A | USA | Dec 2025 |
| Galatek | Equipment | $30.0 | Series A | Singapore | Dec 2025 |
| CyberRidge | Security | $26.0 | Seed | Israel | Oct 2025 |
| VisIC Technologies | Power Semi | $26.0 | Series B | Israel | Dec 2025 |
| Corintis | Thermal Management | $25.0 | Series A+ | Switzerland | Dec 2025 |
| PowerLattice | Power Semi | $25.0 | Series A | USA | Nov 2025 |
| Quilter | EDA | $25.0 | Series B | USA | Oct 2025 |
| NanoXplore | Processors & Network | $23.4 | Venture | France | Dec 2025 |
| Niobium Microsystems | Security | $23.0 | Seed | USA | Dec 2025 |
| ChipAgents | EDA | $21.0 | Series A | USA | Oct 2025 |
| xMEMS Labs | Thermal Management | $21.0 | Series D | USA | Oct 2025 |
| Membrion | Manufacturing | $20.0 | Series B | USA | Oct 2025 |
| PhysicsX | EDA Adjacent | $20.0 | Series B | UK | Nov 2025 |
| NcodiN | Photonics & Optics | $18.4 | Seed | France | Nov 2025 |
| Lucidean | Photonics & Optics | $18.0 | Seed | USA | Dec 2025 |
| Hummink | Equipment | $17.5 | Venture | France | Nov 2025 |
| RAAAM Memory Technologies | Memory & Storage | $17.5 | Series A | Israel | Nov 2025 |
| AlixLabs | Equipment | $16.3 | Series A | Sweden | Nov 2025 |
| C12 Quantum Electronics | Quantum | $16.3 | Grant | France | Dec 2025 |
| SandGrain | Security | $15.7 | Series A | Netherlands | Dec 2025 |
| Kiutra | Quantum | $15.3 | Series A+ | Germany | Oct 2025 |
| Enlightra | Photonics & Optics | $15.0 | Seed | Switzerland | Dec 2025 |
| Pantherun Technologies | Security | $12.0 | Series A | India | Oct 2025 |
| PicoJool | Photonics & Optics | $12.0 | Seed | USA | Nov 2025 |
| QphoX | Quantum | $11.5 | Venture | Netherlands | Nov 2025 |
| Ideaded | Manufacturing | $11.0 | Venture | Spain | Nov 2025 |
| Vertical Semiconductor | Power Semi | $11.0 | Seed | USA | Oct 2025 |
| Altrove | Materials | $10.0 | Seed | France | Oct 2025 |
| OptQC | Quantum | $9.9 | Series A | Japan | Oct 2025 |
| TiHive | Sensors | $9.4 | Venture | France | Oct 2025 |
| Delft Circuits | Quantum | $9.3 | Series A+ | Netherlands | Dec 2025 |
| Isentroniq | Quantum | $8.7 | Pre-Seed | France | Oct 2025 |
| Q.ANT | Photonics & Optics | $8.0 | Series A | Germany | Oct 2025 |
| Sparrow Quantum | Quantum | $7.0 | Series A | Denmark | Dec 2025 |
| PINC Technologies | Photonics & Optics | $6.8 | Seed | USA | Oct 2025 |
| LightSpeed Photonics | Photonics & Optics | $6.5 | Pre-A | Singapore | Nov 2025 |
| Falcomm | Wireless | $5.8 | Seed | USA | Oct 2025 |
| Skycore Semiconductors | Power Semi | $5.8 | Seed | Denmark | Nov 2025 |
| Patentix | Materials | $4.9 | Series A | Japan | Oct 2025 |
| Magics Technologies | AMS | $4.6 | Venture | Belgium | Oct 2025 |
| SPhotonix | Memory & Storage | $4.5 | Pre-Seed | USA | Nov 2025 |
| Morphing Machines | Processors & Network | $4.3 | Series A+ | India | Oct 2025 |
| Cephia | Sensors | $4.0 | Seed | USA | Oct 2025 |
| CCRAFT | Photonics & Optics | $3.1 | Grant | Switzerland | Nov 2025 |
| EuQlid | Equipment | $3.0 | Seed | USA | Nov 2025 |
| Mobius Materials | Manufacturing | $3.0 | Seed | USA | Dec 2025 |
| Random Power | Security | $3.0 | Seed | Italy | Dec 2025 |
| QFX (Quantum Fabrix) | Quantum | $2.7 | Seed | UK | Oct 2025 |
| Chipmind | EDA | $2.5 | Pre-Seed | Switzerland | Oct 2025 |
| Quantum Dice | Quantum | $2.3 | Grant | UK | Dec 2025 |
| Sophrosyne Technologies | Sensors | $2.0 | Seed | India | Nov 2025 |
| Aquark Technologies | Quantum | $1.8 | Grant | UK | Nov 2025 |
| Maieutic Semiconductor | EDA | $1.8 | Seed | India | Oct 2025 |
| Qilimanjaro Quantum Tech | Quantum | $1.2 | Venture | Spain | Nov 2025 |
| Shinephi | Equipment | $1.2 | Seed | Spain | Nov 2025 |
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