Engineering considerations in multi-chiplet designs.
Systems companies and leading-edge chipmakers are pushing past reticle limits with chiplet-based designs, often breaking compute-intensive functions into different chiplets and coupling those with other chiplets that may have been developed by different teams and at different process nodes. This is harder than it sounds, and results can vary widely even under the best circumstances. Nir Sever, senior director of business development at proteanTecs, talks about the complexities of moving data between different types of chiplets, what kinds of physical effects engineering teams need to consider when placing chiplets next to other chiplets, and how to balance performance and power across chiplets before they are packaged together to ensure the whole package remains reliable throughout its expected lifetime.
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