Single Vs. Multi-Patterning Advancements For EUV


As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and technologies. While the basic lithography process hasn’t changed since the founding of the industry — exposing light through a reticle onto a prepared silicon wafer — the techniques and technology ... » read more

3D Metrology Meets Its Match In 3D Chips And Packages


The pace of innovation in 3D device structures and packages is accelerating rapidly, driving the need for precise measurement and control of feature height to ensure these devices are reliable and perform as expected throughout their lifetimes. Expansion along the z axis is already well underway. One need look no further than the staircase-like 3D NAND stacks that rise like skyscrapers to p... » read more

Chip Industry Week In Review


Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Opportunities Grow For GPU Acceleration


Experts at the Table: Semiconductor Engineering sat down to discuss the impact of GPU acceleration on mask design and production and other process technologies, with Aki Fujimura, CEO of D2S; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys. W... » read more

Chip Industry Week In Review


Absolics, an affiliate of Korea materials company SKC, will receive up to $75 million in direct funding under the U.S. CHIPS Act for the construction of a 120,000 square-foot facility in Covington, Georgia, for glass substrates in advanced packaging. imec will host a €2.5 billion (~$2.72B) pilot line for researching chips beyond 2nm, partially funded through the EU Chips Act. imec CEO Luc ... » read more

Navigating The GPU Revolution


Experts at the Table: Semiconductor Engineering sat down to discuss the impact of GPU acceleration on mask design and production and other process technologies, with Aki Fujimura, CEO of D2S; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys. What f... » read more

Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing


How Advantest Corporation, ASML, Fraunhofer, imec, Siemens EDA and others are using deep learning in semiconductor manufacturing. Click here to read more. » read more

Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review


By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

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