category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Moving Defect Detection And Classification To The Edge
By Ed Sperling - 29 May, 2026 - Comments: 0

The number of defects detected through inspection is exploding at each new process node. There are now millions of defects being identified on each wafer, but only a fraction of those can cause problems. Prasad Bachiraju, senior director of business development at Onto Innovation, talks about the different types of images being captured using different illumination modes at different touch poin... » read more

What’s Really Needed For Advanced Test?
By Greg Prewitt - 12 May, 2026 - Comments: 0

By Greg Prewitt and Marc Jacobs Advanced test has become one of the semiconductor industry's most promising frontiers: adaptive binning, feed-forward models, and real-time analytics pulling signals from mountains of measurement data. But there is a problem hiding underneath all that ambition, and it is neither compute nor algorithm; it is data. More specifically, it is the unglamorous, found... » read more

The Specialty Device Surge Part 3: Solving The Process Control Challenges Of MEMS, Photonics, Co-Packaged Optics, And More
By Christopher Haire - 12 May, 2026 - Comments: 0

Every day, consumers rely on an invisible network of specialty semiconductor devices without realizing it. The smartphone in your pocket is a good place to start. It knows when you rotate the screen thanks to MEMS sensors, and its camera delivers crisp images through advanced CMOS image sensors. Meanwhile, fast charging technology, wireless connectivity, facial recognition, and high-frequency c... » read more

Complete End-To-End Closed-Loop Product Yield Ramp And Learning
By Guy Cortez - 12 May, 2026 - Comments: 0

By Guy Cortez and Maheshwaran Jothi Yield ramp has always been a concern in semiconductor manufacturing: systems companies need confidence that devices meet quality targets before shipment, and chipmakers need to reach yield entitlement quickly to control cost and supply. While this has never been easy, advanced nodes are raising the bar again. First, designs are larger and more heterogen... » read more

Test Distribution Evolves To Meet AI Challenges
By Fabio Pizza - 12 May, 2026 - Comments: 0

The proliferation of artificial intelligence (AI) is driving rapid acceleration of the semiconductor market, which analysts now predict will reach $1 trillion this year. Many semiconductor devices will be the GPUs that populate the data centers that run AI workloads. Driven by strong, sustained investments from hyperscaler operators, high-performance computing (HPC)/AI data centers are expected... » read more

Ensuring AI Reliability: Mitigating Silent Data Corruption Risks
By Noam Brousard - 12 May, 2026 - Comments: 0

Silent Data Corruption (SDC) is an industry challenge affecting data centers worldwide with increasing frequency. This phenomenon stems from untraceable hardware failures that make detection notoriously difficult. SDCs don’t leave any record in system logs or trigger exception mechanisms. The corrupted data they produce can propagate unnoticed, causing cascading failures that often demand ext... » read more

AI Accelerator Testing Depends On DFT Innovations
By Laura Peters - 12 May, 2026 - Comments: 0

Key Takeaways: I/O and lane repair capabilities are becoming critical to improving yield. System-level testing catches marginal defects and rare defects such as silent data corruption errors. Synopsys and TSMC developed a multi-die demo vehicle capable of full test, monitor, debug, and repair capability across the system’s lifecycle. The proliferation of accelerators in AI... » read more

Advanced Metrology for Backside Metallization Using Picosecond Laser Ultrasonics
By Onto Innovation - 12 May, 2026 - Comments: 0

Picosecond Ultrasonics (PULSE) Technology has emerged as a leading metrology solution for characterizing single-layer and multilayer metal films in advanced semiconductor manufacturing [1]. As a non-contact, non-destructive technique, PULSE Technology has become the tool-of-record across multiple device segments, including logic, radio frequency (RF), memory, microelectromechanical systems (MEM... » read more

The AI Server Challenge: Testing Power At Scale
By Aik-Moh Ng - 12 May, 2026 - Comments: 0

Artificial intelligence is most often framed as a story of compute advancements. Faster GPUs, denser accelerators, and advanced process nodes. But behind every AI workload, the most fundamental constraint is power. Fig. 1: AI server market. Source: Grand View Research As AI servers scale to meet data center demand, power delivery is becoming one of the most critical and complex engine... » read more

Home Win: Challenging The Traditional Semiconductor Manufacturing Model
By Chris Rand - 12 May, 2026 - Comments: 0

Across Europe, many of us have grown accustomed to a model where semiconductor products, subassemblies and components are sourced from the Far East almost by default. The rationale has always been clear: significantly lower labor and manufacturing costs made offshore supply the most commercially viable option. Yet, while this approach has long been convenient, it has never been without compromi... » read more

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