Chip Industry Week In Review

Amkor’s $1.5B deal; Intel Foundry revenue up 31%; Siemens’ dual buys; SiC plant dies; AMD’s big week; TSMC price hike; Nokia’s fab buy; earnings; $300M for accelerating inference; Keysight’s multiphysics; copper interconnect alternative.

popularity

Notable deals 

  • Amkor and Nvidia signed a $1.5B multiyear agreement to develop advanced packaging and test technologies for next-gen AI and accelerated-computing platforms. Nvidia’s prepayment will support Amkor’s U.S. capacity expansion in Arizona, including high-density interconnect and heterogeneous integration capabilities.
  • Siemens announced plans to acquire two EDA companies: Defacto Technologies, a provider of tools for automated SoC design creation and integration, and Precision Innovations, which develops AI-driven chip planning and design exploration software built on the open-source OpenROAD framework.
  • IBM plans to acquire HRL Laboratories, an R&D firm jointly owned by Boeing and GM with expertise in silicon-spin qubits and quantum sensing.
  • Mitsubishi Electric and Sony Semiconductor will establish a joint venture, Advanced Vision Solutions, to develop image sensors with integrated AI-based analysis of visual data for a range of manufacturing equipment.
  • Powertech Technology is planning a $400M joint venture with Broadcom to provide panel-level packaging services in Singapore, reports Taipei News.

AMD’s Full AI Stack

  • AMD said its Helios rack-scale AI platform has entered production, combining 72 GPUs, 18 CPUs, and networking software for large-scale AI training and inference.
  • Anthropic plans to deploy up to 2 GW of AMD’s GPUs in the Helios racks, starting with 1GW in H1 2027. AMD will also invest up to $5B in Anthropic and use Claude for software development.
  • Cerebras will combine AMD’s rack-scale solution with its wafer-scale engine in a single inference workflow.
  • AMD partners deploying the new infrastructure include OpenAI, Meta, Microsoft, and others.

Price hikes

Facilities watch

  • Nokia is planning to acquire NXPs Chandler, Arizona fab to expand its indium phosphide semiconductor manufacturing capacity. Subject to approvals, Nokia plans to lease part of the site, starting early next year, and convert it to indium phosphide production for optical components, with the full acquisition expected to close in Q1 2029.
  • SK Siltron is closing its silicon carbide wafer plant in Monitor Township, Michigan.
  • Paras Semiconductors signed an MoU for a ~US$644M OSAT facility in Madhya Pradesh, India.

Big funding

Photonics

Cybersecurity

Analysis

  • TrendForce expects NAND flash supply constraints to ease in H2 2027, driven by weakened demand for smartphones and notebook PCs.
  • The advanced packaging market reached $55B in 2025 and could exceed $120B by 2031, according to Yole Group.

Earnings

Quick links to more news:

In-Depth |Reports and Deals | New Technologies | Security | Vehicles, Batteries | Trending Video | ResearchQuantum | Workforce, Education  Events and Webinars

In-Depth

Semiconductor Engineering published the Systems and Design newsletter this week:

Plus:


Reports and Deals

Fundings

  • Elio raised $21M to design image sensors with dynamic optical layers of micromirrors that AI can tune to acquire the image it needs.
  • Keiron Printing raised ~$23M for its Laser-Induced Forward Transfer precision solder paste printing.
  • Infinity AI Institute raised $15M to automatically generate kernels for AI chips.
  • Mach42 raised $9.5M for its physics-driven surrogate modeling technology for faster verification of analog circuits.
  • Silicon Microgravity raised ~$8.1M to manufacture MEMS accelerometers for extreme environments.
  • Circular Materials raised ~$13.5M to recover critical raw materials from industrial wastewater, including in the semiconductor industry.

