The Race To Mass Customization


The number of advanced packaging options continues to rise. The choices now include different materials for interposers, at least a half-dozen fan-outs, not to mention hybrid fan-out/3D stacking, system-in-package, flip-chip and die-to-die bridges. There are several reasons for all of this activity. First, advanced packaging offers big improvements in performance and power that cannot be ac... » read more

Choosing The Right Interconnect


Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

Xcerra’s Stock Buoyed by Busted Deal


The stock chart for XCRA, Xcerra’s common stock traded on the Nasdaq Global Select Market, looks like a hockey stick since late February, when the company called off its acquisition by Chinese investors in the face of opposition by the federal Committee on Foreign Investment in the United States. That busted deal may prove to be a blessing in disguise for Xcerra, which posts impressive financ... » read more

Integrated Software For CompactRIO


Embedded software tools today are fragmented. This forces developers to waste time stitching together IDEs, compilers, debuggers, trace tools, profilers, and other disparate pieces in their toolboxes. Then they have to make these pieces cooperate with each other. Furthermore, these same developers must spend months building, testing, and debugging all the dependencies of an OS, middleware, a bo... » read more

Embedded Die Packaging Emerges


Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

The Problem With Spin-On Carbon Materials


In an integrated circuit manufacturing process, spin-on-carbon (SOC) materials constitute an important layer for the multilayer process to achieve smaller feature size. The SOC layer responds to the photolithography, pattern transformation, substrate planarization, and a variety of other critical processes. A key challenge in selecting a suitable material is that some processes require a hig... » read more

Wireless Test Faces New Challenges


Your mobile phone is far more complex than it was even five years ago, and it’s about to become even more complex with new wireless technologies. That has set off a scramble among test equipment vendors to come up with solutions, methodologies and equipment that is affordable, effective and reliable enough to make sure all of this technology works as planned—and that it continues to work th... » read more

Functional Safety In AI-Controlled Vehicles


Whereas ISO 26262 specifies requirements for eliminating safety hazards in the presence of an E/E system fault, this paper explains why new standards for the AI era must address so-called safety of the intended functionality (SOTIF), which means helping to validate that advanced automotive functionalities are engineered into the vehicle to avoid safety hazards even in the absence of a fault. ... » read more

Is Advanced Packaging The Next SoC?


Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

Xcerra: Back to the Drawing Board


It’s been nearly two weeks since Xcerra and Hubei Xinyan Equity Investment Partnership announced they have terminated their merger agreement in the face of apparent opposition by the Committee on Foreign Investment in the United States, the federal interagency panel that reviews transactions for their impacts on national security. Xcerra and Hubei Xinyan also withdrew their CFIUS application.... » read more

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