Creating A Modular And Versatile State-of-the-Art Cryptographic Subsystem


As the demand for secure, high-performance silicon continues to grow, chipmakers are seeking cryptographic subsystems that are not only robust and efficient but also adaptable to a wide range of use cases. Whether targeting defense electronics, automotive systems, or industrial IoT, customers are looking for solutions that deliver certified, trusted, and future-proof security capabilities. A... » read more

The Evolution Of eIDAS: Past, Present, And Future


The European Union's journey toward a unified digital identity framework began with the establishment of the Electronic Identification, Authentication, and Trust Services (eIDAS) regulation. Since its inception, eIDAS has aimed to provide a secure and interoperable framework for electronic identification and trust services across the EU. This blog explores the evolution of eIDAS from its initia... » read more

Securing The Road Ahead: MACsec Compliant For Automotive Use


Since the rise of connected and autonomous vehicles, the automotive industry has undergone a significant transformation. Modern vehicles are now equipped with advanced systems that communicate with each other and external infrastructures, enhancing the driving experience. However, this increased connectivity also brings heightened security risks. Unauthorized access to a vehicle’s systems can... » read more

Multimodal AI For IoT Devices Requires A New Class Of MCU


The rise of AI-driven IoT devices is pushing the limits of today’s microcontroller unit (MCU) landscape. While AI-powered perception applications—such as voice, facial recognition, object detection, and gesture control—are becoming essential in everything from smart home devices to industrial automation, the hardware available to support them is not keeping pace. The challenge? The broad ... » read more

How Secure Are Analog Circuits?


The move toward multi-die assemblies and the increasing value of sensor data at the edge are beginning to focus attention and raise questions about security in analog circuits. In most SoC designs today, security is almost entirely a digital concern. Security requirements in digital circuits are well understood, particularly in large data centers and at the upper end of edge computing, which... » read more

Accelerated Assurance For Functional Safety


Today’s electronic systems face unprecedented challenges in ensuring functional safety. As autonomous vehicles navigate our streets, medical devices sustain lives, and industrial automation systems control critical processes, the need for robust safety processes and supporting automation has never been more crucial. The complexity of modern electronic systems, coupled with stringent safety st... » read more

Accelerating Chiplet-Based SoC Design For AI-Defined Vehicles


Today, we are witnessing a paradigm shift towards a more modular design approach that disaggregates SoC functions into various chiplets, each optimized for specific functionalities. Chiplets offer more modularity, which enables product scalability and customization, which is key for AI-defined vehicles, the next generation of software-defined vehicles (SDVs). Cadence’s Helium Virtual and H... » read more

Mobile Chip Challenges In The AI Era


Leading smart phone vendors are struggling to keep pace with the rising compute and power demands of localized generative AI, standard phone functions, and the need to move more data back and forth between handsets and the cloud. In addition to edge functions, such as facial recognition and other on-device apps, phones must accommodate a continuous stream of new communications protocols, and... » read more

AR/VR Glasses Taking Shape With New Chips


More augmented reality (AR), virtual reality (VR), and mixed reality (MR) wearables are coming, but how they are connected, and where image and other data is processed, are still in flux. Ray-Ban Meta AI glasses, for example, look like classic eyeglasses, but they rely on a tethered smart phone for such functions as taking pictures, AI voice assistance, and object identification. In contrast... » read more

A New RF Platform For Silicon MMIC And System Design


Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost. Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable se... » read more

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