tag: UT Austin

Chip Industry Week In Review
By The SE Staff - 18 Oct, 2024 - Comments: 0

Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Chip Industry Technical Paper Roundup: Oct. 8
By Linda Christensen - 08 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=365 /] More ReadingTechnical Paper Library home » read more

Multi-Node, Virtualized Neuromorphic Architecture
By Technical Paper Link - 06 Oct, 2024 - Comments: 0

A new technical paper titled "NeuroVM: Dynamic Neuromorphic Hardware Virtualization" was published by researchers at Stanford University, UT Austin and Temsa Research & Development Center. Abstract "This paper introduces a novel approach in neuromorphic computing, integrating heterogeneous hardware nodes into a unified, massively parallel architecture. Our system transcends traditional ... » read more

Gold Substrate Plays Boosts Performance of Tellurium-Based Memristors
By Technical Paper Link - 06 Oct, 2024 - Comments: 0

A new technical paper titled "Non-Volatile Resistive Switching in Nanoscaled Elemental Tellurium by Vapor Transport Deposition on Gold" was published by researchers at Politecnico di Milano, UT Austin, and STMicroelectronics. Abstract: "Two-dimensional (2D) materials are promising for resistive switching in neuromorphic and in-memory computing, as their atomic thickness substantially impr... » read more

Chip Industry Week in Review
By The SE Staff - 30 Aug, 2024 - Comments: 1

The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Chip Industry Week In Review
By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Chip Industry Week In Review
By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

Chip Industry Technical Paper Roundup: May 13
By Linda Christensen - 13 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=225 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 22 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys  acquired Intrinsic ID, which develops physical unclonable func... » read more

Chip Industry Week In Review
By The SE Staff - 15 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

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