Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

8-In-1 Reconfigurable Logic Gate (TU Dresden)


A technical paper titled “The RGATE: an 8-in-1 Polymorphic Logic Gate Built from Reconfigurable Field Effect Transistors” was published by researchers at TU Dresden and NaMLab. Abstract: "We present the hardware implementation of a reconfigurable universal logic gate, that we call RGATE, able to deliver up to eight different logic functionalities and based on a symmetric four-transistors... » read more

Rapid Prototyping For Emerging Semiconductor Devices


A technical paper titled “Generating Predictive Models for Emerging Semiconductor Devices” was published by researchers at TU Darmstadt and NaMLab. Abstract: "Circuit design requires fast and scalable models which are compatible to modern electronic design automation tools. For this task typically analytical compact models are preferred. However, for emerging device concepts with altered ... » read more

Chip Industry’s Technical Paper Roundup: Apr. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=90 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Characteristics of Three-Gated Reconfigurable FETs


A new technical paper titled "Insights into the Temperature Dependent Switching Behaviour of Three-Gated Reconfigurable Field Effect Transistors" was published by researchers at NaMLAB and TU Dresden. "In this work, it is possible to assess the performances of Three-Gated Reconfigurable Field Effect Transistors within a considerable temperature span and finally provide significant insights o... » read more

Possible Uses Narrow For Negative Capacitance FETs


The discovery of a ferroelectric phase in hafnium dioxide (HfO2) has sparked significant interest in opportunities for integration of ferroelectric transistors and memories with conventional CMOS devices. Demonstrations of “negative capacitance” behavior in particular suggest these devices might evade the 60 mV/decade limit on subthreshold swing, thereby improving transistor efficiency. ... » read more

Memory Startups To Watch


The next-generation memories are finally ramping up after years’ of delays and promises. Intel, for one, is shipping 3D XPoint, a next-generation technology based on phase-change memory. In addition, the big foundries are readying embedded MRAM. And, of course, there are a number of other players in the next-generation memory arena. There are also a number of startups that are flying un... » read more

A New Memory Contender?


Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

Manufacturing Bits: Aug. 8


Ferroelectric films Ferroelectric RAM (FRAM) is creating a buzz again. For years, FRAMs have been shipping for embedded applications, although the technology has taken a backseat to MRAM, phase-change and ReRAM. Using a ferroelectric capacitor to store data, FRAM is a nonvolatile memory with unlimited endurance. FRAM is faster than EEPROM and flash. FRAM performs an over-write function in ... » read more

What Are FeFETs?


The memory market is going in several different directions at once. On one front, the traditional memory types, such DRAM and flash, remain the workhorse technologies in systems despite undergoing some changes in the business. Then, several vendors are readying the next-generation memory types in the market. As part of an ongoing series, Semiconductor Engineering will explore where the new a... » read more

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