Advanced Packaging Still Not So Simple


The promise of advanced packaging comes in multiple areas, but no single packaging approach addresses all of them. This is why there is still no clear winner in the packaging world. There are clear performance benefits, because the distance between two chips in a package can be significantly shorter than the distance that signals have to travel from one side of a die to another. Moreover, wi... » read more

2017: A Good Year for ATE


The rising revenue enjoyed by automatic test equipment vendors in 2017 translated into soaring stock prices for some publicly held companies. The Dow Jones Industrial Average was up 25% for 2017. Advantest’s shares traded on the Tokyo Stock Exchange had a 2017 low of 1,787 yen (about $15.85 at the year-end currency exchange rate) and a 52-week high of 2,698 yen ($23.92), up 51% from the... » read more

Packaging Challenges For 2018


The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Fan-Out Wafer Level eWLB Technology As An Advanced System-In-Package Solution


System-in-Package (SiP) technology continues to be essential for higher integration of functional blocks to meet the ever demanding market needs with respect to smaller form factor, lower cost and time to market. A typical SiP incorporates all or some form of Fan-Out Wafer Level packaging, wire bonding or flip chip that serves a multitude of applications such as optoelectronics, RF, power ampli... » read more

Auto Chip Test Issues Grow


By Jeff Dorsch & Ed Sperling Semiconductor suppliers are flocking to the automotive chip market to gain share in fitting out the connected car and the autonomous vehicle. But before those chips are sold to automotive manufacturers and Tier 1 suppliers, they must be tested and certified to meet stringent industry standards. This is no ordinary testing, though. Assisted and autonomous v... » read more

Grounding Considerations For Improved Measurements


Learn how grounding can determine how a measurement system should be connected for the most accurate measurements. Article topics include grounded signal sources, floating signal sources, differential measurements, single-ended measurements, and the proper signal and measurement configuration. This tutorial is part of the Instrument Fundamentals series. To read more, click here. » read more

Getting Serious About Chiplets


Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

The Quantum Man Effect


Recently I saw an art exhibit by one of my favorite artists, Julian Voss-Andreae, a German-born sculptor now living and working in Portland, Oregon. In addition to sculpting, he has studied physics, mathematics and philosophy. His background in science has informed and influenced his career in the arts, leading to his creation of pieces such as protein sculptures, based on frames of a protein f... » read more

Tessent MissionMode: New Inline DFT Technology


Written for automotive OEMs and suppliers, this whitepaper gives an overview of design-for-test (DFT) technology. Among the topics addressed: Why is DFT important in IC design generally and critical for creating automotive ICs in particular? And how does the new Tessent MissionMode technology, teamed with some of Mentor’s other DFT offerings, pave the way for the automotive industry to develo... » read more

How To Deal With The Flood Of Analog Data


Analog data from a variety of sensors and other devices is a huge problem. Here are three approaches to overcoming the problems that big analog data can cause. Approach 1: Analyze at the Edge A lot of data can be collected at the point of capture, but most of it’s uninteresting. You can save and analyze it all or you can take advantage of intelligent embedded software that constantly meas... » read more

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