Smart Irrigation System Using Periodic Advertisement With Response (PAwR) Feature Of Bluetooth Low Energy

By Advait Kulkarni - 05 Dec, 2024 - Comments: 0

With an ever-growing market of IoT and Industry 4.0 applications, a need for newer features arises to support these applications. The latest Infineon chip CYW20829 boasts a set of new features suitable for a multitude of these IoT applications. These features include Periodic Advertisements with Response (PAwR), low energy long-range (LE-LR), 2M PHY layer, etc. These features offer a novel pe... » read more

Radar vs. PIR: Selecting the Right Solution

By Montassar Ben Romdhane - 07 Nov, 2024 - Comments: 0

As radar technology continues to advance, it offers an increasingly broad range of capabilities, making it a viable alternative to traditional passive infrared (PIR) sensors. With radar's enhanced features, it's essential to reassess whether PIR remains the best choice for your specific application or if radar's advantages can bring greater value. The purpose of this material is to provide a... » read more

Sustainable Rail Transportation With High Power SiC Modules: Part 2

By Diana Car - 10 Oct, 2024 - Comments: 0

In the first part of this blog, we had a look at how energy-efficient high-power modules contribute to the decarbonization of railway transportation. This part will focus on the future of traction: high-power silicon carbide modules, their key features, and the multiple system benefits they enable. Silicon carbide power modules and hybrid-propulsion trains: It’s a match! As we inch toward... » read more

Sustainable Rail Transportation With High Power SiC Modules: Part 1

By Diana Car - 05 Sep, 2024 - Comments: 0

The process of electrification of railways, though crucial for achieving net-zero climate targets, is nevertheless far from being complete. Let's delve into how high-power semiconductor technologies are accelerating the decarbonization of rail transport, making it cleaner, safer, and smarter. Decarbonization of transportation: Unraveling the global picture According to the International Ene... » read more

How To Solve Frequency Jitter In Constant On-Time POLs With A Ripple Injection Circuit

By Tammie Bard - 01 Aug, 2024 - Comments: 0

The purpose of this article is to walk through the steps of implementing a ripple injection circuit for constant on-time POLs. It covers how to connect the circuit and then how to calculate the values used in the circuit. Frequency jitter can be caused by a number of things such as noise injection into the voltage sense lines from outside sources, to very low ripple current in the output ind... » read more

Power Stage Selection Considerations For High-Current Voltage Regulators

By Tammie Bard - 02 Jul, 2024 - Comments: 0

There are several key things to consider when selecting a power stage for high-current voltage regulators: What area does the power stage need to fit in? What is the continuous output current? What is the maximum peak current? This should not exceed the peak current rating of the power stage. What is the power loss for sustained output current? This can be calculated... » read more

Liquid Cooling And GaN: A Winning Combination

By Paul Wiener - 06 Jun, 2024 - Comments: 0

Data centers are facing an unprecedented transformation due to the surge in generative AI and other emerging technologies. A single ChatGPT session consumes 50 to 100 times more energy than a comparable Google search, escalating data center rack power requirements towards 200 kW or more, presenting serious challenges for operators. Cooling, in fact, takes up about 40% of the power requireme... » read more

Optimize Power For RF/μW Hybrid And Digital Phased Arrays

By Kimia Azad - 09 May, 2024 - Comments: 0

Field-programmable gate arrays (FPGAs) are a critical component of both digital and hybrid phased array technology. Powering FPGAs for aerospace and defense applications comes with its own set of challenges, especially because these applications require higher reliability than many industrial or consumer technologies. This blog post will provide a brief history on beamforming and beam-steeri... » read more

Protecting Automotive Power Distribution

By Vasiliki Makantasi - 04 Apr, 2024 - Comments: 0

It was on a warm summer’s evening aboard a cruise boat on one of Austria’s most beautiful lakes that I was co-hosting an Infineon event to conclude a professional experience week for a group of around 50 students from technical high schools in the region. It was time for the final round for us to showcase our creations. Smaller groups of around 10 students went from co-host to co-host, a... » read more

Semiconductors Beyond Nanometers

By Andreas Schumacher - 07 Mar, 2024 - Comments: 0

In today's world, semiconductors are essential components of our everyday lives and the backbone of our economies. From the devices we use to communicate to the machines that power our factories, semiconductors are the building blocks that enable digitalization and decarbonization. However, public and policy debates about semiconductors often focus solely on their smallest feature size, measure... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.