Chip Industry Technical Paper Roundup: June 10


New technical papers added to Semiconductor Engineering’s library this week. [table id=232 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Using Formal Verification To Evaluate The HW Reliability Of A RISC-V Ibex Core In The Presence Of Soft Errors


A technical paper titled “Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core” was published by researchers at University of Southampton. Abstract: "Reliability has been a major concern in embedded systems. Higher transistor density and lower voltage supply increase the vulnerability of embedded systems to soft errors. A Single Event Upset (SEU), which is also calle... » read more

Chip Industry’s Technical Paper Roundup: Dec 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=171 /] More ReadingTechnical Paper Library home » read more

Front-end patterning and epitaxy approach on Si photonics 220nm SOI substrates


A new technical paper titled "Lateral Tunnel Epitaxy of GaAs in Lithographically Defined Cavities on 220 nm Silicon-on-Insulator" was published by researchers at Cardiff University and University of Southampton. Abstract "Current heterogeneous Si photonics usually bond III–V wafers/dies on a silicon-on-insulator (SOI) substrate in a back-end process, whereas monolithic integration by di... » read more

Week In Review: Design, Low Power


Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

Week In Review: Auto, Security, Pervasive Computing


The European Parliament took a major step toward enacting the world’s first laws around the use of AI. Known as the AI Act, the draft law won a majority vote following two years of debate. If the proposed regulations pass the next hurdles, AI systems posing an unacceptable risk to human safety would be banned — along with “intrusive and discriminatory” uses of AI, including biometric su... » read more

Chip Industry’s Technical Paper Roundup: Apr. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=90 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Large Area Process For Atomically Thin 2D Semiconductor, Using Scalable ALD


A new technical paper titled "Large-area synthesis of high electrical performance MoS2  by a commercially scalable atomic layer deposition process" by researchers at the University of Southampton, LMU Munich, and VTT Technical Research Centre of Finland. Abstract: "This work demonstrates a large area process for atomically thin 2D semiconductors to unlock the technological upscale required... » read more

Research Bits: Dec. 13


Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

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