tag: proteanTecs

Different Ways To Improve Chip Reliability
By Ed Sperling - 12 Nov, 2019 - Comments: 1

A push toward greater reliability in safety- and mission-critical applications is prompting some innovative approaches in semiconductor design, manufacturing, and post-production analysis of chip behavior. While quality over time has come under intensive scrutiny in automotive, where German carmakers require chips to last 18 years with zero defects, it isn't the only market demanding extende... » read more

Reducing Costly Flaws In Heterogeneous Designs
By Ed Sperling - 08 Oct, 2019 - Comments: 0

The cost of defects is rising as chipmakers begin adding multiple chips into a package, or multiple processor cores and memories on the same die. Put simply, one bad wire can spoil an entire system. Two main issues need to be solved to reduce the number of defects. The first is identifying the actual defect, which becomes more difficult as chips grow larger and more complex, and whenever chi... » read more

From Womb To Tomb: A Lifetime Of Chip Data In A Common Language
By Noam Brousard - 08 Oct, 2019 - Comments: 0

Every integrated circuit (IC) has a lifetime of stories to tell. From design through the end of a chip’s life, it can let us know what’s happening all along the way, providing we give it a voice and the language to do so. But until we can gain access to this data, the lives of these ICs remain secret. In-chip monitoring opens up those secrets. It helps to optimize performance, and it is esp... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Degradation Monitoring – From Vision to Reality
By Evelyn Landman - 06 Aug, 2019 - Comments: 0

Reliability physics has historically focused on models for time-to-failure, but that approach is reaching its limit. Those models generally were developed using data gathered from very simple test structures that could be stressed to failure. Today, with electronics playing a such a critical role in our everyday life, failures are no longer an option. The underlying ICs being implemented call f... » read more

More Semiconductor Data Moving To Cloud
By Ed Sperling - 06 Aug, 2019 - Comments: 0

The cloud is booming. After years of steady growth it has begun to spike, creating new options for design, test, analytics and AI, all of which have an impact on every segment of the semiconductor industry. The initial idea behind the cloud is that it would supplement processing done on premises, adding extra processing power wherever necessary, such as in the verification and debug stages o... » read more

Using Better Data To Shorten Test Time
By Ed Sperling - 06 Aug, 2019 - Comments: 0

The combination of machine learning plus more sensors embedded into IC manufacturing equipment is creating new possibilities for more targeted testing and faster throughput for fabs and OSATs. The goal is to improve quality and reduce the cost of manufacturing complex chips, where time spent in manufacturing is ballooning at the most advanced nodes. As the number of transistors on a die incr... » read more

April’19 Startup Funding: Corporate Gushers
By Jeff Dorsch - 02 May, 2019 - Comments: 0

It was another rich month for startups, large and small. In April’s top 11 funding rounds, five were investments by big corporations or corporate venture capital funds—an investor consortium led by the SoftBank Vision Fund, PayPal, Ford Motor, NTT DoCoMo, and HAPSMobile, a joint venture of SoftBank Group and AeroVironment. Those 11 investments totaled $3.74 billion. Intel Capital was als... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Apr, 2019 - Comments: 0

Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more

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