AI Design In Korea


Like many in the semiconductor design businesses, Arteris IP is actively working with the Korean chip companies. This shouldn’t be a surprise. If a company is building an SoC of any reasonable size, it needs network-on-chip (NoC) interconnect for optimal QoS (bandwidth and latency regulation and system-level arbitration) and low routing congestion, even in application-centric designs such as ... » read more

The Evolution Of Digital Twins


Digital twins are starting to make inroads earlier in the chip design flow, allowing design teams to develop more effective models. But they also are adding new challenges in maintaining those models throughout a chip's lifecycle. Until a couple of years ago, few people in the semiconductor industry had even heard the term "digital twin." Then, suddenly, it was everywhere, causing confusion ... » read more

Over-Design, Under-Design Impacts Verification


Designing a complex chip today and getting it out the door on schedule and within budget — while including all of the necessary and anticipated features and standards — is forcing engineering teams to make more tradeoffs than in the past, and those tradeoffs now are occurring throughout the flow. In an ideal system design flow, design teams will have done early, pre-design analysis to se... » read more

Best Practices for Deploying ClioSoft SOS7 on AWS


Semiconductor integrated circuits (ICs) are at the center of a number of modern technological innovations. To keep up with the ever-increasing pace of innovation, IC design teams require robust, scalable design management (DM) solutions to enable seamless global collaboration and to increase productivity. This paper outlines the advantages of and best practices for deploying the ClioSoft SOS de... » read more

Safety Critical Design In Automotive


Shiv Chonnad, hardware engineer at Synopsys, examines how to design chips for safety-critical applications such as automotive and ensure they work as planned and in accordance with ISO 26262 and the various ASIL levels. This includes how to find faults at both a chip and a system level. https://youtu.be/3dL4ZuSe5Ls » read more

EDA, IP Show Strong Growth


EDA and IP revenue increased 6.7% worldwide in Q3 2018 to $2.44 billion, compared to $2.28 billion in the same period in 2017. The growth was fueled by rising investments in startups in AI and 5G, as well as a stampede of new and existing companies targeting automotive electrification and autonomous vehicles. While startup funding ultimately will run out as these new markets mature and cons... » read more

Tech Talk: 2.5D Issues


Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

Tech Talk: Mobile Security (Part 2)


Simon Blake Wilson of Rambus' Cryptography Research Division talks about where security needs to fit into the design flow and where the biggest risks are. To view part one of this video, click here. [youtube vid=_nnniakpP3M] » read more

Tech Talk: 2.5D Stacked Die


What's the motivation for moving to 2.5D packaging and architectures rather than following Moore's Law? Shafy Eltoukhy, VP of operations and technology development at Open-Silicon, talks with Semiconductor Engineering about adding another dimension in semiconductors. [youtube vid=HwpY9bUNt0w] » read more

The “Last Simple Node” And the Internet of Things


Power, performance and size are key targets that will enable the expected explosion of the Internet of Things (IoT). Today, most observers see the path to that running directly through 16/14nm finFET and below for the node’s ability to manage power and size and boost integration. Geoff Lees isn’t your average observer. The vice president and general manager of Freescale’s microcon... » read more

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