中文 English

Author's Latest Posts


Data Management Position: An Automated Approach to Intelligent PCB Design Data Management


The design cycle of electronic devices produces vast amounts of data. From a top-level view, this data can be broken down into basic blocks, including software, circuit board design, mechanical design, and others. These blocks contain extensive and complex information, including the types and amounts of individual data and information files, as well as their hierarchy structure. This data and i... » read more

Advances In EM Analysis And Design Flows For RF System Development


With the move toward higher frequencies and component densities, RF/mixed signal PCB systems and heterogeneous system-in-package (SiP) technologies are increasingly susceptible to delayed product development turnaround times that threaten delivery schedules. These delays often occur late in development during integration when components that met the design specifications fail to achieve the req... » read more

Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards


By Martin James, Gary Dick, and Arif Khan, Cadence with Suhas Pai and Brian Rea, Intel The Compute Express Link™ (CXL™) 2.0 specification, released in 2020, accompanies the latest PCI Express (PCIe) 5.0 specification to provide a path to high-bandwidth, cache-coherent, low-latency transport for many high-bandwidth applications such as artificial intelligence, machine learning, ... » read more

Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications


By Melika Roshandell, Cadence Design overview Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule ef... » read more

RF To mmWave Design For Systems


RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today’s electronic systems often integra... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design


In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

Leveraging Multi-Protocol PHY For PCIe To Cope With SoC Design Complexity


Now in the post-Moore’s Law era, the fast-evolving semiconductor market is continually geared toward higher performance and feature-rich integrated chip (IC) solutions. More functional design blocks integrated with growing interconnections—to not only increase the overall throughput but also expand the I/O connectivity—resulted in a more powerful system on chip (SoC). This increasing comp... » read more

Radar Systems


Combined with advances in phased-array antennas and integration technologies, radars are moving beyond military/aerospace markets to address a host of commercial applications. This white paper showcases how the Cadence AWR Design Environment platform provides designers with a host of modeling and simulation technologies needed to meet the challenges of all types of radar system design. Click h... » read more

Holistic FMEDA-Driven Safety Design And Verification For Analog, Digital, And Mixed-Signal Design


With state-of-the-art electronics propelling the automotive industry into the future, automotive OEMs require safety-certified semiconductors. The integration of these advanced technologies into cars drives a need for component suppliers to assess and audit the risk of the technologies they want to deploy. At the same time, safety requirements are constantly evolving and becoming more stringent... » read more

The Physics Of Ports And Associated Ground For EM Simulators Serving RF Designs


The use of ports in electromagnetic (EM) simulators has evolved and matured over the years to make real-world design simulations practical. Having a foundational understanding of ports provides an intuitive skill in their proper selection and use in conjunction with circuit simulation. In this white paper, we examine ports common to EM simulators, which are the most common simulators for microw... » read more

← Older posts