Building An MRAM Array


MRAM is gaining traction in a variety of designs as a middle-level type of memory, but there are reasons why it took so long to bring this memory to market. A typical magnetoresistive RAM architecture is based on CoFeB magnetic layers, with an MgO tunneling barrier. The reference layer should have zero net magnetization to make sure that it doesn’t influence the orientation of the free lay... » read more

Node Within A Node


Enough margin exists in manufacturing processes to carve out the equivalent of a full node of scaling, but shrinking that margin will require a collective push across the entire semiconductor manufacturing supply chain. Margin is built into manufacturing at various stages to ensure that chips are manufacturable and yield sufficiently. It can include everything from variation in how lines are... » read more

Controlling Variability And Cost At 3nm And Beyond


Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the migration to new process nodes, and advancements in ALE and materials that could have a big impact on controlling costs. What follows are excerpts of that conversation. SE: As more sensors are added int... » read more

ALD Tungsten Solves Capacity Challenges in 3D NAND Device Manufacturing


Our increasingly connected and ever “smarter” world generates increasing amounts of data, putting pressure on manufacturers who face new technical challenges in delivering the increasing capacity required for processing and storage. The ALD Tungsten process is helping 3D NAND manufacturers overcome the technical challenges of producing memory chips with higher storage capacity. 3D NAND a... » read more

Manufacturing Bits: March 26


ALD materials database Atomic Limits, a blog site that addresses atomic-level processing technologies, has developed an online database listing all atomic layer deposition (ALD) materials and processes. The database could be useful for ALD processes in semiconductors and other fields. ALD is a deposition technique that deposits materials one layer at a time. In ALD systems, wafers are place... » read more

Manufacturing Bits: March 5


WAAM process Thales Alenia Space, Cranfield University and Glenalmond Technologies have produced a prototype of a titanium pressure vessel for use in future space missions. The vessel is 1 meter in height and weighs 8.5kg. The titanium alloy is made using Cranfield’s additive technology, dubbed the Wire + Arc Additive Manufacturing (WAAM) process. Related to 3D printing technology, WA... » read more

Blog Review: Jan. 30


Cadence's Paul McLellan provides a primer on embedded memory types, their tradeoffs, and the emerging technologies to keep an eye on. Mentor's Matthew Ballance takes a look at how Portable Stimulus can help create better virtual sequences. Synopsys' Taylor Armerding takes a look at what the next year holds for open source, from changes in license terms to the impact of GDPR and a broader ... » read more

Vapor-Deposited Octadecanethiol Masking Layer on Copper for Selective Hf3N4 ALD


Full title: Vapor-deposited octadecanethiol masking layer on copper to enable area selective Hf3N4 atomic layer deposition on dielectrics studied by in situ spectroscopic ellipsometry Journal of Vacuum Science & Technology A 36, 031605 (2018); Authors: Laurent Lecordiera, Veeco Instruments Sebastiaan Herregods and Silvia Armini, IMEC Area-selective atomic layer deposition (AS-ALD) h... » read more

New Patterning Options Emerging


Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are developing self-aligned technologies based on a variety of new approaches. The latest approach involves self-aligned patterning techniques with multi-color material schemes, which are designed for us... » read more

How Atomic Layer Deposition Works


Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition (ALD) is a reality. In fact, it’s being used in an ever-increasing number of applications as an extremely precise and controllable process for creating thin films. Together with its etch counterpart – atomic layer etching (ALE) – ALD is enabling the us... » read more

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