Degradation Monitoring


This paper describes a reliability degradation modeling and monitoring method based on a combination of IC novel embedded circuits (Agents), and off-chip machine learning algorithms which infer the digital readouts of these circuits during test and operational lifetime. Together, they monitor the margin degradation of an IC, as well as other vital parameters of the IC and its environmental s... » read more

Blog Review: Feb. 12


Complexity is growing by process node, by end application, and in each design. The latest crop of blogs points to just how many dependencies and uncertainties exist today, and what the entire supply chain is doing about them. Mentor's Shivani Joshi digs into various types of constraints in PCBs. Cadence's Neelabh Singh examines the complexities of verifying a lane adapter state machine in... » read more

Logic Chip, Heal Thyself


If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

Using Machine Learning To Gain Data Insights


Today’s consumers have little appetite for networks that go down, for electronic devices that fail, and for any kind of digital service that doesn’t deliver as promised every time. Reliability is no longer a nice-to-have. It's  a key feature. The continued scaling of advanced electronics and chip manufacturing technologies, however, makes reliability harder to achieve — even as expectati... » read more

More Data, More Problems In Automotive


The race toward increasing levels of autonomy is being hampered by competitive concerns over sharing data across the automotive supply chain. Pushing past the initial ADAS levels into full autonomy is expected to take more than a decade, but the infrastructure for those systems, and making sure all assisted and autonomous vehicles work with other vehicles, is under development today. Still, ... » read more

Making 3D Structures And Packages More Reliable


The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

Automakers Changing Tactics On Reliability


Automakers are beginning to rethink how to ensure automotive electronics will remain reliable over their projected lifetimes, focusing their efforts on redundancy, more data-centric architectures and continued testing throughout the life of a vehicle. It is still too early to really know how automotive chips actually will perform over the next 15 to 20 years, especially AI logic developed at... » read more

Week In Review: Manufacturing, Test


Fab tools and materials In a blog, David Haynes, managing director of strategic marketing at Lam Research, talks about the IoT and automotive chip markets, which are fabricated at a wide range of technology nodes. Hoya recently made an unsolicited $1.4 billion bid to acquire NuFlare, a supplier of e-beam mask writers and other equipment. Click here for more information. Hoya makes several p... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs TrendForce has released its projected foundry rankings for the fourth quarter of 2019. TSMC remains in first place, followed by Samsung, GlobalFoundries and UMC, according to the firm. “TrendForce projects the foundry industry’s 4Q19 revenue performance to exceed previous expectations,” according to the firm. “Nonetheless, the ongoing U.S-China trade war and uncerta... » read more

Gaps Emerge In Test And Analytics


Sensor and process drift, increased design complexity, and continued optimization of circuitry throughout its lifetime are driving test and analytics in new directions, requiring a series of base comparisons against which equipment and processes can be measured. In the design world this type of platform is called a digital twin, but in the test world there is no equivalent today. And as more... » read more

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