Chip Industry Technical Paper Roundup: Mar. 31


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DiscoRD: An Experimental Methodology for Quickly Discovering the Reliable Read Disturbance Threshold of Real DRAM Chips 🔗 ETH Zurich, Rutgers University Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review 🔗 Univ... » read more

How SW and HW Vulnerabilities Can Complement LLM-Specific Algorithmic Attacks (UT Austin, Intel et al.)


A new technical paper, "Cascade: Composing Software-Hardware Attack Gadgets for Adversarial Threat Amplification in Compound AI Systems," was published by the University of Texas, Austin, Intel Labs, Symmetry Systems, Microsoft and Georgia Tech. Abstract "Rapid progress in generative AI has given rise to Compound AI systems - pipelines comprised of multiple large language models (LLM), so... » read more

Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Technical Paper Roundup: August 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=460 /] Find more semiconductor research papers here. » read more

Preventing End-to-End Slowdowns In Accelerated Chip Multi-Processors (Cornell University, Intel Labs)


A new technical paper titled "RACER: Avoiding End-to-End Slowdowns in Accelerated Chip Multi-Processors" was published by researchers at Cornell University and Intel Labs. Abstract "Recent chip multiprocessors incorporate several on-chip accelerators, marking the beginning of the Accelerated Chip Multi-Processor (XMP) era in datacenters. Despite the close proximity of accelerators and gener... » read more

Chip Industry Technical Paper Roundup: July 29


New technical papers recently added to Semiconductor Engineering’s library: [table id=458 /] Find more semiconductor research papers here. » read more

Tag-Based Memory Verification System for RISC-V (Inha Univ., Intel Labs et al.)


A new technical paper titled "Efficient Hardware-Assisted Heap Memory Safety for Embedded RISC-V Systems" was published by researchers at Inha University, Intel Labs, Electronics and Telecommunications Research Institute, and Korea National University of Education. Abstract "In recent years, memory safety issues in embedded environments have garnered significant attention, with spatial and ... » read more

Chip Industry Week In Review


Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

Chip Industry Week In Review


Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Chip Industry Week In Review


Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

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