tag: test

Enhancing System Observability
By Movellus - 23 Jul, 2026 - Comments: 0

Modern AI SoCs push power delivery networks to their physical limits, yet traditional monitoring leaves a visibility gap. This joint white paper from Siemens EDA and Movellus shows how hardware cross-triggering links Aeonic Insight voltage telemetry with Tessent Embedded Analytics functional monitoring for a single, time-aligned view of what happened and why. To read more, click here. » read more

Innovation First, AI Second: Lessons From SSN And The Future Of Test
By Marc Hutner - 13 Jul, 2026 - Comments: 0

By Marc Hutner and Ron Press Artificial Intelligence is rapidly becoming pervasive in society and across semiconductor development processes. We have to be careful not to apply AI to solve optimizations and challenges of existing methods but pair with engineering innovation for evolutionary results. One example is the application of scan test data in multi-core designs. AI can optimize the d... » read more

From Data Accumulation To Data Activation: AI-Driven Data Feed Forward For Chiplet-Based Test
By Greg Prewitt - 07 Jul, 2026 - Comments: 0

For most of the industry's history, the lever for semiconductor performance gains was process-node scaling. That is no longer the whole story. As one recent industry analysis put it, advanced packaging has now displaced node scaling as the primary lever for performance gains. The consequence reaches well beyond design and assembly; it lands squarely on test. In a monolithic world, test optim... » read more

The Test Cell Ecosystem: From Tester Performance To Production Outcomes
By Denis Kang - 07 Jul, 2026 - Comments: 0

In semiconductor manufacturing, tester performance has traditionally been the focal point of evaluation, encompassing speed, accuracy, and measurement capability. Yet even the most advanced tester depends on something broader to fully realize optimal throughput, yield, and overall equipment efficiency (OEE) in a production environment: the test cell. This distinction is becoming more pronoun... » read more

Multi-die Testing In The Field Must Build On Established Test Methodologies
By Laura Peters - 07 Jul, 2026 - Comments: 0

Key Takeaways:  In-system testing is the very best way to ensure the longevity of data center and automotive hardware. A 2-die monitor, test, and repair strategy requires a modified test strategy and new physical-aware bump repair. Microbumps are too small to probe directly, so sacrificial pads enable probing. The AI revolution is significantly outpacing the IC industry’s... » read more

From Reactive Replacement To Predictive Planning: Unlocking Probe Card Intelligence With Real-Time Data
By Arik Peltz - 07 Jul, 2026 - Comments: 0

Probe cards are among the most critical — and costly — assets in wafer test. Even if production line typically prepares on-demand spares, unexpected failure can cause significant downtime and production loss. One of the most persistent challenges is tip-burn degradation: gradual probe tips wear that ultimately leads to failure. A new technical initiative explores whether DC profiling dat... » read more

Microchip Manufacturing: Understanding The Semiconductor Manufacturing Process
By Jeanine Norlin - 07 Jul, 2026 - Comments: 0

Over the past several decades, the semiconductor industry has experienced sustained growth. Early expansion was driven by the widespread adoption of personal computers, while today demand is fueled by mobile devices, cloud computing, electric vehicles, and advanced connectivity. As these technologies evolve, semiconductor manufacturing must support higher performance, greater device density,... » read more

Scaling Production Test Without Scaling Complexity
By Kwan Wee Lee - 25 Jun, 2026 - Comments: 0

Production test teams often need to balance two competing priorities: improving throughput while keeping test development practical and maintainable. As product volumes increase, parallel testing becomes an attractive option because it allows multiple devices under test (DUTs) to run at the same time. In practice, however, multi-DUT execution can introduce duplicated test logic, instrument cont... » read more

Making On-Chip Photonics Manufacturable
By Gregory Haley - 18 Jun, 2026 - Comments: 0

Key Takeaways: System-level energy and bandwidth pressures are pulling optics into the package faster than the manufacturing flow can mature. Photonics combines front-end fabrication, materials, thermal, cleanliness, and test into one problem that can’t be solved domain by domain. Test is moving upstream because discovering an optical failure after final assembly forfeits every goo... » read more

Effective UX/UI Is A Critical Link Between AI Insights And Yield Improvement
By Keira Lai - 09 Jun, 2026 - Comments: 0

The semiconductor industry is undergoing a fundamental shift in how data is generated, analyzed, and acted upon thanks to the integration of AI into process control flows. As AI becomes more deeply integrated into the manufacturing process, its value is increasingly determined not by data-driven decision making alone, but by how effectively its outputs are delivered, interpreted, and acted upon... » read more

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