Author's Latest Posts


Re-Architecting Die-to-Die IO For AI


By Lakshmi Jain and Wei-Yu Ma As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, conventional die-to-die interconnect technologies—such as SerDes-based links and wide parallel IO—are increasingly becoming limiting factors. These approaches struggle to meet the growing demands for higher bandwidth density and improved energy e... » read more

High-Speed Test IO: Addressing High-Performance Data Transmission And Testing Needs For HPC & AI


By Lakshmi Jain and Wei-Yu Ma The AI and HPC industries are rapidly shifting toward chiplet-based designs to achieve unprecedented levels of performance, as traditional monolithic system-on-chip (SoC) architectures face scaling limitations. This transition is fueled by the rise of heterogeneous integration, which is driving innovation across the semiconductor sector. However, this advancemen... » read more

3DIO IP For Multi-Die Integration


By Lakshmi Jain and Wei-Yu Ma The demand for high performance computing, next-gen servers, and AI accelerators is growing rapidly, increasing the need for faster data processing with expanding workloads. This rising complexity presents two significant challenges: manufacturability and cost. From a manufacturing standpoint, these processing engines are nearing the maximum size that lithogra... » read more