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Making The Most Of Data Lakes


Having all the semiconductor data available is increasingly necessary for improving manufacturability, yield, and ultimately the reliability of end devices. But without sufficient knowledge of relationships between data from different processes and computationally efficient data structures, the value of any data is significantly reduced. In the semiconductor industry, reducing waste, decreas... » read more

Supply Chain Security And Counterfeit Detection Using Universal Chip Telemetry (UCT)


The recent shortage of chip supply and long lead times prompted system makers to turn to second tier suppliers and distributors for fulfilling their semiconductor needs. This in turn has put the spotlight on the growing concern of fraudulent or counterfeited Integrated Circuits (ICs). Proteus deep data analytics based on Universal Chip Telemetry (UCT) provides a new approach to supply chain ... » read more

Week in Review: Manufacturing, Test


Fab capacity STMicroelectronics and GlobalFoundries inked a deal to build a new jointly-operated 300mm fab adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out (~42% ST and ~58% GF). The new facility will support several technologies, with a special focus... » read more

Elevating Production Testing With Deep Data Analytics And ACS At The Edge And Cloud


The level of system integration continues to increase at a rate of greater than 30% per year — fueled by the industry’s desire for increased capability, advanced process nodes, and "more than Moore" packaging techniques. Co-optimization of the hardware and software have also been required not only at the design stage, but at test and in the field. This white paper will present how to ele... » read more

Week In Review, Manufacturing, Test


Samsung announced initial production of its 3nm process node, which uses a gate-all-around (nanosheet) transistor structure that the company calls Multi-Bridge-Channel FET (MBCFET). The first-generation 3nm process can reduce power consumption by up to 45% compared with a 5nm process, as well as improve performance by 23% and reduce area by 16%, according to the company. The second-generation 3... » read more

Removing Barriers For End-To-End Analytics


Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end analytics. While the promise of big data analytics is well understood, data sharing through the semiconductor supply chain has been stymied by an inability to link together data sources throughout the lifecycle of a chip, package, or ... » read more

Startup Funding: May 2022


May was another strong month for China as it continues its push to build a native semiconductor ecosystem. Over half the month's total funding went to startups in the country. Over half the companies funded were from China as well, including two FPGA companies, three making CPUs, a GPU startup, and numerous networking and wireless chip companies. Two of those, in FPGAs and CPUs, raised rounds s... » read more

Week in Review: Manufacturing, Test


Industry Numbers NAND flash memory is forecast to hit US $83 billion this year, an increase of 24%. DRAM is projected to hit $118 billion, up 25%, according to a recent Yole report. Both are historic records. DRAM and NAND revenues are expected to be a $260 billion market in 2027 (combined), with advanced technologies such as EUV lithography, hybrid bonding and 3D DRAM driving this. SEMI in... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Fraunhofer IIS has opened a five-kilometer (3.11-mile) 5G test bed for automotive 5G applications near the city of Rosenheim in Bavaria, Germany. A closed 5G network with multiple base stations covers the test track, where connected cars can be tested under real conditions. “The automotive test bed is designed specially for developers and users that want to test new conn... » read more

Where And When End-to-End Analytics Works


With data exploding across all manufacturing steps, the promise of leveraging it from fab to field is beginning to pay off. Engineers are beginning to connect device data across manufacturing and test steps, making it possible to more easily achieve yield and quality goals at lower cost. The key is knowing which process knob will increase yield, which failures can be detected earlier, and wh... » read more

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