category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

AI data Center Providers Seek Power and Bandwidth Promise in CPO
By Teradyne - 07 Apr, 2026 - Comments: 0

Co-packaged optics (CPO), a high-speed networking technology that integrates optical components (lasers, photodetectors) directly with switch/compute chips (ASICs) in the same package, continues to show promise. Advocates of CPO maintain that it reduces power consumption by over 80% and increases bandwidth density by shortening electrical traces to millimeters. Used primarily in data cente... » read more

What’s Failing At The Interface
By Gregory Haley - 07 Apr, 2026 - Comments: 0

Key Takeaways The interface is where failures in advanced packaging become visible, but it's increasingly not where they originate. Weak interfaces often don't fail at time zero, but they do degrade due to parametric drift and margin erosion that binary test screens miss entirely. The temporary test interconnect is the largest variable in the measurement chain and must be controlled ... » read more

Mid-infrared Ellipsometry For Optical Critical Dimension Metrology
By Onto Innovation - 07 Apr, 2026 - Comments: 0

Abstract "Mid-infrared ellipsometry offers a powerful approach for non-destructive optical critical dimension (OCD) metrology in advanced semiconductor manufacturing. This technique supports in-line measurements of high aspect ratio structures, such as those found in 3D NAND memory devices. The incorporation of quantum cascade lasers and fast phase modulation allows rapid acquisition of Muel... » read more

AI Accelerators Usher In New Era For IC Test
By Laura Peters - 07 Apr, 2026 - Comments: 0

Key Takeaways The parallelism in AI accelerators enables low latency but complicates failure isolation. HBM can account for 50% of package cost, so known-good stack assurance is critical. DFT and test cooperate to solve final test, singulated die test, SLT, and in-system test for data centers. AI accelerators are used for everything from training large language models to mak... » read more

Untrusted Analog Components Add Risks For Critical Infrastructure
By Anne Meixner - 07 Apr, 2026 - Comments: 0

Key Takeaways New certificate-based solutions are necessary within fabs and packaging houses to deliver trusted semiconductors. Physical IDs bind the device to the certificate, but it needs to be immutable and unclonable. Extrinsic IDs are required for analog, mixed-signal, sensor ICs as well as discrete components. Rising concern over the source and destination of chips, an... » read more

Platform-Led AI Analytics for the Semiconductor Ecosystem
By PDF Solutions - 07 Apr, 2026 - Comments: 0

Abstract: Semiconductor manufacturers face a mounting data crisis: modern fabrication facilities generate petabytes of complex, siloed data, yet less than 5% of it is typically used in analytics. Traditional business intelligence tools lack the scalability to handle datasets with millions of parameters, leaving critical yield and quality insights untapped. In this presentation we outline a c... » read more

Harnessing Digital Twins And AI/ML For Smarter Semiconductor Test Optimization
By Vincent Chu - 07 Apr, 2026 - Comments: 0

As semiconductor devices become increasingly complex, the challenge of testing them efficiently and accurately grows in parallel. Traditional testing methods—rooted in static test plans—often fall short in dealing with the nuances of today's advanced integrated circuits (ICs), especially in high-volume manufacturing environments. In response, the industry is exploring real-time, data-dri... » read more

Human-Centered Agentic AI Workflows For RTL Verification
By Siemens EDA - 17 Mar, 2026 - Comments: 0

Productivity challenges in modern semiconductor development stem less from individual tool limitations and more from process-level complexity across design creation, verification, and iteration. Agentic EDA addresses this shift by embedding intelligence directly into workflows that span creation and validation. The Questa One Agentic Toolkit extends the Questa One solution with human-centere... » read more

Improving Yield Through Shared Data
By Ed Sperling - 11 Mar, 2026 - Comments: 0

Increasing complexity due to advanced packaging, multi-die assemblies, and more devices under test is having an impact on yield, which in turn slows time to market and impacts overall chip costs. What's needed is a way to share data that previously was siloed by chipmakers, fabs, and OSATs. Jayant D'Souza, technical product director at Siemens EDA, talks about the underlying drivers for sharing... » read more

The Specialty Device Surge, Part 1: Wafer Size Transitions Are Powering The Future Of Specialty Devices And Bringing New Challenges
By Christopher Haire - 10 Mar, 2026 - Comments: 0

Specialty devices are the unsung heroes of modern life. For many in the semiconductor industry today, the spotlight is on the SiC and GaN power devices used in automotive, green energy, fast-charge consumer electronics (CE), and high-performance computing (HPC) applications (Figures 1 and 2). However, specialty devices are more than just power devices. They are a broad class of semiconductor... » read more

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