New approaches to preventing counterfeiting across the supply chain.
Rising costs, complexity, and fuzzy delivery schedules are casting a cloud over next-gen lithography.
Challenges range from constant security updates to expected lifetimes that last beyond the companies that made them.
Experts at the Table: The challenges of putting EUV into production, and why DRAM will require advanced litho in the future.
Building together a verification approach for safety and security in automotive chips is complex, multi-faceted, and extremely difficult.
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