Chip Industry Week In Review

By The SE Staff - 26 Jun, 2026 - Comments: 0

IBM unveiled a 7Å transistor architecture that uses staggered nanosheet transistors stacked on a precisely beveled angle, almost like tiles on a roof. That allows more transistors to be crammed into a given area, boosting performance by 50% or power efficiency by up to 70%. Perhaps even more important, IBM claims a 40% improvement in SRAM scaling, which is orders of magnitude faster and lower ... » read more

Chip Industry Week In Review

By The SE Staff - 19 Jun, 2026 - Comments: 0

Dealmaking Amkor inked a 10-year agreement with TSMC to provide advanced packaging and test services in Arizona, tying TSMC’s U.S. fab expansion to domestic OSAT capacity. Trump said in a post that Apple will partner with Intel on chip design and production in the U.S., marking a second reported win for the chipmaker this month. Intel Foundry will also reportedly manufacture 3 million... » read more

Chip Industry Week In Review

By The SE Staff - 29 May, 2026 - Comments: 1

ECTC Panel-level packaging, hybrid bonding, new substrates, and fine-pitch interconnects topped the list of advanced packaging technologies at ECTC this week. Among the announcements: ASE launched an automated 310mm × 310mm panel-level packaging production line. Expected to enter production in the first half of 2027, the line is compatible with FOCoS and FOCoS-Bridge pa... » read more

Chip Industry Week in Review

By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Chip Industry Week In Review

By The SE Staff - 08 May, 2026 - Comments: 0

Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Chip Industry Week In Review

By The SE Staff - 24 Apr, 2026 - Comments: 0

Deals Marvell acquired Polariton Technologies, a Swiss developer of plasmonics-based silicon photonics devices. Onto Innovation is partnering with Rigaku, combining Onto’s analysis software with Rigaku’s CD-SAXS platform for advanced semiconductor process control. Onto also agreed to acquire a 27% stake in Rigaku for about $710M. Tesla plans to use Intel’s 14A process for its T... » read more

Chip Industry Week In Review

By The SE Staff - 17 Apr, 2026 - Comments: 0

Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Chip Industry Week In Review

By The SE Staff - 20 Mar, 2026 - Comments: 0

War impacts The Iran War's toll on the chip industry is widening. Over 95% of Taiwan's energy is imported, causing the country to secure alternative sources. Korea is also heavily dependent on energy imports from the Middle East. Shortages of key materials are cropping up everywhere. Helium from Qatar, the second largest producer behind the U.S., is constrained by hostilities in the Per... » read more

Chip Industry Week In Review

By The SE Staff - 06 Mar, 2026 - Comments: 0

Think tank IAPS' report on AI integrity attacks contends that advanced AI systems must be protected from hidden tampering, backdoors, or unauthorized changes that could alter their behavior or outputs, especially when AI adoption is scaling rapidly, with over 60% of the federal workforce now using AI every day. Geopolitics The U.S. government has drafted new export rules that may give W... » read more

Chip Industry Week In Review

By The SE Staff - 27 Feb, 2026 - Comments: 0

Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

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Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week in Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

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