Chip Industry Technical Paper Roundup: Mar. 31

Edge, in-sensor AI processors; TMDC-based transistors; DRAM read disturbance threshold; replay-based validation for chiplets; LLM-specific algorithmic attacks; noise in tellurium transistors; FMEDA safety metrics; HW reverse engineering; slowdowns in multi-GPU LLM inference.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
DiscoRD: An Experimental Methodology for Quickly Discovering the Reliable Read Disturbance Threshold of Real DRAM Chips 🔗 ETH Zurich, Rutgers University
Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review 🔗 University of Austria, ETH Zurich
Oxide induced degradation in MoS2 field-effect transistors 🔗 imec, ETH Zurich
ODIN-Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation 🔗 Intel, Nvidia, Synopsys
Cascade: Composing Software-Hardware Attack Gadgets for Adversarial Threat Amplification in Compound AI Systems 🔗 UT Austin, Intel Labs, Symmetry Systems, Microsoft, Georgia Tech
Revealing and Engineering Contact-Origin Noise in Ultrathin Tellurium Transistors 🔗 POSTECH
Quantifying Uncertainty in FMEDA Safety Metrics: An Error Propagation Approach for Enhanced ASIC Verification 🔗 Robert Bosch GmbH
SoK: From Silicon to Netlist and Beyond Two Decades of Hardware Reverse Engineering Research 🔗 Ruhr University Bochum, Max Planck Institute for Security and Privacy
Characterizing CPU-Induced Slowdowns in Multi-GPU LLM Inference 🔗 Georgia Tech

Find more semiconductor research papers here.

 



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