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Improving Volume Diagnosis and Debug with Test Failure Clustering and Reorganization


Abstract: "Volume diagnosis and debug play a key role in identifying systematic test failures caused by manufacturing defectivity, design marginalities, and test overkill. However, diagnosis tools often suffer from poor diagnosis resolution. In this paper, we propose techniques to improve diagnosis resolution by test failure clustering and reorganization. The effectiveness of our techniques ... » read more

Reversible Chain Diagnosis


For advanced technologies, the industry is seeing very complicated silicon defect types and defect distribution. One consequence is that scan chain diagnosis becomes more difficult. To improve the resolution of scan chain diagnosis, Tessent Diagnosis can use new scan chain test patterns to leverage a reversible scan chain architecture. This paper describes the novel scan chain architecture t... » read more

Automotive Keyless Entry SoC Test Methodologies And Techniques


By Philip Brock, Louis Benton, Jr., and Jonvyn Wongso Passive Entry Passive Start (PEPS) technology has become standard in the automotive market for keyless operation. A secure wireless communication system, PEPS enables you to lock and unlock the vehicle, and start and stop the vehicle without physically using the key. Electronic functionality embedded in the key fob to interact with the ve... » read more

Total Critical Area For Optimizing Test Patterns


Increasing complexity at advanced nodes makes it much harder to locate defects and latent defects because there is more surface area to cover and much less space between the various components in a leading-edge chip design. Ron Press, technology enablement director at Siemens Digital Industries Software, talks about why it’s so important to predict where defects are most likely to occur in th... » read more

The Everything New Syndrome


Technology is all about the latest features, the fastest processing, with the lowest power. While that sounds great in marketing pitch, any or all of those factors don't necessarily equate to a better product or long-term user satisfaction. There's a reason semiconductor companies are conservative by nature. They want to know that when they spend tens or hundreds of millions of dollars on a ... » read more

Manage Scaling Challenges For Silicon Success


Semiconductor companies are faced with significant challenges related to technology scaling, design scaling, and system scaling. These challenges have a broad impact on design development, manufacturing, and functional operation. This paper discusses the challenges and the specific impact of a Silicon Lifecycle Solutions approach that includes DFT, operations, and Embedded Analytics in enabling... » read more

Inspecting, Testing, And Measuring SiC


Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

One Test Is Not Always Enough


To improve yield, quality, and cost, two separate test parameters can be combined to determine if a part passes or fails. The results gleaned from that approach are more accurate, allowing test and quality engineers to fail parts sooner, detect more test escapes, and ultimately to improve yield and reduce manufacturing costs. New data analytic platforms, combined with better utilization of s... » read more

Don’t Let X Be A Problem For Logic BIST


By Rahul Singhal and Giri Podichetty A failure in the operation of integrated circuits (ICs) or chips deployed in safety-critical applications such as automotive, medical, and aerospace could have catastrophic consequences. These failures could stem from defects in the chip that escaped manufacturing tests or from transient faults that can occur during system operation due to factors such as... » read more

PCB And IC Technologies Meet In The Middle


Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will themselves be mounted on PCBs. But SMT for advanced packages isn’t the same as the SMT we’ve been used to. “Many systems include multiple ASICs, a lot of memory, and that's all integrated i... » read more

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