X-ray Inspection Becoming Essential In Advanced Packaging


X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected throughout their lifecycles. A single defect in a chiplet or interconnect can transform a complex advanced package into expensive scrap, and the risk only increases as the chip industry shifts from homog... » read more

Controlling Warpage In Advanced Packages


Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Warpage plays a critical role in determining whether an advanced package can be assembled successfully and meet long-term reliability targets. New advances, such as molding compounds with impro... » read more

Promises And Pitfalls Of SoC Restructuring


As chips become more complex and increasingly heterogeneous, it's becoming more difficult to keep track of different methodologies, tools, and blend data from different sources to create a chip. Tim Schneider, staff application engineer at Arteris, explains why IP-XACT has become so critical, why it took so long to gain a solid foothold in chip design, and how the new IP-XACT standard interface... » read more

Integration Hurdles For Analog And RF In Next-Gen Packages


A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package. Since the early 2000s, the majority of chips used at the most advanced nodes were systems-on-chip (SoCs). All features had to fit into a single planar S... » read more

Secure Movement Of Data In Test


Historically, test data flowed out of the tester and was loaded into a file. But with heterogeneous integration, including chiplets and IP from multiple vendors, test data is now being streamed across the manufacturing floor where it can be used to make real-time decisions. Eli Roth, product manager for smart manufacturing at Teradyne, talks with Semiconductor Engineering about challenges in da... » read more

Challenges With Chiplets And Power Delivery


Chiplets hold the potential to deliver the same PPA benefits as an SoC, but with many more features and options that are possible on a reticle-constrained die. If chiplets live up to the hype, they will deliver what is essentially mass customization, democratizing and speeding the delivery of complex chips across a broad array of markets. Today, the focus has been on die-to-die interfaces, but ... » read more

Chiplet Hardware Security Module To Mitigate Security Vulnerabilities In SiP Systems (Univ. of Florida)


A new technical paper titled "Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration" was published by researchers at University of Florida (Gainesville). Abstract: "The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified syst... » read more

Interconnects Essential To Heterogeneous Integration


Designing and manufacturing interconnects is becoming more complex, and more critical to device reliability, as the chip industry shifts from monolithic planar dies to collections of chips and chiplets in a package. What was once as simple as laying down a copper trace has evolved into tens of thousands of microbumps, hybrid bonds, through-silicon vias (TSVs), and even junctions for optical ... » read more

Security Is Critical For Commercial Chiplets


Experts at the Table: Semiconductor Engineering sat down to talk about the security issues and requirements in commercial chiplet ecosystem, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA prod... » read more

Chiplet IP Standards Are Just The Beginning


Experts at the Table: Semiconductor Engineering sat down to talk about chiplet standards, interoperability, and the need for highly customized AI chiplets, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen S... » read more

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