Chip Industry Technical Paper Roundup: Mar. 31


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DiscoRD: An Experimental Methodology for Quickly Discovering the Reliable Read Disturbance Threshold of Real DRAM Chips 🔗 ETH Zurich, Rutgers University Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review 🔗 Univ... » read more

In-Depth Analysis of 187 Publications on Hardware Reverse Engineering (Ruhr U., MPI)


A new technical paper, "SoK: From Silicon to Netlist and Beyond Two Decades of Hardware Reverse Engineering Research," was published by the Ruhr University Bochum and the Max Planck Institute for Security and Privacy. Abstract "As hardware serves as the root of trust in modern computing systems, Hardware Reverse Engineering (HRE) is foundational for security assurance. In practice, HRE en... » read more

Chip Industry Technical Paper Roundup: Mar. 3


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance 🔗 KAIST, Panmnesia, Peking University, Hanyang University, Pennsylvania State University Sputtering-driven formation of interstitial oxygen for intrinsic NIR detec... » read more

Three New ALD/MLD Processes for Co-organic Thin Films (Aalto University, RUB et al.)


A new technical paper, "Amido-Amine Co(II) Precursor-Based Atomic/Molecular Layer Deposition Processes for Cobalt-Organic Thin Films and Their Thermal Conversion to CoO Thin Films," was published by researchers at Aalto University, Ruhr University Bochum, Tyndall National Institute, ESRF et al. "Atomic/molecular layer deposition (ALD/MLD) offers a comprehensive process and application portfo... » read more

Chip Industry Technical Paper Roundup: Oct. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=480 /] Find more semiconductor research papers here » read more

A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)


A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, University Bremen, Infineon and WavesenseDD GmbH. Abstract “Dividing a System on Chip (SoC) into multiple smaller chiplets and embedding them into a single package has gained significant t... » read more

Security Technical Paper Roundup: Sept. 30


A number of hardware security-related technical papers were presented at the August 2025 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, rowhammer, and more. Here are some highlights with associated links: [ta... » read more

Chip Industry Technical Paper Roundup: Sept 23


New technical papers recently added to Semiconductor Engineering’s library: [table id=478 /] Find more semiconductor research papers here. » read more

Undervolting Attack That Exploits The Vulnerability Of Chips During Brownout Conditions (Worcester Polytechnic, RUB)


A new technical paper titled "Chypnosis: Stealthy Secret Extraction using Undervolting-based Static Side-channel Attacks" was published by researcher at Worcester Polytechnic Institute and Ruhr University Bochum. Abstract: "Static side-channel analysis attacks, which rely on a stopped clock to extract sensitive information, pose a growing threat to embedded systems' security. To protect a... » read more

Chip Industry Technical Paper Roundup: Feb. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

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