Reports

Opinions


New Technologies

Design

  • Keysight unveiled a multiphysics design and verification solution for electronics, including a structural analysis application covering drop, shock, and vibration.  The company also expanded startups’ access to its chip design software through its collaboration with the Midwest Microelectronics Consortium’s  ScaleBridge Labs incubator.
  • Si2 launched LBC-bench, a public, open-source leaderboard that tracks how LLMs and AI agents perform on semiconductor design and verification tasks.
  • Real Intent released an AI agent for static sign-off tool workflows.

AI data centers/infrastructure

  • Skyworks Solutions uncorked network synchronizers for AI data centers and other time-sensitive communications infrastructure.
  • Astera Labs released 3.2T Ethernet smart retimers and redrivers for scale-up and scale-out AI infrastructure.
  • Cornelis Networks uncorked a reference network architecture for AI/HPC around its SuperNIC and AMD CPUs and GPUs.

Memory

  • California Memory Technologies announced an LPDDR5x memory simulation and verification platform.
  • Acrab debuted an SoC for edge AI that integrates CPU, GPU, and NPU resources with a unified memory architecture for large models.
  • CAST updated its xSPI serial memory controller IP core with AES encryption, AMBA power-state management, and programmable delay tuning.

Deployments

  • Speedata deployed Arteris‘ FlexNoC technology in its processor for large-scale data analytics workloads.
  • Ambiq expanded deployment of ChipAgentsagentic AI platform for designing and verifying its ultra-low power edge AI chips.
  • The Exploration Co. adopted Siemens‘ industrial software to develop reusable spacecraft.

Research

Cornell researchers showed that single-crystal niobium arsenide nanowires become more conductive as they shrink, offering a proof-of-concept alternative to copper interconnects at advanced nodes.

KAUST, MIT and other researchers showed that “a commercial 65nm CMOS process can be repurposed as a passive, foundry-manufacturable characterization platform by functionally partitioning its metal stack into microwave, thermal, and electrical subsystems within a 1 mm2 footprint.”

A UCSD team developed an in-storage retrieval accelerator that embeds vector-search functions directly into 3D NAND to lower latency and energy for retrieval-augmented AI workloads.

Princeton researchers proposed HW mechanisms for dynamically throttling AI performance, using microarchitecture-level controls such as cache way masking, bandwidth limits and latency insertion to constrain workloads at runtime.

More technical papers

Find more industry research here.


Security

Government guidance

  • ENISA published new healthcare cybersecurity procurement guidelines urging buyers to require HW security features, signed firmware updates, device certificates, vulnerability-disclosure commitments, and timely patching for medical devices and connected systems.
  • The UK’s National Cyber Security Centre urged organizations to inventory systems that rely on cryptography and prepare for post-quantum migration, targeting completed plans by 2028, priority-system upgrades by 2031, and full migration by 2035.

Hacks and vulnerabilities

  • A hack of AI-music generation company Suno reportedly exposed 55 million customers’ private information and revealed that the AI tool had scraped music from sites like YouTube, Genius and Deezer amid several ongoing copyright lawsuits against the company.
  • A cyberattack temporarily suspended U.S. production at Coca-Cola-owned fairlife. The Anubis group later claimed responsibility and said it stole 1TB of data; Coca-Cola did not confirm that claim.
  • Hikvision disclosed 5 firmware vulnerabilities affecting several IP-camera families.
  • CISA posted new vulnerability alerts this week.

New security releases

  • Google released three new Gemini AI models, including the security-focused Gemini 3.5 Flash Cyber.
  • Researchers at DigiCert report that little progress has been made toward PQC security deployment, despite widespread testing and fast-approaching regulatory deadlines. While 87% of organizations report they are planning, testing, or implementing PQC initiatives, only 7% of organizations have deployed quantum-safe or hybrid cryptography across most of their digital certificates, according to the researchers.

Security research papers


Vehicles, Batteries

Vehicle vulnerabilities

Auto chips

  • NXP debuted the SAF9800, a new automotive audio and radio processor designed to simplify infotainment architectures. The company said the processor was built through integrating analog radio and AI/ML-enabled audio processing into a single-chip solution.

