Chip Industry Technical Paper Roundup: May 5


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design 🔗 Univ. of Edinburgh, Peking Univ., Cambridge, CAS, HKUST In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Direct... » read more

Mapping and Routing Fault-Tolerant Quantum Circuits Onto Chiplet Architectures (TU Munich)


A new technical paper, "Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures," was published by researchers at the Technical University of Munich. Abstract "As quantum computing advances toward fault-tolerance through quantum error correction, modular chiplet architectures have emerged to provide the massive qubit counts required while overcoming fabrication limits of mon... » read more

Chip Industry Week In Review


Disruptions caused by the Iran conflict have taken about one third of the global helium supply off the market, an essential gas for semiconductor manufacturing, reports the World Economic Forum. Other potential impacts for the chip industry include bromine and other chemical shortages, logistical disruptions, and higher energy prices incurred by fabs in Asia. Top Deals IBM and Lam R... » read more

Automotive Week In Review


Quick links: Automotive chips, Autonomous, EVs, Batteries, Policy, Research. Automotive chips  Mythic and Honda will jointly develop an automotive-grade AI SoC for Honda’s SDVs that leverages Mythic’s energy-efficient analog compute-in-memory technology. ST released a new MCU with AI acceleration for the automotive edge, integrating an embedded neural network accelerator. I... » read more

Chip Industry Technical Paper Roundup: Feb. 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=519 /] Find more semiconductor research papers here. » read more

Autonomous Driving: Motion Planner Executed on Automotive-Grade Embedded HW (TU Munich)


A new technical paper titled "Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware" was published by researchers at TU Munich. Abstract "Ensuring the functional safety of Autonomous Vehicles (AVs) requires motion planning modules that not only operate within strict real-time constraints but also maintain controllability in case of system faults. Exis... » read more

Chip Industry Week in Review


Government funding/defunding NIST is terminating funding for the SMART USA Institute, a CHIPS Act research center focused on digital twins, prompting congressional concern that the decision disrupts active awards and weakens U.S. semiconductor R&D commitments. Korea Zinc was awarded $210M in CHIPS Act funding towards a new $6.6B Tennessee advanced smelter and minerals processing facility,... » read more

Analysis of EM Side Channel Attacks On Smartphones (Fraunhofer AISEC, BSI, TUM)


A new technical paper titled "Breaking ECDSA with Electromagnetic Side-Channel Attacks: Challenges and Practicality on Modern Smartphones" was published by researchers at Fraunhofer Institute for Applied and Integrated Security (AISEC), German Federal Office for Information Security, and TU Munich. Abstract "Smartphones handle sensitive tasks such as messaging and payment and may soon sup... » read more

Chip Industry Technical Paper Roundup: Dec. 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=499 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review.   » read more

Verification and Reliability Methods For RRAM-Based Computing-in-Memory (Univ. of Bremen et al)


A new technical paper titled "Special Session Paper: Formal Verification Techniques and Reliability Methods for RRAM-based Computing-in-Memory" was published by researchers at University of Bremen, DFKI GmbH, University of Florida and TU Munich. Abstract "Computing-in-memory (CIM) has gained immense traction owing to the benefits it provides in power, performance, and area. CIM can be don... » read more

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