Chip Industry Week In Review

By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Will AI Disrupt EDA?

By Brian Bailey - 25 Jul, 2024 - Comments: 0

Generative AI has disrupted search, it is transforming the computing landscape, and now it's threatening to disrupt EDA. But despite the buzz and the broad pronouncements of radical changes ahead, it remains unclear where it will have impact and how deep any changes will be EDA has two primary roles — automation and optimization. Many of the optimization problems are NP hard, which means t... » read more

Survey of CXL Implementations and Standards (Intel, Microsoft)

By Technical Paper Link - 22 Jul, 2024 - Comments: 0

A new technical paper titled "An Introduction to the Compute Express Link (CXL) Interconnect" was published by researchers at Intel Corporation, Microsoft, and University of Washington. Abstract "The Compute Express Link (CXL) is an open industry-standard interconnect between processors and devices such as accelerators, memory buffers, smart network interfaces, persistent memory, and solid-... » read more

Blog Review: July 10

By Jesse Allen - 10 Jul, 2024 - Comments: 0

Cadence's Paul Graykowski suggests using real number modeling to streamline digital mixed-signal verification using logic simulators and hardware emulators. Siemens' John McMillan and Microsoft's Amit Kumar introduce the basics of 3D-IC, describe the flow and data management challenges, look at the evolution of TSMC 3DBlox 1.0 and 2.0, and detail a physical verification and reliability analy... » read more

Digital Twins Find Their Footing In IC Manufacturing

By Laura Peters - 09 Jul, 2024 - Comments: 0

Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. The movement toward digital twins opens up a slew of opportunities, from building and equipping new fabs faster to speeding yield ramps by reducing the number of silicon-based tes... » read more

Chip Industry Week In Review

By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Chip Industry Technical Paper Roundup: May 28

By Linda Christensen - 28 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=229 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review

By The SE Staff - 24 May, 2024 - Comments: 0

Absolics, an affiliate of Korea materials company SKC, will receive up to $75 million in direct funding under the U.S. CHIPS Act for the construction of a 120,000 square-foot facility in Covington, Georgia, for glass substrates in advanced packaging. imec will host a €2.5 billion (~$2.72B) pilot line for researching chips beyond 2nm, partially funded through the EU Chips Act. imec CEO Luc ... » read more

A HW-Aware Scalable Exact-Attention Execution Mechanism For GPUs (Microsoft)

By Technical Paper Link - 21 May, 2024 - Comments: 0

A technical paper titled “Lean Attention: Hardware-Aware Scalable Attention Mechanism for the Decode-Phase of Transformers” was published by researchers at Microsoft. Abstract: "Transformer-based models have emerged as one of the most widely used architectures for natural language processing, natural language generation, and image generation. The size of the state-of-the-art models has in... » read more

Chip Industry Week In Review

By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

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tag: Microsoft

Chip Industry Week In Review

Will AI Disrupt EDA?

Survey of CXL Implementations and Standards (Intel, Microsoft)

Blog Review: July 10

Digital Twins Find Their Footing In IC Manufacturing

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: May 28

Chip Industry Week In Review

A HW-Aware Scalable Exact-Attention Execution Mechanism For GPUs (Microsoft)

Chip Industry Week In Review

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