Author's Latest Posts


Enhancing High Bandwidth Memory (HBM) Reliability With 3D X-ray Inspection


High Bandwidth Memory (HBM) is revolutionizing AI, high-performance computing, and advanced graphics systems. Its 3D architecture—stacked DRAM dies interconnected via through-silicon vias (TSVs)—delivers exceptional bandwidth and efficiency. But this complexity introduces new challenges for inspection and quality assurance. Why 3D X-ray for HBM? Traditional 2D X-ray imaging cannot fully v... » read more

Home Win: Challenging The Traditional Semiconductor Manufacturing Model


Across Europe, many of us have grown accustomed to a model where semiconductor products, subassemblies and components are sourced from the Far East almost by default. The rationale has always been clear: significantly lower labor and manufacturing costs made offshore supply the most commercially viable option. Yet, while this approach has long been convenient, it has never been without compromi... » read more

X-ray Inspection In The Semiconductor Industry


With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures and electrical connections in the production of chips have become smaller and smaller. In addition, the sheer number of these connections in a given unit area have also increased in a spectacular way. At the heart of all X-ray inspection, whether it is manual or fully automated metrolog... » read more