Integration Hurdles For Analog And RF In Next-Gen Packages


A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package. Since the early 2000s, the majority of chips used at the most advanced nodes were systems-on-chip (SoCs). All features had to fit into a single planar S... » read more

Supporting Multiple Time Domains In SoC Production Test


Complex system-on-chip (SoC) devices make every stage of the development flow harder, and the challenges continue even after the silicon is fabricated. Automatic test equipment (ATE) screening for defective wafers and assembled chips is always challenging. Production test engineers constantly struggle to minimize expensive test pattern memory, test each wafer or chip as quickly as possible, and... » read more

Advancing Product Performance Through Adaptable Production Test Equipment


Semiconductors are the backbone of modern electronics, powering everything from smartphones and laptops to autonomous vehicles and advanced medical equipment. As the semiconductor industry continues to push technological boundaries to deliver faster, smaller, and more powerful devices, ensuring the reliability and optimal performance of these components becomes increasingly challenging. A modu... » read more

Doing More At Functional Test


Experts at the Table: Semiconductor Engineering sat down to discuss the increasing importance of functional test, especially in high-performance computing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center products); Nitza Basoco, tec... » read more

Dealing With AI/ML Uncertainty


Despite their widespread popularity, large language models (LLMs) have several well-known design issues, the most notorious being hallucinations, in which an LLM tries to pass off its statistics-based concoctions as real-world facts. Hallucinations are examples of a fundamental, underlying issue with LLMs. The inner workings of LLMs, as well as other deep neural nets (DNNs), are only partly kno... » read more

PCI Express Test Overview


PCl Express, short for Peripheral Component Interconnect Express, is a high-performance and high-bandwidth serial communication interconnect standard. First proposed by Intel and further developed by the Peripheral Component Interconnect Special Interest Group (PCI-SIG) in replacement of bus-based communication architecture, such as PCI, PCI Extended (PCI-X), and Accelerated Graphics Port (AGP)... » read more

IC Test And Quality Requirements Drive New Collaboration


Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how chips are tested and monitored. At the core of this shift is a growing recognition that no company can do everything, and that to work together will require much tighter integration of flows, met... » read more

Data Acquisition Software: The Brains Behind The Hardware


We have previously talked about how data acquisition systems streamline the testing of various test scenarios. However, the data acquisition (DAQ) hardware is just one-half of the equation. To make the hardware useful for various test scenarios, you need suitable data acquisition software and firmware that can take advantage of that powerful hardware and bridge the gap between your needs and... » read more

Effectively Monitor And Streamline Test Processes Using A DAQ


Manufacturing and field operations generate a high volume of data, and they are also fueling growth in the use of smart remote sensing and the Industrial Internet of Things (IIoT). The data that is generated gives users visibility into their operations in real time or near real time to help them make decisions quickly. Time is a critical factor when high-volume production lines go down, electri... » read more

3D Connection Artifacts In PDN Measurements


Authors: Ethan Koether, Amazon; Kristoffer Skytte, John Phillips, Shirin Farrahi, Cadence; Joseph Hartman, Oracle; Sammy Hindi, Ampere Computing Inc.; Mario Rotigni, STMicroelectronics; Gustavo Blando, Istvan Novak, Samtec From a simulation stand-point, we have covered several important topics that users must consider in detail to get accurate low frequency simulation results. We investigate... » read more

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