Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP


Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, mobile and AI will all use this technology. According to Yole Développement’s analysis, the fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014,... » read more

Silicon Lifecycle Management


How do you track, measure and ensure reliability over the lifetime of a chip, regardless of how or where it is used? Steve Pateras, senior director of marketing for test products at Synopsys, drills down into the impact of hardware-software co-design, over-the-air updates, the expected lifetime of designs, and how the various monitors and sensors are used to track environmental, structural and ... » read more

Making IC Test Faster And More Accessible: Part 2


Recently, my colleague Robert Ruiz described a new approach to scan test that utilizes the high-speed I/O (HSIO) ports that exist on most chips. The benefits of this new approach include reduced test time and cost thanks to the high-speed interface. Simplified pin electronics and tester setup are also benefits, as is the ability to run manufacturing tests in the field in support of silicon life... » read more

Selective Redundancy In Cars


The automotive industry has been fish-tailing its way through design strategies and electronics architectures, but it finally appears to be honing in on a strategy that actually might work. This doesn't mean fully autonomous vehicles will take over the road anytime soon, but at least it points carmakers in the right direction. The auto industry has been in panic mode ever since Tesla, Waymo,... » read more

Lower Process Nodes Drive Timing Signoff Software Evolution


A dramatic rise in design complexity has led to a slew of new signoff challenges that impact the ability to predictably meet PPA targets. Smaller technology nodes and larger design sizes have caused the number of corners and modes to grow exponentially leading to much longer turnaround times for timing signoff. Moreover, larger design sizes demand huge compute resources for timing signoff. I... » read more

Adaptive Test Gains Ground


Not all devices get tested the same way anymore, and that’s a good thing. Quality, test costs, and yield have motivated product engineers to adopt test processes that fall under the umbrella of adaptive test, which uses test data to modify a subsequent test process. But to execute such techniques requires logistics that support analysis of data, as well as enabling changes to a test based ... » read more

Does HW Vs. SW Choice Affect Quality And Reliability?


Electronic systems comprise both hardware and software. Which functions are implemented with hardware and which with software are decisions made based upon a wide variety of considerations, including concerns about quality and reliability. Hardware may intrinsically provide for higher device quality, but it is also the source of reliability concerns. This is in contrast with popular views of... » read more

High Throughput Noise Measurements


Flicker noise and random telegraph noise (RTN) testing can take a long time, especially when measuring down to frequencies of 1 Hz or below. Sweep times up to 30 min at a single temperature are common. And standard data collection for device models requires DUT data at multiple temperatures on small pads. To lower Cost of Test (CoT), and significantly increase on-wafer test throughput, a... » read more

Industry 4.0 And The Rise Of QPaaS


McKinsey & Company frames this shift as a matter of moving the industry from its current approach of “firefighting” – responding to failures and vulnerabilities after they’re brought to OEMs’ attention – toward proactively preventing such episodes in the first place. How can the industry achieve this objective? By embracing quality protection as a service (QPaaS) — an approach... » read more

Benefits Of Outsourcing Yield Management Software


Microchip is a longtime yieldHUB customer. We work with a number of divisions worldwide. We spoke to Kasia Metlička-Sawicka, an Engineering Release Supervisor, Senior Engineer II-Product in Microchip Ireland to find out why she likes using our system. What do you do? I’m an Engineering Release supervisor/Senior Product Engineer. I oversee the engineering release group of technicians... » read more

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