How Chips Age


Andre Lange, group manager for quality and reliability at Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about circuit aging, whether current methods of predicting reliability are accurate for chips developed at advanced process nodes, and where additional research is needed. » read more

Things That Go Bump In The Daytime


There is no argument that autonomous technology is better at certain things than systems controlled by people. A computer-guided system has only one mission — to stay on the road, avoid object, and reach the end destination. It doesn't get tired, text, or look out the window. And it can park within a millimeter of a wall or another vehicle without hitting it, and do that every time — as lon... » read more

Making 3D Structures And Packages More Reliable


The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

Extreme Quality Semiconductor Manufacturing, Part 1: Automotive


By Ben Tsai and Cathy Perry Sullivan Across the full range of semiconductor device types and design nodes, there is a drive to produce chips with significantly higher quality. Automotive, IoT and other industrial applications require chips that achieve very high reliability over a long period of time, and some of these chips must maintain reliable performance while operating in an environmen... » read more

Big Growth Areas: Connectivity, AI, Reliability


Connectivity and artificial intelligence (AI) will be the biggest drivers for 2020, with an emphasis on improved reliability across all areas. New standards, new applications, and new pressures being placed on old technology will created boundless opportunities for those ready to fill the need. Of course, there will also be a lot of carnage along the way, and we can expect to see a lot of that ... » read more

Configurable, Easy-To-Use, Packaged Reliability Checks


Using a packaged checks flow lets designers quickly select, configure and run custom reliability checks and check combinations to help design companies achieve today’s demanding time-to-market schedules while ensuring product reliability. To read more, click here. » read more

Scaling, Packaging, And Partitioning


Prior to the finFET era, most chipmakers either focused on shrinking or packaging, but they rarely did both. Going forward, the two will be inseparable, and that will lead to big challenges with partitioning of data and processing. The key driver here, of course, is that device scaling no longer provides appreciable benefits in power, performance and cost. Nevertheless, scaling does provide ... » read more

Testing Autonomous Vehicles


Jeff Phillips, head of automotive marketing at National Instruments, talks about how to ensure that automotive systems are reliable and safe, how test needs to shift to adapt to continual updates and changes, and why this is particularly challenging in a world where there is no known right answer. » read more

How To Ensure Reliability


Michael Schuldenfrei, corporate technology fellow at OptimalPlus, talks about how to measure quality, why it’s essential to understand all of the possible variables in the testing process, and why outliers are no longer considered sufficient to ensure reliability. » read more

Reliability At 5nm And Below


The best way to figure out how a chip or package will age is to bake it in an oven, heat it in a pressure cooker, and stick it in a freezer. Those are all standard methods to accelerate physical effects and the effects of aging, but it's not clear they will continue working as chips shrink to 5nm and 3nm, or as they are included in multi-die packages. Extending any of those kitchen-like appr... » read more

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