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Chip Industry’s Technical Paper Roundup: Nov. 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

3-to-1 Reconfigurable Analog Signal Modulation Circuit On A Single Device


A new technical paper titled "Three-to-one analog signal modulation with a single back-bias-controlled reconfigurable transistor" was published by researchers at NaMLab gGmbH, GlobalFoundries, and TU Dresden. "Reconfigurable field effect transistors are an emerging class of electronic devices, which exploit a structure with multiple independent gates to selectively adjust the charge carrier ... » read more

Technical Paper Round-Up: July 5


New technical papers added to Semiconductor Engineering’s library this week. [table id=36 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

TU Dresden: Tile-based Multi-Core Architecture for Heterogeneous RISC-V Processors Suitable for FPGA Platforms


New technical paper titled "AGILER: An Adaptive Heterogeneous Tile-Based Many-Core Architecture for RISC-V Processors" from researchers at Technische Universitaet Dresden (TU Dresden). Partial Abstract: "In this work, AGILER is proposed as an adaptive tile-base many-core architecture for heterogeneous RISC-V based processors. The proposed architecture consists of modular and adaptable heter... » read more

Technical Paper Round-up: June 14


New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Cu/SiO₂ Hybrid Bond Interconnects


Technical paper titled "Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests" from researchers at TU Dresden and others. Abstract: "The focus of this study is a detailed characterization of hybrid Cu/SiO 2 wafer-to-wafer bonding interconnects after reliability testing. Hybrid bonding (or direct bond interconnect) is a technology of choice for fine pitch... » read more

Technical Paper Round-Up: June 8


  New technical papers added to Semiconductor Engineering’s library this week. [table id=32 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Hybrid Sensing Platform w/Silicon Nanowires on a Fully Functional CMOS Chip Containing the Readout Electronics & Signal amplification


New technical paper titled "Multisite Dopamine Sensing With Femtomolar Resolution Using a CMOS Enabled Aptasensor Chip" from TU Dresden, Riken Quantitative Biological Center, Imperial College London, NaMLab gGmbH, ETH Zürich, MaxWell Biosystems AG, TU Wien, and Institute of Radiopharmaceutical Cancer Research. Abstract "Many biomarkers including neurotransmitters are found in external bo... » read more

Improved graphene-base heterojunction transistor with different collector semiconductors for high-frequency applications


New research paper from TU Dresden & others. Abstract "A new kind of transistor device with a graphene monolayer embedded between two n-typesilicon layers is fabricated and characterized. The device is called graphene-base heterojunction transistor (GBHT). The base-voltage controls the current of the device flowing from the emitter via graphene to the collector. The transit time for e... » read more

Highly efficient modulation doping: A path toward superior organic thermoelectric devices


New academic paper from TU Dresden. Abstract "We investigate the charge and thermoelectric transport in modulation-doped large-area rubrene thin-film crystals with different crystal phases. We show that modulation doping allows achieving superior doping efficiencies even for high doping densities, when conventional bulk doping runs into the reserve regime. Modulation-doped orthorhombic rubr... » read more

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