category: Building The IoE

category: IoT, Security & Automotive

Efficient ESD Verification For 2.5/3D Automotive ICs
By Dina Medhat - 09 Dec, 2024 - Comments: 0

Protection against electrostatic discharge (ESD) events is an extremely important aspect of integrated circuit (IC) design and verification, particularly for 2.5/3D designs targeted for automotive systems. ESD events cause severe damage to ICs due to a sudden and unexpected flow of electrical current between two electrically charged objects. This current may be caused by contact, an electrical ... » read more

Reliability On The Road: Multiphysics Design For Automotive 3D-ICs
By John Ferguson - 07 Nov, 2024 - Comments: 0

Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for diagnostics and entertainment as well as logic associated with advanced sensor technology and automated assist features have quickly become key requirements that drivers rely on every day to ensure ... » read more

CMA/SPDM—An Additional Layer of Security for PCIe Transport
By Suprio Biswas - 10 Oct, 2024 - Comments: 0

In today’s data-driven world, everyone is navigating a vast ocean of information that transcends across unsecured links and can easily fall prey to digital hackers. To keep our data safe, it is crucial to beef up security and make sure that only the right users can access our data. This article dives into the world of secure communication, where component measurement and authentication (CM... » read more

Ensure Reliability In Automotive ICs By Reducing Thermal Effects
By Lee Wang - 05 Aug, 2024 - Comments: 0

In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D assembly offers numerous benefits, including enhanced performance, reduced power consumption, and more efficient use of space. However, this advanced technology also introduces significant thermal di... » read more

Digital Twin And The Implications For Semiconductor Suppliers
By Jacob Wiltgen - 02 Jul, 2024 - Comments: 0

Automotive is a prime example of one industry where advanced semiconductors are forcing change across all aspects of vehicle development. Accelerated investment is fueling this industry wide evolution, driven by new business models, environmental regulations, and the evolution toward fully autonomous, software-defined vehicles. The demand for fully and semi-autonomous systems has a particula... » read more

Reset Domain Crossing Verification
By Reetika - 13 May, 2024 - Comments: 0

By Reetika and Sulabh Kumar Khare To meet low-power and high-performance requirements, system on chip (SoC) designs are equipped with several asynchronous and soft reset signals. These reset signals help to safeguard software and hardware functional safety as they can be asserted to speedily recover the system onboard to an initial state and clear any pending errors or events. By definiti... » read more

Early Cycle Analysis And Verification Of Logical SEU Mitigation
By Jacob Wiltgen - 04 Apr, 2024 - Comments: 0

The global appetite for data continues to soar, driving innovation across all industry sectors, including how space-based technology can facilitate a more connected world. Miniaturized satellites configured into constellations offer faster communication and higher bandwidth than lone satellites flying higher in geocentric or high-earth orbits. However, industry analysis suggests that to make... » read more

Interoperability And Automation Yield A Scalable And Efficient Safety Workflow
By Ann Keffer - 07 Mar, 2024 - Comments: 0

By Ann Keffer, Arun Gogineni, and James Kim Cars deploying ADAS and AV features rely on complex digital and analog systems to perform critical real-time applications. The large number of faults that need to be tested in these modern automotive designs make performing safety verification using a single technology impractical. Yet, developing an optimized safety methodology with specific f... » read more

Weaving A Digital Thread For Design And Manufacture Of Additive Electronics
By Dave Wiens - 04 Jan, 2024 - Comments: 0

Additive manufacturing has been around electronics since thick-film, screened hybrids came on the scene more than 30 years ago. And while those never quite went away, they never gained the prominence we all expected alongside the more traditional laminated, subtractive-etched PCBs. Today, emerging technologies are bringing a resurgence in additive manufacturing, also known as printed electro... » read more

Advanced DFT And Silicon Bring-Up For AI Chips
By Lee Harrison - 07 Dec, 2023 - Comments: 0

The AI market is growing quickly, spurring an insatiable demand for powerful AI accelerators. AI chip makers are pressed with aggressive time-to-market goals and need the tools to help them get their chips into the hands of customers as quickly as possible. IC test and silicon bring-up are tasks that can affect both the quality and the time-to-market of AI chips. Different companies are usin... » read more

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