Author's Latest Posts


Why Hardware Monitoring Needs Infrastructure, Not Just Sensors


Chipmakers need comprehensive hardware monitoring, with monitors (Agents) and sensors distributed throughout their devices, to manage the growing complexity and scale of modern SoCs. As designs now incorporate billions of transistors, multiple power and clock domains, and advanced process technologies, traditional characterization, test, and guard-banding approaches no longer provide sufficient... » read more

Thermal Sensing Headache Finally Over For 2nm And Beyond


Effective thermal management is crucial to prevent overheating and optimize performance in modern SoCs. Inadequate temperature control due to inaccurate thermal sensing compromises power management, reliability, processing speed, and lifespan, leading to issues like electromigration, hot carrier injection, and even thermal runaway. Unfortunately, precise thermal monitoring reached an inflect... » read more

The Future Of Chiplet Reliability


Chipmakers are increasingly turning to advanced packaging to overcome the reticle size limit of silicon manufacturing without increasing transistor density. This method also allows hybrid devices with dies in different process nodes while improving yield, which decreases exponentially with size. However, 2.5D/3D designs introduce a fair share of new challenges, one of the most significant be... » read more