Spiking Neural Networks: Research Projects or Commercial Products?


Spiking neural networks (SNNs) often are touted as a way to get close to the power efficiency of the brain, but there is widespread confusion about what exactly that means. In fact, there is disagreement about how the brain actually works. Some SNN implementations are less brain-like than others. Depending on whom you talk to, SNNs are either a long way away or close to commercialization. Th... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Imagination Technologies and BAIC Capital have formed an automotive joint venture to create a new automotive fabless semiconductor company focused on China as a client. The JV will be headquartered in the Zhongguancun Integrated Circuit Design Park in Beijing, China, with Bravo Lee serving as CEO. The JV will license IP and software from Imagination to create automotive-grade SoCs. ... » read more

Power/Performance Bits: May 5


CMOS-compatible laser Researchers at Forschungszentrum Jülich, Center for Nanoscience and Nanotechnology (C2N), STMicroelectronics, and CEA-Leti Grenoble developed a CMOS-compatible laser for optical data transfer. Comprised of germanium and tin, the efficiency is comparable with conventional GaAs semiconductor lasers on Si. Optical communications provide much higher data rates, and are be... » read more

Scaling Up Compute-In-Memory Accelerators


Researchers are zeroing in on new architectures to boost performance by limiting the movement of data in a device, but this is proving to be much harder than it appears. The argument for memory-based computation is familiar by now. Many important computational workloads involve repetitive operations on large datasets. Moving data from memory to the processing unit and back — the so-called ... » read more

Week In Review: Design, Low Power


Tools & IP Synopsys revealed DSO.ai (Design Space Optimization AI), an autonomous AI application that searches for optimization targets in very large solution spaces of chip design, inspired by the process of DeepMind's game-playing AlphaZero. DSO.ai engines ingest large data streams generated by chip design tools and use them to explore search spaces, observing how a design evolves over t... » read more

Manufacturing Bits: Jan. 7


Beyond 5G chips At the recent IEEE International Electron Devices Meeting (IEDM), NTT and the Tokyo Institute of Technology presented a paper on a technology that could enable high-speed wireless devices beyond the 5G standard. Researchers have devised a 300GHz wireless transceiver (TRx) that supports a data rate of more than 100Gb/s. The device is based on a technology called indium phosph... » read more

Manufacturing Bits: Dec. 16


Imec-Leti alliance At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Leti announced plans to collaborate in select areas. The two R&D organizations plan to collaborate in two areas—artificial intelligence (AI) and quantum computing. Imec and Leti have been separately working on AI technologies based on various next-generation memory architectures. Both entitie... » read more

Week In Review: Manufacturing, Test


Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best efforts, we have not yet resolved this challenge,” according to a statement from Michelle Johnston Holthaus, executive vice president and general manager of the Sales, Marketing and Communicati... » read more

Blog Review: May 8


Synopsys' Taylor Armerding warns that the threat of cyber war on the financial system is a real possibility and points to four major vulnerability concerns. Cadence's Meera Collier takes a look at bees and technology, from smart hives to sensors that can be carried on the insects' backs. Mentor's Brent Klingforth argues that electrical and mechanic designers need to seamlessly share infor... » read more

Power/Performance Bits: Feb. 26


Integrated RRAM for edge AI Researchers at CEA-Leti and Stanford University have developed the first circuit integrating multiple-bit non-volatile Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. The proof-of-concept chip monolithically integrates two heterogeneous technologies: 18KB of on-chip... » read more

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