Autonomous, connectivity, sensors

EVs, batteries

Vehicle research

  • UCLA, U. of Rochester, and others demonstrated a physics-based ML imaging system designed to capture details within “complex media.”  The system more than doubled the signal-to-noise ratio compared to a previous generation of the technology, with researchers suggesting that the system could power advances in AV sensor and biomedical imaging technology.
  • NUS researchers developed an “electronic skin” for underwater diving devices that are capable of detecting damage and autonomously self-healing while underwater.
  • KAIST created an ultra-precise inspection technology to prevent EV battery fires​.

AI Models On The Edge: Moving from LLMs in the cloud to SLMs at the edge is much more complicated than just slimming down the algorithms. It requires changes in both HW and SW, and the constraints can vary greatly from one market segment to another. Quadric’s Daniel Firu and Ravi Chakaravarthy talk about how to optimize NPUs for different applications, how to build in enough flexibility to keep designs from becoming obsolete too quickly, and how to leverage the benefits of open-source while still adding value.


Quantum

Hitachi is designing 100-qubit silicon quantum chips that will be fabricated on Intel Foundry’s 18A process.

Quantinuum and SoftBank published a roadmap to explore which quantum computing use cases will become feasible at what stage of hardware maturity.

Photon Queue raised $4M to build quantum memory devices that store photons directly in free-space optical loops.

PsiQuantum signed an expanded $125M deal with DARPA to continue work on the Quantum Benchmarking Initiative.

Illinois received ~$30M in federal funding for quantum ecosystem development.


Workforce, Education

DHS’s final rule replaces open-ended “duration of status” for F, J and I nonimmigrants with fixed admission periods. Also, USCIS says it received enough petitions to meet both the 65,000 regular H-1B cap and the 20,000 advanced-degree exemption, or master’s cap, for FY 2027.

Security and ECE guru Mark Tehranipoor is now the dean of the University of Florida’s College of Engineering.

The UK now has a semiconductor scholarship track in its TechFirst program, offering students ~US$5K per year, industry connections and career support.

ASML plans to offer eligible employees a conditional stock grant worth €20,000 (about US$23K) if they remain with the company from 2027 through 2030, Reuters reports.

An Economist tool: Where should you move for higher pay?


Events and Webinars

Upcoming webinars are here, including:

Find upcoming chip industry events here, including:

  • EVENTS Date Location
    The Chips to Systems Conference (DAC) July 26 – 29 Long Beach, CA
    2026 IEEE International Conference on LLM-Aided Design (ICLAD) July 30 – 31 Stanford, CA
    FMS: Future of Memory and Storage Aug 4 – 6 Santa Clara, CA
    USENIX Security Symposium Aug 12 – 14 Baltimore, MD
    CadenceLIVE India 2026 Aug 12 Bengaluru
    Hot Interconnects Aug 19 – 21 Virtual
    SPIE Optics + Photonics Aug 23 – 27 San Diego
    Hot Chips Aug 23 – 25 Palo Alto, CA
    SEMICON Taiwan Sept 2 – 4 Taipei
    SPIE Photomask Technology + Extreme Ultraviolet Lithography Sept 8 – 11 Monterey, CA
    AI Infra Summit 2026 Sept 15 – 17 Santa Clara, CA
    SEMICON India Sept 17 – 19 Delhi, India
    JEDEC’s Automotive Electronics Forum Sept 17 Santa Clara, CA
    GSA: 2026 U.S. Executive Forum Sept 22 Menlo Park, CA
    TSMC 2026 North America OIP Ecosystem Forum Sept 23 Santa Clara, CA
    IMAPS Microelectronics
    Symposium 2026
    Sept 28 – Oct 1 Everett, Mass
    Microelectronics UK Sept 29 – 30 London
    Find all events here.



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