ESD Verification For 2.5D And 3D-ICs

By Siemens EDA - 10 Dec, 2024 - Comments: 0

Ensuring your integrated circuit (IC) design can withstand electrostatic discharge (ESD) events without incurring damage or failure is an extremely important activity in IC circuit design and verification. While automated flows for ESD verification are well-established for regular 2D ICs, 2.5D and 3D integration presents new challenges in both ESD design and verification. The new automated ESD ... » read more

Efficient ESD Verification For 2.5/3D Automotive ICs

By Dina Medhat - 09 Dec, 2024 - Comments: 0

Protection against electrostatic discharge (ESD) events is an extremely important aspect of integrated circuit (IC) design and verification, particularly for 2.5/3D designs targeted for automotive systems. ESD events cause severe damage to ICs due to a sudden and unexpected flow of electrical current between two electrically charged objects. This current may be caused by contact, an electrical ... » read more

Auto Chip Aging Accelerates In Hot Climates

By Ed Sperling - 09 Dec, 2024 - Comments: 1

Automotive chips are aging significantly faster than expected in hot climates with sustained high temperatures, raising concerns about the reliability of electrified vehicles over time and whether advanced-node chips are the right choice for safety-critical applications. Many of the most advanced electronics used in vehicles today are ASIL D-compliant, expected to function up to 125° C. But... » read more

Enhancing Compute Security Architecture For New-Age Applications

By Ajay Kapoor - 05 Dec, 2024 - Comments: 0

New-age AI-powered applications are becoming increasingly essential in our daily lives. Continuing to do so requires that these applications and services meet three primary challenges: Achieving high performance for complex compute tasks. Ensuring cost-effectiveness and seamless integration with existing infrastructure. Maintaining robust security and privacy measures. Historicall... » read more

USB4 Sideband Channel Is Not a Side Business

By Neelabh Krishnan - 05 Dec, 2024 - Comments: 0

The USB4 specification has been around for several years now. Two years ago, USB4 version 2.0 was also released by the USB Promoter Group. This specification enables up to 80Gbps link speed per direction in symmetric mode and 120Gbps link speed in asymmetric mode. Be it Gen 2, Gen 3, or Gen 4 link speeds of 20Gbps, 40Gbps, 80Gbps, or 120Gbps, the sideband channel is indispensable for the sta... » read more

The Future Of Technology: Generative AI In China

By Eleanor Brash - 05 Dec, 2024 - Comments: 0

China's investment in Gen-AI is projected to surge with an estimated 86% CAGR over the next five years. This growth is driven by a focus on technological self-sufficiency, from applications to chips, and a strong emphasis on locally developed technology. Key areas of development include: AI Chip Development: Addressing the need for powerful AI infrastructure. Dataset Localization: S... » read more

Advancing AI At The IoT Edge

By Deepak Mital - 05 Dec, 2024 - Comments: 0

In a highly connected world, there is a need for more intelligent and secure computation locally and preferably on the very devices that capture data, whether it be raw or compressed video, images, or voice. End markets continue to expect compute costs to trend down, at a time when computation demands are increasing, as is evident from recently popularized AI paradigms such as large language mo... » read more

Tools Needed To Track, Catalog Hardware Vulnerabilities

By Adam Kovac - 05 Dec, 2024 - Comments: 0

Monitoring for cyberattacks is a key component of hardware-based security, but what happens afterward is equally important. Logging and cataloging identified hardware vulnerabilities to ensure they are not repeated is essential for security. In fact, thousands of weak points have been identified as part of the chip design process, and even posted publicly online. Nevertheless, many companies... » read more

Post-Quantum Cryptography: Safeguarding The Future Of Digital Security

By Dana Neustadter - 05 Dec, 2024 - Comments: 0

As technological advancements surge forward, the specter of quantum computing looms ever larger. While the promise of quantum computers holds the potential to revolutionize fields like weather forecasting, drug discovery, and fundamental physics, it also harbors a significant threat to our current cryptographic systems. The risk is not just a future concern; any sensitive data intercepted today... » read more

Radar, AI, And Increasing Autonomy Are Redefining Auto IC Designs

By Ann Mutschler - 05 Dec, 2024 - Comments: 0

Increasing levels of autonomy in vehicles are fundamentally changing which technologies are chosen, how they are used and interact with each other, and how they will evolve throughout a vehicle's lifetime. Entire vehicle architectures are being reshaped continuously to enable the application of AI across a broad swath of functions, prompting increasing investment into technologies that were ... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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Partitioning In The Chiplet Era

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by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.