Week in Review – IoT, Security, Autos

By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Data Leakage And The IIoT

By Ed Sperling - 22 Mar, 2017 - Comments: 1

The Internet of Things has raised concerns about people hacking into home networks or using armies of bots to disrupt communications. But with the Industrial IoT, the stakes are significantly higher—and the effects can last much longer. Security tops the list of concerns as more industrial equipment is connected to the Internet, according to numerous industry insiders. That hasn't stopped ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 23 Dec, 2016 - Comments: 0

Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 24 Oct, 2014 - Comments: 0

After months of on-again, off-again negotiations, IBM agreed to hand over its Microelectronics unit to GlobalFoundries for $1.5 billion—meaning IBM will actually pay GlobalFoundries that amount to get rid of what has become an albatross for Big Blue. Analyst Jim McGregor said it is only a matter of time before GlobalFoundries shuts down IBM’s fabs, according to the Albany Business Review... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Week in Review – IoT, Security, Autos

Data Leakage And The IIoT

The Week In Review: Manufacturing

The Week In Review: Manufacturing

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