category: Test, Measurement and Analytics

category: IoT, Security & Automotive

IC Test And Quality Requirements Drive New Collaboration
By Laura Peters - 09 Apr, 2024 - Comments: 0

Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how chips are tested and monitored. At the core of this shift is a growing recognition that no company can do everything, and that to work together will require much tighter integration of flows, met... » read more

Progress In Wafer And Package Level Defect Inspection
By Anne Meixner - 09 Apr, 2024 - Comments: 0

The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex manufacturing processes. In both wafer and assembly manufacturing, engineering teams have long relied on imaging tools to measure critical features and to inspect for defects after specific pr... » read more

New Strategies For Interpreting Data Variability
By Gregory Haley - 09 Apr, 2024 - Comments: 0

Every measurement counts at the nanoscopic scale of modern semiconductor processes, but with each new process node the number of measurements and the need for accuracy escalate dramatically. Petabytes of new data are being generated and used in every aspect of the manufacturing process for informed decision-making, process optimization, and the continuous pursuit of quality and yield. Most f... » read more

Using Automatic Defect Classification To Reduce The Escape Rate Of Defects
By Bryce Chi - 09 Apr, 2024 - Comments: 0

Automated optical inspection (AOI) is a cornerstone in semiconductor manufacturing, assembly and testing facilities, and as such, it plays a crucial role in yield management and process control. Traditionally, AOI generates millions of defect images, all of which are manually reviewed by operators. This process is not only time-consuming but error prone due to human involvement and fatigue, whi... » read more

Reimagining PVT Monitoring IP For Advanced Node GAA Process
By Rohan Bhatnagar - 09 Apr, 2024 - Comments: 0

As process technology continues to evolve, so must design tools and the IP that support them. One example of an industry evolution is on the PVT monitoring IP side. The process, voltage, and temperature (PVT) monitors embedded within chips provide feedback on silicon status at every stage of the lifecycle, including mission use in the field. The data gathered from the monitors enables benefits ... » read more

The Need For Speed: Wi-Fi 7 And The Era Of Ultra-Fast Internet
By Alejandro Escobar Calderon - 09 Apr, 2024 - Comments: 0

The exponential growth of data consumption and the proliferation of connected devices have driven the need for the development of Wi-Fi 7. With the increasing demand for high-speed internet access, especially in bandwidth-intensive applications such as streaming, gaming, and virtual reality, existing wireless standards have become inadequate to meet the evolving needs of users. Wi-Fi 7 addresse... » read more

Fabrication Of Vertical-Taper Structures For Silicon Photonic Devices By Using Local-Thickness-Thinning Process
By Advantest - 09 Apr, 2024 - Comments: 0

Authors: Shunsuke Abe, Hideo Hara, Shin Masuda, and Hirohito Yamada. This paper describes a simple fabrication process of verticaltaper structures which can locally tune the thickness of silicon photonic devices. For low-loss spot-size conversion, taper angles less than 10° are required. To fabricate the gradual-slope shape of the vertical tapers, we have developed a step-andexposure lithog... » read more

Non-Destructive Metrology Techniques For Measuring Hole Profile In DRAM Storage Node
By Onto Innovation - 09 Apr, 2024 - Comments: 0

DRAM storage node profile measurement during high aspect ratio (HAR) etch has been one of the most challenging metrology steps. DRAM storage node profile affects refresh time and device electric quality. So, controlling this profile is one of the key challenges. Conventional 3D modeling in Optical Critical Dimension (OCD) metrology has typically used multiple cylinder stacks. This method cannot... » read more

Cost And Quality Of Chiplets
By Ed Sperling - 19 Mar, 2024 - Comments: 0

Chiplets add a whole new challenge for the semiconductor industry. How much testing is enough? How do you optimize system binning? What’s the right amount of burn-in? The answers to these questions will vary, depending upon cost and quality tradeoffs, the number and source of the chiplets, and real-world workloads and projected lifespans. Marc Jacobs, senior director of solutions architectur... » read more

Using Picosecond Ultrasonics To Measure Trench Structures In SiC Power Devices
By Nick Keller - 12 Mar, 2024 - Comments: 0

The road to the future is not always a smooth, trouble-free drive. Along the way, there may be unforeseen detours, potholes and accidents, each one capable of setting progress back. But for those behind the wheel, those obstacles are just a part of the journey. Such is the case for the automotive industry as it continues to steer away from gas-powered vehicles and turn toward hybrid and elec... » read more

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