Surface-Activated ALD For Room-Temperature Bonding of Al2O3


A new technical paper titled “Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition” was published by researchers at Kyushu University.


“In this study, room-temperature wafer bonding of Al2O3 thin films on Si thermal oxide wafers, which were deposited using atomic layer deposition (ALD), was realized using the surface-activated bonding (SAB) method. Transmission electron microscopy (TEM) observations indicated that these room-temperature-bonded Al2O3 thin films appeared to work well as nanoadhesives that formed strong bond between thermally oxidized Si films. The perfect dicing of the bonded wafer into dimensions of 0.5 mm × 0.5 mm was successful, and the surface energy, which is indicative of the bond strength, was estimated to be approximately 1.5 J/m2. These results indicate that strong bonds can be formed, which may be sufficient for device applications. In addition, the applicability of different Al2O3 microstructures in the SAB method was investigated, and the effectiveness of applying ALD Al2O3 was experimentally verified. This successful SAB of Al2O3 thin films, which is a promising insulator material, opens the possibility of future room-temperature heterogenous integration and wafer-level packaging.”

Find the technical paper here. Published March 2023.  Additional information can be found here.

Takakura, R., Murakami, S., Watanabe, K. et al. Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition. Sci Rep 13, 3581 (2023). https://doi.org/10.1038/s41598-023-30376-7.

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