Tracking Automotive’s Rapidly Shifting Ecosystem


The automotive ecosystem is becoming much harder to navigate as automakers, Tier 1s and IP vendors redefine their relationships based upon shifting value caused by an rapidly expanding amount of increasingly interdependent and complex electronic content. Predictions of massive change started almost a decade ago with a number of pilot programs around autonomous vehicles. But those shifts real... » read more

Week In Review: Manufacturing, Test


The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

New Architectural Issues Facing Auto Ecosystem


As chips bound for the automotive world move to small process nodes, including 5nm and below, the automotive ecosystem is wrestling with both scaling issues and challenges related to architecting safety-critical systems using fewer chips. This may sound counterintuitive, because one of the main reasons automotive chip providers are moving to smaller nodes is to reduce the number of chips in ... » read more

The Challenges Of Building Inferencing Chips


Putting a trained algorithm to work in the field is creating a frenzy of activity across the chip world, spurring designs that range from purpose-built specialty processors and accelerators to more generalized extensions of existing and silicon-proven technologies. What's clear so far is that no single chip architecture has been deemed the go-to solution for inferencing. Machine learning is ... » read more

The Cost Of Programmability


Nothing comes for free, and that is certainly true for the programmable elements in an SoC. But without them we are left with very specific devices that can only be used for one fixed application and cannot be updated. Few complex devices are created that do not have many layers of programmability, but the sizing of those capabilities is becoming more important than in the past. There are... » read more

EDA In The Cloud


Michael White, director of product marketing for Calibre physical verification at Mentor, a Siemens Business, looks at the growing compute requirements at 7, 5 and 3nm, why the cloud looks increasingly attractive from a security and capacity standpoint, and how the cloud as well as new lithography will affect the cost and complexity of developing new chips. » read more

Where Timing And Voltage Intersect


João Geada, chief technologist at ANSYS, talks about the limitations for power delivery networks and what processors can handle, why the current solutions to these issues are causing failures, and how voltage reduction can affect timing. » read more

Software In Inference Accelerators


Geoff Tate, CEO of Flex Logix, talks about the importance of hardware-software co-design for inference accelerators, how that affects performance and power, and what new approaches chipmakers are taking to bring AI chips to market. » read more

Hardware Attack Surface Widening


An expanding attack surface in hardware, coupled with increasing complexity inside and outside of chips, is making it far more difficult to secure systems against a variety of new and existing types of attacks. Security experts have been warning about the growing threat for some time, but it is being made worse by the need to gather data from more places and to process it with AI/ML/DL. So e... » read more

Week In Review: IoT, Security, Autos


The United States signed trade agreements with the China (phase one agreement) and North American countries Mexico and Canada this week. The SIA (Semiconductor Industry Association), which represents the U.S. semiconductor industry, applauded the agreements. Still to be worked out is the second part, or phase two, of the U.S.’s agreement with China. AI/Edge M&A Apple is acquiring edge... » read more

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