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Week In Review: Manufacturing, Test


Chipmakers and OEMs Several foundry vendors are building new fabs. The memory vendors, such as Samsung and SK Hynix, are also building new capacity. In another example, Taiwan DRAM supplier Nanya Technology plans to construct a new 300mm fab in the Taishan Nanlin Technology Park in New Taipei City. The plant will produce DRAMs with Nanya’s in-house developed 10nm-class process technologies a... » read more

The Quest For Curvilinear Photomasks


The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

EUV Pellicles Finally Ready


After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing


The Survey: 2021 Deep Learning Applications List by eBeam Initiative members is a list of current deep learning efforts that are being used in photomask to wafer semiconductor manufacturing. Examples come from ASML, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, Siemens Industries Software, Inc., Siemens EDA, STMicroelectronics, and TASMIT. Published by the eBeam Initiative Membe... » read more

Week In Review: Manufacturing, Test


Government policy For the last four years, the U.S. and China have been embroiled in a trade war, especially on the technology front. The U.S. has implemented a number of export control measures and tariffs in the arena. But there might be a thawing in the tense relationship between the two superpowers. “Reports surfaced Thursday indicating the China Semiconductor Industry Association (CSIA)... » read more

Week In Review: Manufacturing, Test


Government policy The National Security Commission on Artificial Intelligence (NSCAI) this week submitted its final report to Congress and the President. The goal is to develop a national strategy to maintain America’s AI advantages related to national security. As part of the long and complex report, the NSCAI came to a sobering conclusion: “The U.S. government is not prepared to defend t... » read more

Week In Review: Manufacturing, Test


Chipmakers Intel posted its quarterly results. But the big question is whether the chip giant will outsource more of its production to the foundries. As reported, Intel has fallen behind TSMC and Samsung in process technology. And Intel may need to outsource some of its chip production to stay ahead. All of this rests on Pat Gelsinger, the new CEO at Intel. Gelsinger will be taking over for... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and others, the letter says Intel needs to decide “whether Intel should remain an integrated device manufacturer” and should divest certain failed acquisitions. Here’s another analysis of the sit... » read more

200mm Demand Surges


A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

EUV Challenges And Unknowns At 3nm and Below


The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

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