Chip Industry Technical Paper Roundup: June 8


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective 🔗 imec, KU Leuven ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs 🔗 KAIST Thermal- and Aging-Aware Rowhamme... » read more

Chip Industry Week In Review


ECTC Panel-level packaging, hybrid bonding, new substrates, and fine-pitch interconnects topped the list of advanced packaging technologies at ECTC this week. Among the announcements: ASE launched an automated 310mm × 310mm panel-level packaging production line. Expected to enter production in the first half of 2027, the line is compatible with FOCoS and FOCoS-Bridge pa... » read more

Chip Industry Week in Review


Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Chip Industry Week In Review


Deals Marvell acquired Polariton Technologies, a Swiss developer of plasmonics-based silicon photonics devices. Onto Innovation is partnering with Rigaku, combining Onto’s analysis software with Rigaku’s CD-SAXS platform for advanced semiconductor process control. Onto also agreed to acquire a 27% stake in Rigaku for about $710M. Tesla plans to use Intel’s 14A process for its T... » read more

Chip Industry Technical Paper Roundup: Apr. 21


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Neural Computers 🔗 Meta AI, KAUST Characterizing tip-sample interaction dynamics on EUV nanostructures using AFM with a high-aspect ratio tip 🔗 Purdue University, Intel, Bruker  Photonic chip packaging for extreme environments ὑ... » read more

PDN Challenges In DRAM-Based Compute-In-Memory Systems (UT Austin)


A new technical paper, "A comparative study on power delivery aspects of compute-in/near-memory approaches using DRAM," was published by researchers at UT Austin. Abstract "Compute-in-memory (PIM) mitigates the memory wall by performing computation within memory, reducing data movement and improving energy efficiency. DRAM-based PIM is particularly attractive due to its high density, matu... » read more

Chip Industry Technical Paper Roundup: Mar. 31


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DiscoRD: An Experimental Methodology for Quickly Discovering the Reliable Read Disturbance Threshold of Real DRAM Chips 🔗 ETH Zurich, Rutgers University Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review 🔗 Univ... » read more

Chip Industry Week In Review


Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

Chip Industry Week In Review


Deals: NVIDIA inked a $20B non-exclusive licensing deal with Groq for its inference technology. The startup's founder, Jonathan Ross, and some other employees will join NVIDIA to assist in scaling and advancing the technology. The non-exclusive licensing deal, versus an outright purchase, is a tool other companies have used to avoid antitrust regulation. Samsung Ventures made a strategic inv... » read more

Chip Industry Week in Review


Government funding/defunding NIST is terminating funding for the SMART USA Institute, a CHIPS Act research center focused on digital twins, prompting congressional concern that the decision disrupts active awards and weakens U.S. semiconductor R&D commitments. Korea Zinc was awarded $210M in CHIPS Act funding towards a new $6.6B Tennessee advanced smelter and minerals processing facility,... » read more

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