Reliability Over Time And Space


The demand for known good die is well understood as multi-chip packages are used in safety-critical and mission-critical applications, but that alone isn't sufficient. As chips are swapped in and out of packages to customize them for specific applications, it will be the entire module that needs to be verified, simulated and tested, and analyzed. This is more complicated than it sounds for s... » read more

Demand Grows For Reducing PCB Defects


Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This represents a significant shift from the past, where concerns about reliability primarily targeted the devices connected to printed circuit boards. But as SoCs become disaggregated into advanced packages... » read more

Scramble For The White Space


Chipmakers are pushing to utilize more of the unused portion of a design for different functions, reducing margin in the rest of the chip to more clearly define that white space. White space typically is used to relieve back-end routing congestion before all of the silicon area is used up. But a significant amount of space still remain unused. That provides an opportunity for inserting monit... » read more

The Quest To Make 5G Systems Reliable


Semiconductor Engineering sat down to discuss 5G reliability with Anthony Lord, director of RF product marketing at FormFactor; Noam Brousard, system vice president at proteanTecs; Andre van de Geijn, business development manager at yieldHUB; and David Hall, head of semiconductor marketing at National Instruments. What follows are excerpts of that conversation. SE: How do we measure the reli... » read more

Sensor Fusion Challenges In Cars


The automotive industry is zeroing in on sensor fusion as the best option for dealing with the complexity and reliability needed for increasingly autonomous vehicles, setting the stage for yet another shift in how data from multiple devices is managed and utilized inside a vehicle. The move toward greater autonomy has proved significantly more complicated than anyone expected at first. There... » read more

Security At The Edge


Semiconductor Engineering sat down to discuss security at the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus, Kris Ardis, executive director at Maxim Integrated; and Steve Roddy, vice president of Arm's Products Learning Group. What follows are excerpts of that conversation. To view part one of this discussion, click here. Part two i... » read more

Are Chips Getting More Reliable?


The semiconductor industry is making huge progress in understanding the causes and telltale signs of circuit aging and irregular behavior. But are devices actually getting more reliable? The answer depends on a number of factors, none of which is easily measured. To be sure, circuits are much better designed and inspected than in the past, and the individual components are printed more accur... » read more

Finding Defects With E-Beam Inspection


Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these new e-beam inspection systems. One is a more traditional approach, which uses a single-beam e-beam system. Others, meanwhile, are developing newer multi-beam technology. Both approaches have thei... » read more

Mission Profiles In The Automotive Development Process


The automotive industry's roadmap for the coming years is e-mobility and autonomous driving. Its implementation is likely to bring about changes on a par with the invention of the automobile itself. While the motor vehicle used to be primarily a mechanical product, it is now an entirely electronic system. Many of the new functions increase the safety of the driver and other road users, and t... » read more

Preparing For A Barrage Of Physical Effects


Advancements in 3D transistors and packaging continue to enable better power and performance in a given footprint, but they also require more attention to physical effects stemming from both increased density and vertical stacking. Even in planar chips developed at 3nm, it will be more difficult to build both thin and thick oxide devices, which will have an impact on everything from power to... » read more

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