The Chemistry Of Semiconductors


At each new process node, the chemistry of chip manufacturing has become much more complex than at previous nodes. But at 5nm and below, it's going to get orders of magnitude more complex. For the first few decades, the chemistry of chips was largely shielded from view for most of the industry. Caustic gases were relatively well understood because they are a potential health hazard, but the ... » read more

Thin Film Characterization For Advanced Patterning


Authors: Zhimin Zhu; Xianggui Ye; Sean Simmons; Catherine Frank; Tim Limmer; James Lamb Brewer Science, Inc. (United States) A variable-angle spectroscopic ellipsometer (VASE) is an essential tool for measuring the thickness of a thin film, as well as its n and k optical parameters. However, for films thinner than 10 nm, precise measurement is very challenging. In this paper, the root cause... » read more

Planarization Challenges At 7nm And Beyond


Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU     _________________________________ See more tech talk videos here   » read more

Power/Performance Bits: Aug. 7


Optical neural network Researchers at the National Institute of Standards and Technology (NIST) have made a silicon chip that distributes optical signals precisely across a miniature brain-like grid, showcasing a potential new design for neural networks. Using light would eliminate interference due to electrical charge and the signals would travel faster and farther, said the researchers. "... » read more

Power/Performance Bits: April 24


Waste heat to power Engineers at the University of California, Berkeley, developed a thin-film system that can be applied to electronics to turn waste heat into energy. The thin-film system uses pyroelectric energy conversion, which is well suited for tapping into waste-heat energy supplies below 100 degrees Celsius, called low-quality waste heat. In particular, the technology might be part... » read more

Power/Performance Bits: Jan. 30


Wavy display architecture Researchers at KAUST developed a new transistor architecture for flexible ultrahigh resolution devices aimed at boosting the performance of the display circuitry. Flat-panel displays use thin-film transistors, acting as switches, to control the electric current that activates individual pixels consisting of LEDs or liquid crystals. A higher field-effect mobility of... » read more

The Next 5 Years Of Chip Technology


Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of [getentity id="22820" comment="Lam Research"]; Mark Dougherty, vice president of advanced module engineering at [getentity id="22819" comment="GlobalFoundries"]; David Shortt, technical fellow at [getentity id="22876" co... » read more

Power/Performance Bits: Nov. 21


Greener greenhouses Researchers at the University of California, Santa Cruz are testing greenhouses capable of generating some of their own energy, without hampering plant growth. Greenhouses use electricity to control temperature and power fans, lights, and other monitoring systems. Electricity-generating solar greenhouses utilize Wavelength-Selective Photovoltaic Systems (WSPVs), a novel ... » read more

Integrated Passives Market Gets Active


Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

Intel Inside The Package


Mark Bohr, senior fellow and director of process architecture and integration at Intel, sat down with Semiconductor Engineering to discuss the growing importance of multi-chip integration in a package, the growing emphasis on heterogeneity, and what to expect at 7nm and 5nm. What follows are excerpts of that interview. SE: There’s a move toward more heterogeneity in designs. Intel clearly ... » read more

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