category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Innovation First, AI Second: Lessons From SSN And The Future Of Test
By Marc Hutner - 13 Jul, 2026 - Comments: 0

By Marc Hutner and Ron Press Artificial Intelligence is rapidly becoming pervasive in society and across semiconductor development processes. We have to be careful not to apply AI to solve optimizations and challenges of existing methods but pair with engineering innovation for evolutionary results. One example is the application of scan test data in multi-core designs. AI can optimize the d... » read more

Photoluminescence Inspection Is Changing How Manufacturers Protect Yield In SiC And GaN Devices
By Jason Lin - 07 Jul, 2026 - Comments: 0

Electric vehicles, fast-charging infrastructure, renewable energy systems, and industrial power conversion are redefining what power semiconductors need to deliver: higher voltages, higher power densities, faster switching, and longer lifetimes. To meet these demands, manufacturers are increasingly turning to wide-bandgap materials like silicon carbide (SiC) and gallium nitride (GaN). SiC ha... » read more

From Data Accumulation To Data Activation: AI-Driven Data Feed Forward For Chiplet-Based Test
By Greg Prewitt - 07 Jul, 2026 - Comments: 0

For most of the industry's history, the lever for semiconductor performance gains was process-node scaling. That is no longer the whole story. As one recent industry analysis put it, advanced packaging has now displaced node scaling as the primary lever for performance gains. The consequence reaches well beyond design and assembly; it lands squarely on test. In a monolithic world, test optim... » read more

The Test Cell Ecosystem: From Tester Performance To Production Outcomes
By Denis Kang - 07 Jul, 2026 - Comments: 0

In semiconductor manufacturing, tester performance has traditionally been the focal point of evaluation, encompassing speed, accuracy, and measurement capability. Yet even the most advanced tester depends on something broader to fully realize optimal throughput, yield, and overall equipment efficiency (OEE) in a production environment: the test cell. This distinction is becoming more pronoun... » read more

Multi-die Testing In The Field Must Build On Established Test Methodologies
By Laura Peters - 07 Jul, 2026 - Comments: 0

Key Takeaways:  In-system testing is the very best way to ensure the longevity of data center and automotive hardware.  A 2-die monitor, test, and repair strategy requires a modified test strategy and new physical-aware bump repair.  Microbumps are too small to probe directly, so sacrificial pads enable probing.  The AI revolution is significantly outpacing the IC indust... » read more

Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging
By Anne Meixner - 07 Jul, 2026 - Comments: 0

Key Takeaways:  To support AI/HPC devices, high-density fan-out on panels must deliver increased RDL layer count and micropillar height while decreasing the trace and bump/micropillar pitch.   Metrology and inspection steps assist with achieving known-good panel requirements to avoid throwing away expensive chiplets, such as HBM and TPUs.  Optical measurement systems need to acco... » read more

From Reactive Replacement To Predictive Planning: Unlocking Probe Card Intelligence With Real-Time Data
By Arik Peltz - 07 Jul, 2026 - Comments: 0

Probe cards are among the most critical — and costly — assets in wafer test. Even if production line typically prepares on-demand spares, unexpected failure can cause significant downtime and production loss. One of the most persistent challenges is tip-burn degradation: gradual probe tips wear that ultimately leads to failure. A new technical initiative explores whether DC profiling dat... » read more

When The Test Cell Lies
By Gregory Haley - 07 Jul, 2026 - Comments: 0

Key Takeaways:   A marginal test result can be electrically valid and still diagnostically misleading because the socket, load board, and thermal loop are now part of the measurement.   Separating device drift from test-cell drift depends on tracking margins, variance, and calibration trends rather than bins alone.   In advanced packages, a false pass destroys value downstream, ... » read more

Microchip Manufacturing: Understanding The Semiconductor Manufacturing Process
By Jeanine Norlin - 07 Jul, 2026 - Comments: 0

Over the past several decades, the semiconductor industry has experienced sustained growth. Early expansion was driven by the widespread adoption of personal computers, while today demand is fueled by mobile devices, cloud computing, electric vehicles, and advanced connectivity. As these technologies evolve, semiconductor manufacturing must support higher performance, greater device density,... » read more

Unlocking Scalable SRG Waveguides for Mass‑Market AR/MR Displays
By Onto Innovation - 07 Jul, 2026 - Comments: 0

From consumer products to industrial applications, augmented reality (AR)/mixed reality (MR) technology is one of the most innovative interactive technologies on the market today. By overlaying digital information onto the physical world, AR/MR technology improves how people see, understand, and interact with their environment in real time. The industrial applications alone are cause for celebr... » read more

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