Demystifying CXL memory; physical design macro placement; 3-gated reconfigurable FETs; ALD for wafer bonding beyond silicon; self-adaptive HW with ReRAMs for neurocomputing; SiC & quantum nanophotonic HW; covert channel and PDN; scalable ALD for 2D semiconductors.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Demystifying CXL Memory with Genuine CXL-Ready Systems and Devices | University of Illinois Urbana-Champaign (UIUC) and Intel Labs |
| AutoDMP: Automated DREAMPlace-based Macro Placement | NVIDIA |
| Large-area synthesis of high electrical performance MoS2 by a commercially scalable atomic layer deposition process | University of Southampton, LMU Munich, and VTT Technical Research Centre of Finland |
| Insights into the Temperature Dependent Switching Behaviour of Three-Gated Reconfigurable Field Effect Transistors | NaMLAB and TU Dresden |
| Utilizing photonic band gap in triangular silicon carbide structures for efficient quantum nanophotonic hardware | UC Davis |
| Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition | Kyushu University |
| A self-adaptive hardware with resistive switching synapses for experience-based neurocomputing | Infineon Technologies, Politecnico di Milano and IUNET, Weebit Nano, and CEA Leti |
| CPU to FPGA Power Covert Channel in FPGA-SoCs | TU Munich and Fraunhofer Research Institution AISEC |
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