Chip Industry Technical Paper Roundup: Nov. 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=492 /] Find more semiconductor research papers here. » read more

Comparative Analysis of CFET and NSFET Architectures (TU Munich, IIT)


A new technical paper titled "Impact of Aging, Self-Heating, and Parasitics Effects on NSFET and CFET" was published by researchers at TU Munich and Indian Institute of Technology. Abstract "This work presents a comparative analysis of complementary field-effect transistor (CFET) and nanosheet FET (NSFET) architectures, with a focus on self-heating effects (SHEs), negative bias temperature ... » read more

Chip Industry Week in Review


SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

Chip Industry Week in Review


The Open Compute Project (OCP) Summit kicked off this week in San Jose, dominated by open standards, massive scaling of AI infrastructure, chiplet architectures, and energy-efficiency. Among the highlights: An initiative to standardize data center infrastructure and advance Ethernet for AI. New contributions to OCP's Open Chiplet Economy ecosystem, including Arm's new Foundation Chiplet... » read more

Chip Industry Week in Review


The U.S. is considering annual approvals for Samsung and SK hynix to export chipmaking tools and materials to their factories in China, replacing perpetual waivers granted under the validated end user system, reports Bloomberg. The proposal, presented by the U.S. Commerce Department to South Korean officials, would require the companies to reapply each year for specific quantities of restricted... » read more

Chip Industry Week in Review


Apple plans to increase its U.S. investment by an additional $100 billion over four years, which includes the launch of an advanced manufacturing supply chain program, spurring a number of related chip industry announcements, including: Apple will invest in Amkor's new packaging and test facility in Arizona as its first and largest customer, and Amkor will package and test Apple silicon pr... » read more

Chip Industry Technical Paper Roundup: August 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=460 /] Find more semiconductor research papers here. » read more

Overview Of The End-to-End Autonomous Driving through V2X Challenge (Tsinghua, HK Univ., Stanford, TU Munich et al.)


A new technical paper titled "Research Challenges and Progress in the End-to-End V2X Cooperative Autonomous Driving Competition" was published by researchers at Tsinghua University, Hong Kong University, Stanford University, TU Munich, Imperial College of London et al. Abstract "With the rapid advancement of autonomous driving technology, vehicle-to-everything (V2X) communication has emerge... » read more

Chip Industry Technical Paper Roundup: July 29


New technical papers recently added to Semiconductor Engineering’s library: [table id=458 /] Find more semiconductor research papers here. » read more

Computer Architecture Extending The Von Neumann Model With A Dedicated Reasoning Unit For Native Artificial General Intelligence (TU Munich, Pace U.)


A new technical paper titled "Augmenting Von Neumann's Architecture for an Intelligent Future" was published by researchers at TU Munich and Pace University. Abstract "This work presents a novel computer architecture that extends the Von Neumann model with a dedicated Reasoning Unit (RU) to enable native artificial general intelligence capabilities. The RU functions as a specialized co-proc... » read more

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