category: Building The IoE

category: IoT, Security & Automotive

3D-IC Stress Analysis
By Shetha Nolke - 08 Jul, 2025 - Comments: 0

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional density, a smaller footprint and enhanced system performance. However, these same innovations introduce new mechanical stressors within complex assemblies, posing novel reliability risks across the dev... » read more

Accelerated Assurance For Functional Safety
By Jake Wiltgen - 05 Jun, 2025 - Comments: 0

Today’s electronic systems face unprecedented challenges in ensuring functional safety. As autonomous vehicles navigate our streets, medical devices sustain lives, and industrial automation systems control critical processes, the need for robust safety processes and supporting automation has never been more crucial. The complexity of modern electronic systems, coupled with stringent safety st... » read more

Shift-Left Pattern Matching Boosts Automotive IC Quality And Time-To-Market
By John Muirhead - 06 Mar, 2025 - Comments: 0

As the automotive industry races towards a future of connected, autonomous, and electrified vehicles, the complexity of integrated circuits (ICs) powering these innovations is reaching unprecedented levels. Modern automotive ICs incorporate a diverse mix of custom and third-party intellectual property (IP), each with unique performance requirements that must be meticulously verified to ensure f... » read more

Enhancing Reliability For Automotive ICs
By Matthew Hogan - 06 Feb, 2025 - Comments: 0

As an IC designer focused on automotive applications, reliability is likely one of your top priorities. The components you develop need to withstand extreme environmental conditions, maintain performance over extended lifetimes, and meet rigorous industry standards. Failure is simply not an option when it comes to automotive electronics. Achieving the required levels of reliability can be a ... » read more

Tackling Reliability In Early IC Design
By Matthew Hogan - 09 Jan, 2025 - Comments: 0

As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly difficult. Industry analysts predict a significant increase in demand for semiconductor reliability verification as analysis become critical parts of the overall design verification process. The st... » read more

Efficient ESD Verification For 2.5/3D Automotive ICs
By Dina Medhat - 09 Dec, 2024 - Comments: 0

Protection against electrostatic discharge (ESD) events is an extremely important aspect of integrated circuit (IC) design and verification, particularly for 2.5/3D designs targeted for automotive systems. ESD events cause severe damage to ICs due to a sudden and unexpected flow of electrical current between two electrically charged objects. This current may be caused by contact, an electrical ... » read more

Reliability On The Road: Multiphysics Design For Automotive 3D-ICs
By John Ferguson - 07 Nov, 2024 - Comments: 0

Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for diagnostics and entertainment as well as logic associated with advanced sensor technology and automated assist features have quickly become key requirements that drivers rely on every day to ensure ... » read more

CMA/SPDM—An Additional Layer of Security for PCIe Transport
By Suprio Biswas - 10 Oct, 2024 - Comments: 0

In today’s data-driven world, everyone is navigating a vast ocean of information that transcends across unsecured links and can easily fall prey to digital hackers. To keep our data safe, it is crucial to beef up security and make sure that only the right users can access our data. This article dives into the world of secure communication, where component measurement and authentication (CM... » read more

Ensure Reliability In Automotive ICs By Reducing Thermal Effects
By Lee Wang - 05 Aug, 2024 - Comments: 0

In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D assembly offers numerous benefits, including enhanced performance, reduced power consumption, and more efficient use of space. However, this advanced technology also introduces significant thermal di... » read more

Digital Twin And The Implications For Semiconductor Suppliers
By Jake Wiltgen - 02 Jul, 2024 - Comments: 0

Automotive is a prime example of one industry where advanced semiconductors are forcing change across all aspects of vehicle development. Accelerated investment is fueling this industry wide evolution, driven by new business models, environmental regulations, and the evolution toward fully autonomous, software-defined vehicles. The demand for fully and semi-autonomous systems has a particula... » read more

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